HMC525ALC4 Data Sheet
Rev. A | Page 4 of 28
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
RF Input Power 20 dBm
IF Input Power 20 dBm
IF Source and Sink Current 2 mA
Reflow Temperature 260°C
Maximum Junction Temperature (T
J
) 175°C
Lifetime at Maximum (T
J
) >1 × 10
6
hours
Moisture Sensitivity Level (MSL)
1
3
Continuous Power Dissipation, P
DISS
(T
A
=
85°C, Derate 6.22 mW/°C Above 85°C)
2
560 mW
Operating Temperature Range −40°C to +85°C
Storage Temperature Range −65°C to +150°C
Lead Temperature Range −65°C to +150°C
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM) 250 V
Field Induced Charged Device Model
(FICDM)
500 V
1
Based on IPC/JEDEC J-STD-20 MSL Classifications.
2
P
DISS
is a theoretical number calculated by (T
J
− 85°C)/θ
JC
.
Stresses at or above those listed under Absolute Maximum Ratings
may cause permanent damage to the product. This is a stress
rating only; functional operation of the product at these or any
other conditions above those indicated in the operational section of
this specification is not implied. Operation beyond the maximum
operating conditions for extended periods may affect product
reliability.
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θ
JA
is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θ
JC
is
the junction to case thermal resistance.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
E-24-1
1
120 161 °C/W
1
See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (PCB with 3 × 3 vias).
ESD CAUTION
