Tyco Electronics Corporation
300 Constitutional Drive
Menlo Park, CA 94025 USA
No: C-6111
Rev: G
Date: November 5, 1993
Page: 21 of 35
If this document is printed it becomes uncontrolled. Check for the latest revision.
Test Group 3
Test Sequence
Requirement
Paragraph
Procedure
Paragraph
Visual examination
3.1, 3.4, 3.5,
3.7, 3.8
4.5.2
Magnetic permeability 3.6.24 4.5.26
Ozone exposure 3.6.22 4.5.24
Insulation resistance at room temperature 3.6.1 4.5.3
Dielectric withstanding voltage at sea level 3.6.2 4.5.4.1
Fluid immersion 3.6.23 4.5.25
Dielectric withstanding voltage at sea level 3.6.2 4.5.4.1
Coupling torque 3.6.11 4.5.13
Insert retention 3.6.9 4.5.11
Post test examination 3.6.42 4.5.44
Test Group 4
Test Sequence
Requirement
Paragraph
Procedure
paragraph
Visual examination 3.1, 3.4, 3.5,
3.7, 3.8
4.5.2
Contact engagement and separation forces 3.6.6 4.5.8
Temperature life
Insulation resistance at maximum rated temp.
3.6.17 4.5.19
Humidity
Insulation resistance in high humidity
Dielectric withstanding voltage in high humidity
Insulation resistance after 24 hours
Dielectric withstanding voltage after 24 hours
3.6.18 4.5.20
Low signal level contact resistance 3.6.3.2 4.5.5.3
Contact resistance at specified current 3.6.3.1 4.5.5.1
Contact resistance at specified current and
maximum rated temperature
3.6.3.1 4.5.5.2
Cold handling 3.6.41 4.5.43
Insert retention 3.6.9 4.5.11
Contact engagement and separation forces 3.6.6 4.5.8
Contact retention 3.6.10 4.5.12
Post test examination 3.6.42 4.5.44
Solder termination tensile strength 3.6.8 4.5.10
