10
FN6305.6
March 3, 2011
sense resistor), the regular boot refresh circuit will still be
active.
Current Sinking
The ISL6545x incorporates a MOSFET shoot-through
protection method which allows a converter to sink current
as well as source current. Care should be exercised when
designing a converter with the ISL6545x when it is known
that the converter may sink current.
When the converter is sinking current, it is behaving as a
boost converter that is regulating its input voltage. This
means that the converter is boosting current into the V
CC
rail, which supplies the bias voltage to the ISL6545x. If there
is nowhere for this current to go, such as to other distributed
loads on the V
CC
rail, through a voltage limiting protection
device, or other methods, the capacitance on the V
CC
bus
will absorb the current. This situation will allow voltage level
of the V
CC
rail to increase. If the voltage level of the rail is
boosted to a level that exceeds the maximum voltage rating
of the ISL6545x, then the IC will experience an irreversible
failure and the converter will no longer be operational.
Ensuring that there is a path for the current to follow other
than the capacitance on the rail will prevent this failure
mode.
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using
wide, short printed circuit traces. The critical components
should be located as close together as possible, using ground
plane construction or single point grounding.
Figure 7 shows the critical power components of the converter.
To minimize the voltage overshoot, the interconnecting wires
indicated by heavy lines should be part of a ground or power
plane in a printed circuit board. The components shown should
be located as close together as possible. Please note that the
capacitors C
IN
and C
O
may each represent numerous physical
capacitors. For best results, locate the ISL6545x within 1 inch
of the MOSFETs, Q
1
and Q
2
. The circuit traces for the
MOSFET gate and source connections from the ISL6545x
must be sized to handle up to 1A peak current.
Figure 8 shows the circuit traces that require additional
layout consideration. Use single point and ground plane
construction for the circuits shown. Minimize any leakage
current paths on the COMP/SD pin and locate the resistor,
R
OSCET
close to the COMP/SD pin because the internal
current source is only 20µA. Provide local V
CC
decoupling
between V
CC
and GND pins. Locate the capacitor, C
BOOT
as close as practical to the BOOT and PHASE pins. All
components used for feedback compensation (not shown)
should be located as close to the IC as practical.
Feedback Compensation
This section highlights the design consideration for a
voltage-mode controller requiring external compensation. To
address a broad range of applications, a type-3 feedback
network is recommended, as shown in the top part of
Figure 9.
Figure 9 also highlights the voltage-mode control loop for a
synchronous-rectified buck converter, applicable to the
ISL6545x circuit. The output voltage (V
OUT
) is regulated to the
reference voltage, V
REF
. The error amplifier output (COMP pin
voltage) is compared with the oscillator (OSC) modified
sawtooth wave to provide a pulse-width modulated wave with
an amplitude of V
IN
at the PHASE node. The PWM wave is
smoothed by the output filter (L and C). The output filter
capacitor bank’s equivalent series resistance is represented by
the series resistor E.
L
O
C
O
LGATE/OCSET
UGATE
PHASE
Q
1
Q
2
V
IN
V
OUT
RETURN
ISL6545,
C
IN
LOAD
FIGURE 7. PRINTED CIRCUIT BOARD POWER AND
GROUND PLANES OR ISLANDS
ISL6545A
FIGURE 8. PRINTED CIRCUIT BOARD SMALL SIGNAL
LAYOUT GUIDELINES
+V
CC
ISL6545,
LGATE/OCSET
GND
VCC
BOOT
L
O
C
O
V
OUT
LOAD
Q
1
Q
2
PHASE
+V
IN
C
BOOT
C
VCC
R
OCSET
ISL6545A
ISL6545, ISL6545A
11
FN6305.6
March 3, 2011
The modulator transfer function is the small-signal transfer
function of V
OUT
/V
COMP
. This function is dominated by a DC
gain, given by d
MAX
V
IN
/V
OSC
, and shaped by the output
filter, with a double pole break frequency at F
LC
and a zero at
F
CE
. For the purpose of this analysis, L and D represent the
channel inductance and its DCR, while C and E represent the
total output capacitance and its equivalent series resistance.
The compensation network consists of the error amplifier
(internal to the ISL6545x) and the external R1-R3, C1-C3
components. The goal of the compensation network is to
provide a closed loop transfer function with high 0dB crossing
frequency (F
0
; typically 0.1 to 0.3 of F
SW
) and adequate phase
margin (better than 45°). Phase margin is the difference
between the closed loop phase at F
0dB
and 180°. The
equations that follow relate the compensation network’s poles,
zeros and gain to the components (R1, R2, R3, C1, C2, and
C3) in Figure 9. Use the following guidelines for locating the
poles and zeros of the compensation network:
1. Select a value for R1 (1kΩ to 5kΩ, typically). Calculate
value for R2 for desired converter bandwidth (F
0
). If
setting the output voltage via an offset resistor connected
to the FB pin, Ro in Figure 9, the design procedure can
be followed as presented.
2. Calculate C1 such that F
Z1
is placed at a fraction of the F
LC
,
at 0.1 to 0.75 of F
LC
(to adjust, change the 0.5 factor to
desired number). The higher the quality factor of the output
filter and/or the higher the ratio F
CE
/F
LC
, the lower the F
Z1
frequency (to maximize phase boost at F
LC
).
3. Calculate C2 such that F
P1
is placed at F
CE
.
4. Calculate R3 such that F
Z2
is placed at F
LC
. Calculate C3
such that F
P2
is placed below F
SW
(typically, 0.5 to 1.0
times F
SW
). F
SW
represents the switching frequency.
Change the numerical factor to reflect desired placement
of this pole. Placement of F
P2
lower in frequency helps
reduce the gain of the compensation network at high
frequency, in turn reducing the HF ripple component at
the COMP pin and minimizing resultant duty cycle jitter.
It is recommended a mathematical model is used to plot the
loop response. Check the loop gain against the error
amplifier’s open-loop gain. Verify phase margin results and
adjust as necessary. The equations shown in Equations 8
and 9 describe the frequency response of the modulator
(G
MOD
), feedback compensation (G
FB
) and closed-loop
response (G
CL
):
COMPENSATION BREAK FREQUENCY EQUATIONS
FIGURE 9. VOLTAGE-MODE BUCK CONVERTER
COMPENSATION DESIGN
-
+
E/A
VREF
COMP
C1
R2
R1
FB
C2
R3
C3
L
C
V
IN
PWM
CIRCUIT
HALF-BRIDGE
DRIVE
OSCILLATOR
E
EXTERNAL CIRCUIT
ISL6545x
V
OUT
V
OSC
D
UGATE
LGATE
Ro
PHASE
F
LC
1
2π LC
---------------------------
=
F
CE
1
2π CE⋅⋅
------------------------
=
(EQ. 3)
R2
V
OSC
R1 F
0
⋅⋅
d
MAX
V
IN
F
LC
⋅⋅
---------------------------------------------
=
(EQ. 4)
C1
1
2π R2 0.5 F
LC
⋅⋅
------------------------------------------------
=
(EQ. 5)
C2
C1
2π R2 C1 F
CE
1⋅⋅⋅
---------------------------------------------------------
=
(EQ. 6)
R3
R1
F
SW
F
LC
------------
1
----------------------
=
C3
1
2π R3 0.7 F
SW
⋅⋅
-------------------------------------------------
=
(EQ. 7)
G
MOD
f()
d
MAX
V
IN
V
OSC
------------------------------
1sf() EC⋅⋅+
1sf() ED+()C⋅⋅s
2
f() LC⋅⋅++
----------------------------------------------------------------------------------------
=
G
FB
f()
1sf() R2 C1⋅⋅+
sf() R1 C1 C2+()⋅⋅
------------------------------------------------------
=
1sf() R1 R3+()C3⋅⋅+
1sf() R3 C3⋅⋅+()1sf() R2
C1 C2
C1 C2+
----------------------
⎝⎠
⎛⎞
⋅⋅+
⎝⎠
⎛⎞
-----------------------------------------------------------------------------------------------------------------------------
G
CL
f() G
MOD
f() G
FB
f()=
where s f(), 2π fj⋅⋅=
(EQ. 8)
F
Z1
1
2π R2 C1⋅⋅
--------------------------------
=
F
Z2
1
2π R1 R3+()C3⋅⋅
---------------------------------------------------
=
F
P1
1
2π R2
C1 C2
C1 C2+
----------------------
⋅⋅
-----------------------------------------------
=
F
P2
1
2π R3 C3⋅⋅
--------------------------------
=
(EQ. 9)
ISL6545, ISL6545A
12
FN6305.6
March 3, 2011
Figure 10 shows an asymptotic plot of the DC/DC converter’s
gain vs frequency. The actual Modulator Gain has a high gain
peak dependent on the quality factor (Q) of the output filter,
which is not shown. Using the above guidelines should yield a
compensation gain similar to the curve plotted. The open loop
error amplifier gain bounds the compensation gain. Check the
compensation gain at F
P2
against the capabilities of the error
amplifier. The closed loop gain, G
CL
, is constructed on the
log-log graph of Figure 10 by adding the modulator gain, G
MOD
(in dB), to the feedback compensation gain, G
FB
(in dB). This is
equivalent to multiplying the modulator transfer function and the
compensation transfer function and then plotting the resulting
gain.
A stable control loop has a gain crossing with close to a
-20dB/decade slope and a phase margin greater than 45°.
Include worst case component variations when determining
phase margin. The mathematical model presented makes a
number of approximations and is generally not accurate at
frequencies approaching or exceeding half the switching
frequency. When designing compensation networks, select
target crossover frequencies in the range of 10% to 30% of
the switching frequency, F
SW
.
This is just one method to calculate compensation
components; there are variations of Equations 3 through 9.
The error amp is similar to that on other Intersil regulators,
so existing tools can be used here as well. Special
consideration is needed if the size of a ceramic output
capacitance in parallel with bulk capacitors gets too large;
the calculation needs to model them both separately
(attempting to combine two different capacitors types into
one composite component model may not work properly; a
special tool may be needed; contact Intersil at
http://www.intersil.com/contacts/
for assistance.
Component Selection Guidelines
Output Capacitor Selection
An output capacitor is required to filter the output and supply
the load transient current. The filtering requirements are a
function of the switching frequency and the ripple current.
The load transient requirements are a function of the slew
rate (di/dt) and the magnitude of the transient load current.
These requirements are generally met with a mix of
capacitors and careful layout.
Modern components and loads are capable of producing
transient load rates above 1A/ns. High frequency capacitors
initially supply the transient and slow the current load rate
seen by the bulk capacitors. The bulk filter capacitor values
are generally determined by the ESR (Effective Series
Resistance) and voltage rating requirements rather than
actual capacitance requirements.
High frequency decoupling capacitors should be placed as
close to the power pins of the load as physically possible. Be
careful not to add inductance in the circuit board wiring that
could cancel the usefulness of these low inductance
components. Consult with the manufacturer of the load on
specific decoupling requirements.
Use only specialized low-ESR capacitors intended for
switching-regulator applications for the bulk capacitors. The
bulk capacitor’s ESR will determine the output ripple voltage
and the initial voltage drop after a high slew-rate transient. An
aluminum electrolytic capacitor’s ESR value is related to the
case size with lower ESR available in larger case sizes.
However, the Equivalent Series Inductance (ESL) of these
capacitors increases with case size and can reduce the
usefulness of the capacitor to high slew-rate transient loading.
Unfortunately, ESL is not a specified parameter. Work with
your capacitor supplier and measure the capacitor’s
impedance with frequency to select a suitable component. In
most cases, multiple electrolytic capacitors of small case size
perform better than a single large case capacitor.
Output Inductor Selection
The output inductor is selected to meet the output voltage
ripple requirements and minimize the converter’s response
time to the load transient. The inductor value determines the
converter’s ripple current and the ripple voltage is a function
of the ripple current. The ripple voltage and current are
approximated by the equations shown in Equation 10:
Increasing the value of inductance reduces the ripple current
and voltage. However, the large inductance values reduce
the converter’s response time to a load transient.
One of the parameters limiting the converter’s response to
a load transient is the time required to change the inductor
current. Given a sufficiently fast control loop design, the
ISL6545x will provide either 0% or 100% duty cycle in
response to a load transient. The response time is the time
required to slew the inductor current from an initial current
value to the transient current level. During this interval the
difference between the inductor current and the transient
current level must be supplied by the output capacitor.
0
F
P1
F
Z2
OPEN LOOP E/A GAIN
F
Z1
F
P2
F
LC
F
CE
COMPENSATION GAIN
GAIN
FREQUENCY
MODULATOR GAIN
FIGURE 10. ASYMPTOTIC BODE PLOT OF CONVERTER GAIN
CLOSED LOOP GAIN
20
d
MAX
V
IN
V
OSC
---------------------------------log
20
R2
R1
--------
⎝⎠
⎛⎞
log
LOG
LOG
F
0
G
MOD
G
FB
G
CL
ΔI =
V
IN
- V
OUT
Fsw x L
V
OUT
V
IN
ΔV
OUT
= ΔI x ESR
x
(EQ. 10)
ISL6545, ISL6545A

ISL6545IBZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers 8LD SYNC PWM BUCK CNTRLR 300KHZ
Lifecycle:
New from this manufacturer.
Delivery:
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