OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

AT45DB011B-XU

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32
28
AT45DB011B
1984J–DFLASH–06/06
Note: 1. These packages are not recommended for new designs.
Notes: 1. This package is not recommended for new designs.
2. Green Packages cover lead-free requirements.
Ordering Information
f
SCK
(MHz)
I
CC
(mA)
Ordering Code Package Operation RangeActive Standby
20 10 0.01
AT45DB011B-CC
(1)
AT45DB011B-SC
AT45DB011B-XC
(1)
9C1
8S2
14X
Commercial
(0°C to 70°C)
20 10 0.01
AT45DB011B-CI
(1)
AT45DB011B-SI
AT45DB011B-XI
(1)
9C1
8S2
14X
Industrial
(-40°C to 85°C)
Green Package Options (Pb/Halide-free/RoHS Compliant)
f
SCK
(MHz)
I
CC
(mA)
Ordering Code Package Operation RangeActive Standby
20 10 0.01
AT45DB011B-SU
AT45DB011B-XU
(1)
8S2
14X
Industrial
(-40°C to 85°C)
Package Type
9C1 9-ball (3 x 3 Array), 1.0 mm Pitch, 5 x 5 mm Plastic Chip-scale Ball Grid Array Package (CBGA)
8S2 8-lead, 0.210" Wide, Plastic Gull Wing Small Outline (EIAJ SOIC)
14X 14-lead, 0.170" Wide, Plastic Thin Shrink Small Outline Package (TSSOP)
29
AT45DB011B
1984J–DFLASH–06/06
Packaging Information
9C1 – CBGA
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
9C1, 9-ball (3 x 3 Array), 5 x 5 x 1.2 mm Body, 1.0 mm Ball
Pitch Chip-scale Ball Grid Array Package (CBGA)
A
9C1
04/11/01
Dimensions in Millimeters and (Inches).
Controlling dimension: Millimeters.
A
B
C
321
2.0 (0.079)
1.50(0.059) REF
0.40 (0.016)
DIA BALL TYP
2.0 (0.079)
1.20(0.047)MAX
0.25(0.010)MIN
5.10(0.201)
1.00 (0.0394) BSC
NON-ACCUMULATIVE
4.90(0.193)
5.10(0.201)
4.90(0.193)
1.50(0.059) REF
A1 ID
1.00 (0.0394) BSC
NON-ACCUMULATIVE
TOP VIEW
SIDE VIEW
BOTTOM VIEW
30
AT45DB011B
1984J–DFLASH–06/06
8S2 – EIAJ SOIC
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8S2, 8-lead, 0.209" Body, Plastic Small
Outline Package (EIAJ)
4/7/06
8S2D
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
Notes: 1. This drawing is for general information only; refer to EIAJ Drawing EDR-7320 for additional information.
2. Mismatch of the upper and lower dies and resin burrs are not included.
3. It is recommended that upper and lower cavities be equal. If they are different, the larger dimension shall be regarded.
4. Determines the true geometric position.
5. Va
lues b,C apply to plated terminal. The standard thickness of the plating layer shall measure between 0.007 to .021 mm.
A 1.70 2.16
A1 0.05 0.25
b 0.35 0.48 5
C 0.15 0.35 5
D 5.13 5.35
E1 5.18 5.40 2, 3
E 7.70 8.26
L 0.51 0.85
θ 0° 8°
e 1.27 BSC 4
θ
1
N
E
TOP VIEW
TOP VIEW
C
E1
E1
END VIEW
END VIEW
A
b
L
A1
A1
e
D
SIDE VIEW
SIDE VIEW
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P32

AT45DB011B-XU

Mfr. #:
Buy AT45DB011B-XU
Manufacturer:
Microchip Technology / Atmel
Description:
NOR Flash 1M SERIAL 2.7V - IND TEMP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet