THine Electronics, Inc.
Security E
THCV215-216_Rev.2.70_E
Copyright(C)2016 THine Electronics, Inc.
Note
1)HTPDN/LOCKN connection between high VDD V-by-One
®
HS transmitter and THCV216
When using THCV216 with high VDD V-by-One
®
HS transmitter, user have to take care of HTPDN/LOCKN
connection because THCV216 HTPDN/LOCKN output pins absolute maximum ratings are VDL+0.3V;
therefore high VDD pull-up at transmitter side can cause violation of usage. Users are supposed to connect
those HTPDN/LOCKN line between two devices with appropriate level-shifter configuration.
LOCKN
HTPDN
THCV216
1.8V
10kΩ
MOSFET
(Vth<1.2V)
1.8V
10kΩ
MOSFET
(Vth<1.2V)
3.3V
3.3V
10kΩ
10kΩ
V-by-One
®
HS Transmitter
(Ex. THCV217,THCV233)
1.8V Tolerant
Transistor
V-by-One
®
HS Tx side PCB V-by-One
®
HS Rx side PCB
D S
G
D S
G
2)LVDS input pin connection
When LVDS line is not drove from the previous device, the line is pulled up to 3.3V internally in
THCV215.This can cause violation of absolute maximum ratings to the previous LVDS Tx device whose
operating condition is lower voltage power supply than 3.3V. This phenomenon may happen at power on phase
of the whole system including THCV215. One solution for this problem is PD=L control during no LVDS input
period because pull-up resistors are cut off at power down state.
3)Power On Sequence
Don’t input TCLK#+/- before power supply to THCV215 is on in order to keep absolute maximum ratings.
4)Unused LVDS input pins
First, select appropriate color depth with COL0,COL1 pins. If there are inevitably remained LVDS no input
pins which are originally active, tie them to GND.
Second, avoid the situation that LVDS input pins in use are open. You can use PDN=L control during no
LVDS input period to cut off pulled-up resistors.
5)Cable Connection and Disconnection
Don’t connect and disconnect CML and LVDS cables, when the power is supplied to the system.
6)GND Connection
Connect the each GND of the PCB which Transmitter, Receiver and THCV215 on it. It is better for EMI
reduction to place GND cable as close to LVDS cable as possible.
LAVDH
LVDS input buffer
Internal circuit of THCV215
Low VDD
LVDS Tx
THCV215
or
LVDS Tx
integrated
device
LVDS Tx side PCB
LVDS Rx side PCB
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THine Electronics, Inc.
Security E
THCV215-216_Rev.2.70_E
Copyright(C)2016 THine Electronics, Inc.
7)Multi Drop Connection
Multi drop connection is not recommended.
8)Multiple counterpart use
Multiple counterpart use such as following system is not recommended.
p.15 tTISK spec should be kept.
Asynchronous use such as following system is not recommended.
9)Multiple device connection
HTPDN and LOCKN signals are supposed to be connected proper for their purpose like the following figure.
HTPDN should be from just one Rx to multiple Tx because its purpose is only ignition of all Tx.
LOCKN should be connected so as to indicate that all Rx CDR become ready to receive normal operation data.
LOCKN of Tx side can be simply split to multiple Tx.
There can be other applicable circuits like ‘OR gate of LOCKN’, ‘npn transistor with resistors as inverter’, etc.
Also possible time difference of internal processing time (p.15 THCV215 tTCD and THCV216 tRDC) on
multiple data stream must be accommodated and compensated by the following destination device connected to
multiple THCV216, which may have internal FIFO.
THCV215
HTPDN
LOCKN
THCV215
HTPDN
LOCKN
THCV216
HTPDN
LOCKN
PDN
THCV216
HTPDN
LOCKN
PDN
Source
Device
Destination
Device
Ex. synchronized Time diff. comes up
clkin.1
clkin.2
clkout.1
clkout.2
Internal processing time tTCD
Internal processing time tRDC
FIFO
FIFO
LVDS Rx
LVDS Rx
IC
CLK
DATA
DATA
THCV216
RLCLK0-
RLCLK0+
RLCLK1-
RLCLK1+
LVDS Tx
LVDS Tx
IC
CLK
CLK
DATA
DATA
THCV215
TLCLK0-
TLCLK0+
TLCLK1-
TLCLK1+
LVDS Rx
THCV216
LVDS Rx
RLCLK0,1-
RLCLK0,1+
23/26
THine Electronics, Inc.
Security E
THCV215-216_Rev.2.70_E
Copyright(C)2016 THine Electronics, Inc.
Package
64 Lead Molded Thin Shrink Small Outline Package, JEDEC
Figure 19. 64 pin TSSOP package physical dimension
0. 50 NOM
0.17~0.27
17. 00 ± 0.10
1
0. 25 NOM
0. 60 ± 0.15
1. 00 NOM
0. 10 ± 0.05
0. 90 ± 0.10
1. 20 MAX
Detail of Lead End
Unit:mm
0.10
0°~8°
8.10 ± 0.20
6.10 ± 0.10
64
24/26

THCV215

Mfr. #:
Manufacturer:
CEL
Description:
High-speed Video Data Transmitter and Receive
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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