17
Handling and Storage
ESD (Electrostatic Discharge)
Electrostatic discharge occurs
naturally in the environment.
With the increase in voltage
potential, the outlet of neutraliza-
tion or discharge will be sought.
If the acquired discharge route is
through a semiconductor device,
destructive damage will result.
ESD countermeasure methods
should be developed and used to
control potential ESD damage
during handling in a factory
environment at each manufactur-
ing site.
MSL (Moisture Sensitivity Level)
Plastic encapsulated surface
mount package is sensitive to
damage induced by absorbed
moisture and temperature.
Agilent Technologies follows
JEDEC Standard J-STD 020B.
Each component and package
type is classified for moisture
sensitivity by soaking a known
dry package at various tempera-
tures and relative humidity, and
times. After soak, the compo-
nents are subjected to three
consecutive simulated reflows.
The out of bag exposure time
maximum limits are determined
by the classification test
described below which corre-
sponds to a MSL classification
level 6 to 1 according to the
JEDEC standard IPC/JEDEC
J-STD-020B and J-STD-033.
WS2512 is MSL3. Thus, according
to the J-STD-033 p.11 the maxi-
mum Manufacturers Exposure
Time (MET) for this part is
168 hours. After this time period,
the part would need to be
removed from the reel, de-taped
and then re-baked.
MSL classification reflow
temperature for the WS2512 is
targeted at 250°C +0/-5°C. Figure
32 and Table 9 show typical SMT
profile for maximum tempera-
ture of 250+0/-5°C.
Table 8. Moisture Classification Level and Floor Life
MSL Level Floor Life (out of bag) at factory ambient ≤ 30°C/60% RH or as stated
1 Unlimited at ≤ 30
o
C/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6 Mandatory bake before use. After bake, must be reflowed within the time limit specified on the label
Note:
1. The MSL Level is marked on the MSL Label on each shipping bag.
Table 7. ESD Classification
Pin# Name Description HBM CDM Classification
1 Vcc1 Supply Voltage ± 2000V ± 200V Class 2
2 RF In RF Input ± 2000V ± 200V Class 2
3 GND Ground ± 2000V ± 200V Class 2
4 Vcont Control Voltage ± 2000V ± 200V Class 2
5 Vref Reference Voltage ± 2000V ± 200V Class 2
6 GND Ground ± 2000V ± 200V Class 2
7 GND Ground ± 2000V ± 200V Class 2
8 RFOut RF Output ± 2000V ± 200V Class 2
9 GND Ground ± 2000V ± 200V Class 2
10 Vcc2 Supply Voltage ± 2000V ± 200V Class 2
Note:
1. Module products should be considered extremely ESD sensitive.
