Data Sheet HMC525ALC4
Rev. A | Page 25 of 28
THEORY OF OPERATION
The HMC525ALC4 is a compact GaAs, MMIC, I/Q mixer in a
24-terminal, RoHS compliant, ceramic LCC package. The
device can be used as either an image reject mixer or a SSB
upconverter. The mixer uses two standard double balanced
mixer cells and a 90° hybrid fabricated in a GaAs, MESFET
process. This device is a much smaller alternative to a hybrid
style image reject mixer and a SSB upconverter assembly. The
HMC525ALC4 eliminates the need for wire bonding, allowing
the use of the surface-mount manufacturing techniques.
HMC525ALC4 Data Sheet
Rev. A | Page 26 of 28
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
Figure 101 shows the typical application circuit for the
HMC525ALC4. To select the appropriate sideband, an external
90° degree hybrid is needed. For applications not requiring
operation to dc, use an off-chip dc blocking capacitor. For
applications that require suppression of the LO signal at the
output, use a bias tee or RF feed as shown in Figure 101. Ensure
that the source or sink current used for LO suppression is
<2 mA for each IF port to prevent damage to the device. The
common-mode voltage for each IF port is 0 V.
To select the upper sideband when using as an upconverter,
connect the IF1 pin to the 90° port of the hybrid, and connect
the IF2 pin to the 0° port of the hybrid. To select the lower
sideband, connect IF1 to the 0° port of the hybrid and IF2 to the
90° port of the hybrid. The input is from the sum port of the
hybrid and the difference port is 50 Ω terminated.
To select the upper sideband (low-side LO) when using as
downconverter, connect the IF1 pin to the 0° port of the hybrid,
and connect the IF2 pin to the 90° port of the hybrid. To select
the lower sideband (high-side LO), connect the IF1 pin to the
90° port of the hybrid and IF2 to the 0° port of the hybrid. The
output is from the sum port of the hybrid, and the difference
port is 50 Ω terminated.
13
1
3
4
2
7
5
6
14
15
16
17
18
90°
HYBRID
RF LO
8
9
10
11
12
19
GND
IF1 IF2
20
21
22
23
24
PACKAGE
BASE
16401-109
50Ω IF
SUPPLY
FOR IF1
SUPPLY
FOR IF2
BIAS TEE/
DC FEED FOR IF2
BIAS TEE/
DC FEED FOR IF1
DC BLOCKING
CAPACITORS
EXTERNAL
90° HYBRID
NOTES
1. DASHED SECTIONS ARE OPTIONAL AND MEANT FOR LO NULLING.
Figure 101. Typical Application Circuit
EVALUATION PCB INFORMATION
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 103). Use a sufficient
number of via holes to connect the top and bottom ground planes.
The evaluation circuit board shown in Figure 103 is available
from Analog Devices, Inc., upon request.
Table 7. Materials for Evaluation PCB EV1HMC525ALC4
Item Description
PCB
1
PCB, 109996-1
J1, J2 2.92 mm SubMiniature Version A (SMA) connectors, SRI
connector gage
J3, J4 Gold plated SMA, edge mount with 0.02 inch pin
connectors, Johnson SMA connectors
U1 Device under test, HMC525ALC4
1
109996-1 is the raw bare PCB identifier. Reference EV1HMC525ALC4 when
ordering complete evaluation PCB.
Data Sheet HMC525ALC4
Rev. A | Page 27 of 28
SOLDERING INFORMATION AND RECOMMENDED
LAND PATTERN
Figure 102 shows the recommended land pattern for the
HMC525ALC4. The HMC525ALC4 is contained in a 4 mm ×
4 mm, 24-terminal, ceramic LCC package, with an exposed
ground pad (EPAD). This pad is internally connected to the
ground of the chip. To minimize thermal impedance and ensure
electrical performance, solder the pad to the low impedance
ground plane on the PCB. It is recommended that the ground
planes on all layers under the pad be stitched together with vias,
to further reduce thermal impedance. The land pattern on the
EV1HMC525ALC4 evaluation board provides a simulated
thermal resistance (θ
JC
) of 161° C / W.
.010" REF
.030"
MASK OPENING
.098" SQUARE MASK OPENING
.020 × 45" CHAMFER FOR PIN 1
.106" SQUARE
GROUND PAD
.116"
MASK
OPENING
PIN 1
.0197"
[0.50]
.034"
TYPICAL
VIA
SPACING
PAD SIZE
.026" × .010"
ᶲ .010"
TYPICAL VIA
GROUND PAD
SOLDERMASK
.004" MASK/METAL OVERLAP
.178" SQUARE
.010" MIN MASK WIDTH
16401-111
Figure 102. Evaluation Board Land Pattern for the HMC525ALC4 Package
116401-110
Figure 103. Evaluation PCB Top Layer

HMC525ALC4

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
RF Mixer Mixers
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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