7
FN6305.6
March 3, 2011
time it will pull the output voltage down to the final value. Any
resistive load connected to the output will help pull down the
voltage (at the RC rate of the R of the load and the C of the
output capacitance).
If the V
IN
to the upper MOSFET drain is from a different
supply that comes up after V
CC
, the soft-start would go
through its cycle, but with no output voltage ramp. When V
IN
turns on, the output would follow the ramp of the V
IN
(at
close to 100% duty cycle, with COMP/SD pin >4V), from
zero up to the final expected voltage. If V
IN
is too fast, there
may be excessive inrush current charging the output
capacitors (only the beginning of the ramp, from zero to
V
OUT
matters here). If this is not acceptable, then consider
changing the sequencing of the power supplies, or sharing
the same supply, or adding sequencing logic to the
COMP/SD pin to delay the soft-start until the V
IN
supply is
ready (see “Input Voltage Considerations” on page 9).
If the IC is disabled after soft-start (by pulling COMP/SD pin
low), and then enabled (by releasing the COMP/SD pin),
then the full initialization (including OCP sample) will take
place. However, that there is no new OCP sampling during
overcurrent retries.
If the output is shorted to GND during soft-start, the OCP will
handle it, as described in the next section.
Overcurrent Protection (OCP)
The overcurrent function protects the converter from a
shorted output by using the lower MOSFET’s on-resistance,
r
DS(ON)
, to monitor the current. A resistor (R
OCSET
)
programs the overcurrent trip level (see “Typical Application”
on page 3). This method enhances the converter’s efficiency
and reduces cost by eliminating a current sensing resistor. If
overcurrent is detected, the output immediately shuts off, it
cycles the soft-start function in a hiccup mode (2 dummy
soft-start time-outs, then up to one real one) to provide fault
protection. If the shorted condition is not removed, this cycle
will continue indefinitely.
Following POR (and 6.8ms delay), the ISL6545x initiates the
Overcurrent Protection sample and hold operation. The
LGATE driver is disabled to allow an internal 21.5µA current
source to develop a voltage across R
OCSET
. The ISL6545x
samples this voltage (which is referenced to the GND pin) at
the LGATE/OCSET pin, and holds it in a counter and DAC
combination. This sampled voltage is held internally as the
Overcurrent Set Point, for as long as power is applied, or
until a new sample is taken after coming out of a shut-down.
The actual monitoring of the lower MOSFET’s on-resistance
starts 200ns (nominal) after the edge of the internal PWM
logic signal (that creates the rising external LGATE signal).
This is done to allow the gate transition noise and ringing on
the PHASE pin to settle out before monitoring. The
monitoring ends when the internal PWM edge (and thus
LGATE) goes low. The OCP can be detected anywhere
within the above window.
If the regulator is running at high UGATE duty cycles (around
75% for 600kHz or 87% for 300kHz operation), then the
LGATE pulse width may not be wide enough for the OCP to
properly sample the r
DS(ON)
. For those cases, if the LGATE
is too narrow (or not there at all) for 3 consecutive pulses,
then the third pulse will be stretched and/or inserted to the
425ns minimum width. This allows for OCP monitoring every
third pulse under this condition. This can introduce a small
pulse-width error on the output voltage, which will be
corrected on the next pulse; and the output ripple voltage will
have an unusual 3-clock pattern, which may look like jitter.
This is not necessarily a problem; it is more of a compromise
to maintain OCP at the higher duty cycles. If the OCP is
disabled (by choosing a too-high value of R
OCSET
, or no
resistor at all), then the pulse stretching feature is also
disabled. Figure 4 illustrates the LGATE pulse width
stretching, as the width gets smaller.
FIGURE 3. SOFT-START WITH PRE-BIAS
GND>
V
OUT
NORMAL
GND>GND>
V
OUT
PRE-BIASED
V
OUT
OVERCHARGED
t0 t1 t2
FIGURE 4. LGATE PULSE STRETCHING
> 425 ns
= 425 ns
< 425 ns
<< 425 ns
ISL6545, ISL6545A
8
FN6305.6
March 3, 2011
The overcurrent function will trip at a peak inductor current
(I
PEAK)
determined by Equation 1:
where I
OCSET
is the internal OCSET current source (21.5µA
typical). The scale factor of 2 doubles the trip point of the
MOSFET voltage drop, compared to the setting on the
R
OCSET
resistor. The OC trip point varies in a system mainly
due to the MOSFET’s r
DS(ON)
variations (over process,
current and temperature). To avoid overcurrent tripping in
the normal operating load range, find the R
OCSET
resistor
from Equation 1 with:
1. The maximum r
DS(ON)
at the highest junction
temperature.
2. The minimum I
OCSET
from the specification table.
3. Determine I
PEAK
for
where ΔI is the output inductor ripple current.
For an equation for the ripple current see “Output Inductor
Selection” on page 12.
The range of allowable voltages detected
(2*I
OCSET
*R
OCSET
) is 0mV to 475mV; but the practical
range for typical MOSFETs is typically in the 20mV to 120mV
ballpark (500Ω to 3000Ω). If the voltage drop across
R
OCSET
is set too low, that can cause almost continuous
OCP tripping and retry. It would also be very sensitive to
system noise and inrush current spikes, so it should be
avoided. The maximum usable setting is around 0.2V across
R
OCSET
(0.4V across the MOSFET); values above that
might disable the protection. Any voltage drop across
R
OCSET
that is greater than 0.3V (0.6V MOSFET trip point)
will disable the OCP. The preferred method to disable OCP
is simply to remove the resistor; that will be detected that as
no OCP.
Note that conditions during power-up or during a retry may
look different than normal operation. During power-up in a
12V system, the IC starts operation just above 4V; if the
supply ramp is slow, the soft-start ramp might be over well
before 12V is reached. So with lower gate drive voltages, the
r
DS(ON)
of the MOSFETs will be higher during power-up,
effectively lowering the OCP trip. In addition, the ripple
current will likely be different at lower input voltage.
Another factor is the digital nature of the soft-start ramp. On
each discrete voltage step, there is in effect a small load
transient, and a current spike to charge the output
capacitors. The height of the current spike is not controlled; it
is affected by the step size of the output, the value of the
output capacitors, as well as the IC error amp compensation.
So it is possible to trip the overcurrent with in-rush current, in
addition to the normal load and ripple considerations.
Figure 5 shows the output response during a retry of an
output shorted to GND. At time t0, the output has been
turned off, due to sensing an overcurrent condition. There
are two internal soft-start delay cycles (t1 and t2) to allow the
MOSFETs to cool down, to keep the average power
dissipation in retry at an acceptable level. At time t2, the
output starts a normal soft-start cycle, and the output tries to
ramp. If the short is still applied, and the current reaches the
OCSET trip point any time during soft-start ramp period, the
output will shut off, and return to time t0 for another delay
cycle. The retry period is thus two dummy soft-start cycles
plus one variable one (which depends on how long it takes to
trip the sensor each time). Figure 5 shows an example
where the output gets about half-way up before shutting
down; therefore, the retry (or hiccup) time will be around
17ms. The minimum should be nominally 13.6ms and the
maximum 20.4ms. If the short condition is finally removed,
the output should ramp up normally on the next t2 cycle.
Starting up into a shorted load looks the same as a retry into
that same shorted load. In both cases, OCP is always
enabled during soft-start; once it trips, it will go into retry
(hiccup) mode. The retry cycle will always have two dummy
time-outs, plus whatever fraction of the real soft-start time
passes before the detection and shutoff; at that point, the
logic immediately starts a new two dummy cycle time-out.
Output Voltage Selection
The output voltage can be programmed to any level between
the 0.6V internal reference, up to the V
IN
supply. The
ISL6545x can run at near 100% duty cycle at zero load, but
the r
DS(ON)
of the upper MOSFET will effectively limit it to
something less as the load current increases. In addition, the
OCP (if enabled) will also limit the maximum effective duty
cycle.
An external resistor divider is used to scale the output
voltage relative to the internal reference voltage, and feed it
back to the inverting input of the error amp. See “Typical
I
PEAK
2I
OCSET
× xR
OCSET
r
DS ON()
-----------------------------------------------------------=
(EQ. 1)
I
PEAK
I
OUT MAX()
ΔI()
2
----------
+>
FIGURE 5. OVERCURRENT RETRY OPERATION
6.8ms6.8ms 0ms to 6.8ms
6.8ms
t0 t1 t2 t0
V
OUT
(0.5V/DIV)
GND>
t1
INTERNAL SOFT-START RAMP
ISL6545, ISL6545A
9
FN6305.6
March 3, 2011
Application” on page 3 for more detail; R
S
is the upper
resistor; R
OFFSET
(shortened to R
O
below) is the lower one.
The recommended value for R
S
is 1kΩ to 5kΩ (±1% for
accuracy) and then R
OFFSET
is chosen according to the
equation below. Since R
S
is part of the compensation circuit
(see “Feedback Compensation” on page 10), it is often
easier to change R
OFFSET
to change the output voltage;
that way the compensation calculations do not need to be
repeated. If V
OUT
= 0.6V, then R
OFFSET
can be left open.
Output voltages less than 0.6V are not available as shown in
Equation 2.
Input Voltage Considerations
The Typical Application diagram on page 3 shows a
standard configuration where V
CC
is either 5V (±10%) or
12V (±20%); in each case, the gate drivers use the V
CC
voltage for LGATE and BOOT/UGATE. In addition, V
CC
is
allowed to work anywhere from 6.5V up to the 14.4V
maximum. The V
CC
range between 5.5V and 6.5V is NOT
allowed for long-term reliability reasons, but transitions
through it to voltages above 6.5V are acceptable.
There is an internal 5V regulator for bias; it turns on between
5.5V and 6.5V; some of the delay after POR is there to allow
a typical power supply to ramp up past 6.5V before the
soft-start ramps begins. This prevents a disturbance on the
output, due to the internal regulator turning on or off. If the
transition is slow (not a step change), the disturbance should
be minimal. So while the recommendation is to not have the
output enabled during the transition through this region, it
may be acceptable. The user should monitor the output for
their application, to see if there is any problem.
The V
IN
to the upper MOSFET can share the same supply
as V
CC
, but can also run off a separate supply or other
sources, such as outputs of other regulators. If V
CC
powers
up first, and the V
IN
is not present by the time the
initialization is done, then the soft-start will not be able to
ramp the output, and the output will later follow part of the
V
IN
ramp when it is applied. If this is not desired, then
change the sequencing of the supplies, or use the
COMP/SD pin to disable V
OUT
until both supplies are ready.
Figure 6 shows a simple sequencer for this situation. If V
CC
powers up first, Q
1
will be off, and R
3
pulling to V
CC
will turn
Q
2
on, keeping the ISL6545x in shut-down. When V
IN
turns
on, the resistor divider R
1
and R
2
determines when Q
1
turns
on, which will turn off Q
2
, and release the shut-down. If V
IN
powers up first, Q
1
will be on, turning Q
2
off; so the
ISL6545x will start-up as soon as V
CC
comes up. The
V
DISABLE
trip point is 0.4V nominal, so a wide variety of
NFET’s or NPN’s or even some logic IC’s can be used as Q
1
or Q
2
; but Q
2
must be low leakage when off (open-drain or
open-collector) so as not to interfere with the COMP output.
Q
2
should also be placed near the COMP/SD pin.
The V
IN
range can be as low as ~1V (for V
OUT
as low as the
0.6V reference). It can be as high as 20V (for V
OUT
just
below V
IN
). There are some restrictions for running high V
IN
voltage.
The first consideration for high V
IN
is the maximum BOOT
voltage of 36V. The V
IN
(as seen on PHASE) plus V
CC
(boot
voltage - minus the diode drop), plus any ringing (or other
transients) on the BOOT pin must be less than 36V. If V
IN
is
20V, that limits V
CC
plus ringing to 16V.
The second consideration for high V
IN
is the maximum
(BOOT - V
CC
) voltage; this must be less than 24V. Since
BOOT = V
IN
+ V
CC
+ ringing, that reduces to (V
IN
+ ringing)
must be <24V. So based on typical circuits, a 20V maximum
V
IN
is a good starting assumption; the user should verify the
ringing in their particular application.
Another consideration for high V
IN
is duty cycle. Very low
duty cycles (such as 20V in to 1.0V out, for 5% duty cycle)
require component selection compatible with that choice
(such as low r
DS(ON)
lower MOSFET, and a good LC output
filter). At the other extreme (for example, 20V in to 12V out),
the upper MOSFET needs to be low r
DS(ON)
. In addition, if
the duty cycle gets too high, it can affect the overcurrent
sample time. In all cases, the input and output capacitors
and both MOSFETs must be rated for the voltages present.
Switching Frequency
The switching frequency is either a fixed 300kHz or 600kHz,
depending on the part number chosen (ISL6545 is 300kHz;
ISL6545A is 600kHz). However, all of the other timing
mentioned (POR delay, OCP sample, soft-start, etc.) is
independent of the clock frequency, unless otherwise noted.
BOOT Refresh
In the event that the UGATE is on for an extended period of
time, the charge on the boot capacitor can start to sag,
raising the r
DS(ON)
of the upper MOSFET. The ISL6545x
has a circuit that detects a long UGATE on-time (nominal
100µs), and forces the LGATE to go high for one clock cycle,
which will allow the boot capacitor some time to recharge.
Separately, the OCP circuit has an LGATE pulse stretcher
(to be sure the sample time is long enough), which can also
help refresh the boot. But if OCP is disabled (no current
V
OUT
0.6V
R
S
R
O
+()
R
O
---------------------------
=
R
O
R
S
0.6V
V
OUT
0.6V
----------------------------------
=
(EQ. 2)
FIGURE 6. SEQUENCER CIRCUIT
R
2
V
IN
R
1
R
3
V
CC
to COMP/SD
Q
2
Q
1
ISL6545, ISL6545A

ISL6545IBZ-T

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers 8LD SYNC PWM BUCK CNTRLR 300KHZ
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union