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BGA123L4E6327XTSA1
P1-P3
P4-P6
P7-P9
P10-P12
P13-P13
Data
Sheet
10
Revision 2.0 (min/max)
2017-0
9-14
BGA123L4
Small Footprint Ultra Low Current Low Noi
se Amplifier for Gl
obal Navigation
Package Information
5
Package Information
Figure
3 TSLP-4-11
Package
Outline
(top, side and bottom views)
Figure 4
Footprint Recommendation TSLP-4-11
Figure
5 Marking
Layout
(top view)
TSLP-4-11-PO
.vsd
0.25
TSLP-4-11-FP V01
Stencil apertures
Copper
Solder mask
0.4
Optional solder
mask dam
0.4
0.25
0.25
0.4
0.4
TSLP-4-11-MK V01
Type code
Date code (M)
Pin 1 marking
1
Data
Sheet
11
Revision 2.0 (min/max)
2017-0
9-14
BGA123L4
Small Footprint Ultra Low Current Low Noi
se Amplifier for Gl
obal Navigation
Package Information
Figure 6
Tape & Reel Dimensions (ree
l diameter 180 mm,
pieces/reel 15000)
Data
Sheet
12
Revision 2.0 (min/max)
2017-0
9-14
BGA123L4
Small Footprint Ultra Low Current Low Noi
se Amplifier for Gl
obal Navigation
Revision History
Page or Item
Subjects (major changes since previous revision)
Revision 2.0 (min/max), 2017-09-14
1, 3, 4, 6, 7 , 8
Update Electrical Characteristics
13
Update Trademark Information
P1-P3
P4-P6
P7-P9
P10-P12
P13-P13
BGA123L4E6327XTSA1
Mfr. #:
Buy BGA123L4E6327XTSA1
Manufacturer:
Infineon Technologies
Description:
RF Amplifier RF SILICON MMIC
Lifecycle:
New from this manufacturer.
Delivery:
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Products related to this Datasheet
BGA123L4E6327XTSA1