MMIX1X200N60B3H1

© 2013 IXYS CORPORATION, All Rights Reserved
XPT
TM
600V IGBT
GenX3
TM
w/Diode
V
CES
= 600V
I
C110
= 72A
V
CE(sat)
1.7V
t
fi(typ)
= 110ns
Symbol Test Conditions Maximum Ratings
V
CES
T
J
= 25°C to 150°C 600 V
V
CGR
T
J
= 25°C to 150°C, R
GE
= 1MΩ 600 V
V
GES
Continuous ±20 V
V
GEM
Transient ±30 V
I
C25
T
C
= 25°C (Chip Capability) 175 A
I
C110
T
C
= 110°C 72 A
I
F110
T
C
= 110°C 28 A
I
CM
T
C
= 25°C, 1ms 1000 A
I
A
T
C
= 25°C 100 A
E
AS
T
C
= 25°C 1 J
SSOA V
GE
= 15V, T
VJ
= 150°C, R
G
= 1Ω I
CM
= 400 A
(RBSOA) Clamped Inductive Load @V
CE
V
CES
t
sc
V
GE
= 15V, V
CE
= 360V, T
J
= 150°C 10 μs
(SCSOA) R
G
= 10Ω, Non Repetitive
P
C
T
C
= 25°C 520 W
T
J
-55 ... +150 °C
T
JM
150 °C
T
stg
-55 ... +150 °C
T
L
Maximum Lead Temperature for Soldering 300 °C
T
SOLD
1.6 mm (0.062 in.) from Case for 10 260 °C
V
ISOL
50/60Hz, 1 minute 2500 V~
F
C
Mounting Force 50..200/11..45 N/lb.
Weight 8 g
DS100473A(02/13)
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
BV
CES
I
C
= 250μA, V
GE
= 0V 600 V
V
GE(th)
I
C
= 250μA, V
CE
= V
GE
3.5 6.0 V
I
CES
V
CE
= V
CES
,
V
GE
= 0V 50 μA
Note 2, T
J
= 150°C 3 mA
I
GES
V
CE
= 0V, V
GE
= ±20V ±200 nA
V
CE(sat)
I
C
= 100A, V
GE
= 15V, Note 1 1.40 1.70 V
T
J
= 150°C 1.58 V
Extreme Light Punch Through
IGBT for 10-30kHz Switching
MMIX1X200N60B3H1
G = Gate E = Emitter
C = Collector
G
C
E
Isolated Tab
C
E
G
Features
z
Silicon Chip on Direct-Copper Bond
(DCB) Substrate
z
Isolated Mounting Surface
z
2500V~ Electrical Isolation
z
Optimized for Low Conduction and
Switching Losses
z
Avalanche Rated
z
Short Circuit Capability
z
Very High Current Capability
z
Square RBSOA
Advantages
z
High Power Density
z
Low Gate Drive Requirement
Applications
z
Power Inverters
z
UPS
z
Motor Drives
z
SMPS
z
PFC Circuits
z
Battery Chargers
z
Welding Machines
z
Lamp Ballasts
(Electrically Isolated Tab)
Preliminary Technical Information
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
MMIX1X200N60B3H1
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
g
fs
I
C
= 60A, V
CE
= 10V, Note 1 27 45 S
C
ie
s
9970 pF
C
oes
V
CE
= 25V, V
GE
= 0V, f = 1MHz 570 pF
C
res
183 pF
Q
g(on)
315 nC
Q
ge
I
C
= 200A, V
GE
= 15V, V
CE
= 0.5 • V
CES
98 nC
Q
gc
130 nC
t
d(on)
48 ns
t
ri
100 ns
E
on
2.85 mJ
t
d(off)
160 ns
t
fi
110 ns
E
of
f
2.90 4.40 mJ
t
d(on)
46 ns
t
ri
94 ns
E
on
4.40 mJ
t
d(off)
180 ns
t
fi
215 ns
E
off
3.45 mJ
R
thJC
0.24 °C/W
R
thCS
0.05 °C/W
Inductive load, T
J
= 150°C
I
C
= 100A, V
GE
= 15V
V
CE
= 360V, R
G
= 1Ω
Note 3
Inductive load, T
J
= 25°C
I
C
= 100A, V
GE
= 15V
V
CE
= 360V, R
G
= 1Ω
Note 3
Notes:
1. Pulse test, t 300μs, duty cycle, d 2%.
2. Part must be heatsunk for high-temp I
CES
measurement.
3. Switching times & energy losses may increase for higher V
CE
(Clamp), T
J
or R
G
.
Reverse Diode (FRED)
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
V
F
I
F
= 100A, V
GE
= 0V, Note 1 2.5 V
T
J
= 150°C 2.3 V
I
RM
95 A
t
rr
100 ns
R
thJC
0.83 °C/W
I
F
= 100A, V
GE
= 0V, T
J
= 150°C
-di
F
/dt = 1500A/μs, V
R
= 300V
PRELIMANARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
© 2013 IXYS CORPORATION, All Rights Reserved
MMIX1X200N60B3H1
PIN: 1 = Gate
5-12 = Emitter
13-24 = Collector

MMIX1X200N60B3H1

Mfr. #:
Manufacturer:
Littelfuse
Description:
IGBT Transistors SMPD IGBTs Power Device
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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