IS62WV2568DBLL-45HLI-TR

Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774 1
Rev. C
05/24/2013
IS62/65WV2568DALL 
IS62/65WV2568DBLL
Copyright © 2013 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest
version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
256K x 8 LOW VOLTAGE,
ULTRA LOW POWER CMOS STATIC RAM                 
FEATURES
High-speed access time: 35ns, 45ns, 55ns
CMOS low power operation
– 36 mW (typical) operating
– 9 µW (typical) CMOS standby
TTL compatible interface levels
Single power supply
– 1.8V ± 10% V
cc (IS62/65WV2568DALL)
– 2.5V–3.6V Vcc (IS62/65WV2568DBLL)
Fully static operation: no clock or refresh
required
Three state outputs
Industrial temperature available
Lead-free available
DESCRIPTION
The ISSI IS62/65WV2568DALL and IS62/65WV2568DBLL
are high-speed, 2M bit static RAMs organized as
256K words by 8 bits. It is fabricated using ISSI's high-
performance CMOS technology. This highly reliable process
coupled with innovative circuit design techniques, yields
high-performance and low power consumption devices.
When CS1 is HIGH (deselected) or when CS2 is LOW
(deselected) , the device assumes a standby mode at
which the power dissipation can be reduced down with
CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs. The active LOW Write Enable
(WE) controls both writing and reading of the memory.
The IS62/65WV2568DALL and IS62/65WV2568DBLL are
packaged in the JEDEC standard 32-pin TSOP (TYPE I),
sTSOP (TYPE I), and 36-pin mini BGA.
FUNCTIONAL BLOCK DIAGRAM
JUNE 2013
A0-A17
CS1
OE
WE
256K x 8
MEMORY ARRAY
DECODER
COLUMN I/O
CONTROL
CIRCUIT
GND
VCC
I/O
DATA
CIRCUIT
I/O0-I/O7
CS2
IS62/65WV2568DALL,  IS62/65WV2568DBLL
2 Integrated Silicon Solution, Inc. — www.issi.com
Rev. C
05/24/2013
PIN DESCRIPTIONS
A0-A17 Address Inputs
CS1 Chip Enable 1 Input
CS2 Chip Enable 2 Input
OE Output Enable Input
WE Write Enable Input
I/O0-I/O7 Input/Output
NC No Connection
Vcc Power
GND Ground
36-pin mini BGA (B)  (6mm x 8mm) 
32-pin TSOP (TYPE I), sTSOP (TYPE I) 
PIN CONFIGURATION
1 2 3 4 5 6
A
B
C
D
E
F
G
H
A0
I/O4
I/O5
GND
Vcc
I/O6
I/O7
A9
A1
A2
OE
A10
CS2
WE
NC
NC
CS1
A11
A3
A4
A5
A17
A16
A12
A6
A7
A15
A13
A8
I/O0
I/O1
Vcc
GND
I/O2
I/O3
A14
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
A11
A9
A8
A13
WE
CS2
A15
VCC
A17
A16
A14
A12
A7
A6
A5
A4
OE
A10
CS1
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
IS62/65WV2568DALL,  IS62/65WV2568DBLL
Integrated Silicon Solution, Inc. — www.issi.com 3
Rev. C
05/24/2013
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol  Parameter  Test Conditions  Vcc  Min. Max. Unit
Voh Output HIGH Voltage Ioh = -0.1 mA 1.8V ± 10% 1.4 V
Ioh = -1 mA 2.5-3.6V 2.2 V
VoL Output LOW Voltage IoL = 0.1 mA 1.8V ± 10% 0.2 V
IoL = 1.0 mA 2.5-3.6V 0.4 V
VIh Input HIGH Voltage 1.8V ± 10% 1.4 Vcc + 0.2 V
2.5-3.6V 2.2 Vcc + 0.3 V
VIL
(1)
Input LOW Voltage
1.8V ± 10% –0.2 0.4 V
2.5-3.6V –0.2 0.6 V
ILI Input Leakage GND VIn Vcc
–1 1 µA
ILo Output Leakage
GND Vout Vcc, Outputs Disabled –1 1 µA
Notes:
For IS62/65WV2568DALL:
VIL (min.) = -1.0V Ac (pluse width < 10ns). Not 100% tested.
VIh (max.) = Vcc + 1.0V Ac; (pluse width < 10ns). Not 100% tested.
For IS62/65WV2568DBLL:
VIL (min.) = -2.0V Ac (pluse width < 10ns). Not 100% tested.
VIh (max.) = Vcc + 2.0V Ac; (pluse width < 10ns). Not 100% tested.
ABSOLUTE MAXIMUM RATINGS
(1)
Symbol  Parameter  Value  Unit
Vterm Terminal Voltage with Respect to GND –0.2 to Vcc+0.3 V
tStg Storage Temperature –65 to +150 °C
Pt Power Dissipation 1.0 W
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reli-
ability.
OPERATING RANGE (Vcc)
Range  Ambient Temperature  IS62/65WV2568DALL  IS62/65WV2568DBLL 
Commercial 0°C to +70°C 1.8V ± 10% 2.5V - 3.6V
Industrial –40°C to +85°C 1.8V ± 10% 2.5V - 3.6V
Automotive (A3) –40°C to +125°C 1.8V ± 10% 2.5V - 3.6V

IS62WV2568DBLL-45HLI-TR

Mfr. #:
Manufacturer:
ISSI
Description:
SRAM 2Mb 256K x 845ns Async SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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