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74LVC74AD-Q100J

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P19
74LVC74A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 5 April 2013 12 of 18
NXP Semiconductors
74LVC74A-Q100
Dual D-type flip-flop with set and reset; positive-edge trigger
12. Package outline
Fig 10. Package outline SOT108-1 (SO14)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT108-1
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
7
8
1
14
y
076E06 MS-012
pin 1 index
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.35
0.34
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.024
0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
99-12-27
03-02-19
0 2.5 5 mm
scale
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
74LVC74A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 5 April 2013 13 of 18
NXP Semiconductors
74LVC74A-Q100
Dual D-type flip-flop with set and reset; positive-edge trigger
Fig 11. Package outline SOT402-1 (TSSOP14)
UNIT A
1
A
2
A
3
b
p
cD
(1)
E
(2) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
5.1
4.9
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.72
0.38
8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT402-1 MO-153
99-12-27
03-02-18
w M
b
p
D
Z
e
0.25
17
14
8
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v M
A
X
A
y
0 2.5 5 mm
scale
TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm
SOT402-1
A
max.
1.1
pin 1 index
74LVC74A_Q100 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 2 — 5 April 2013 14 of 18
NXP Semiconductors
74LVC74A-Q100
Dual D-type flip-flop with set and reset; positive-edge trigger
Fig 12. Package outline SOT762-1 (DHVQFN14)
terminal 1
index area
0.51
A
1
E
h
b
UNIT
ye
0.2
c
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
3.1
2.9
D
h
1.65
1.35
y
1
2.6
2.4
1.15
0.85
e
1
2
0.30
0.18
0.05
0.00
0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT762-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT762-1
DHVQFN14: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
14 terminals; body 2.5 x 3 x 0.85 mm
A
(1)
max.
A
A
1
c
detail X
y
y
1
C
e
L
E
h
D
h
e
e
1
b
26
13
9
8
7
1
14
X
D
E
C
B
A
02-10-17
03-01-27
terminal 1
index area
AC
C
B
v
M
w
M
E
(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D
(1)
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74LVC74AD-Q100J

Mfr. #:
Buy 74LVC74AD-Q100J
Manufacturer:
Nexperia
Description:
Flip Flops 74LVC74AD-Q100/SO14/REEL 13" Q
Lifecycle:
New from this manufacturer.
Delivery:
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