Package Dimensions
Figure 5: 78-Ball FBGA Die Rev. A (Package Code KJR)
Seating plane
0.12 A
Ball A1 ID
(covered by SR)
Ball A1 ID
A
0.25 MIN
1.1 ±0.1
6.4 CTR
9.5 ±0.1
0.8 TYP
9.6 CTR
13 ±0.1
78X Ø0.45
Dimensions
apply to solder
balls post-reflow
on Ø0.33 NSMD
ball pads.
0.8 TYP
123789
A
B
C
D
E
F
G
H
J
K
L
M
N
Notes:
1. All dimensions are in millimeters.
2. Solder ball material: SAC302 (96.8% Sn, 3% Ag, 0.2% Cu).
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Micron and the Micron logo are trademarks of Micron Technology, Inc. TwinDie is a trademark of Micron Technology, Inc.
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This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.
Although considered final, these specifications are subject to change, as further product development and data characterization some-
times occur.
16Gb: x4, x8 TwinDie DDR3L SDRAM
Package Dimensions
PDF: 09005aef862e2c0a
DDR3L_16Gb_x4_x8_2CS_TwinDie.pdf - Rev. B 03/15 EN
10
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