6©2018 Integrated Device Technology, Inc. July 5, 2018
9FGV1001 Datasheet
1
Practical lower frequency is determined by loop filter settings.
2
Includes loading the configuration bits from OTP to registers.
3
Actual PLL lock time depends on the loop configuration.
4
Actual jitter is configuration dependent. These values are representative of what the device can achieve.
5
Input doubler off. Maximum input frequency with input doubler on is 160MHz.
1
This configuration used for 12kHz–20MHz phase jitter measurement.
2
This configuration used for PCIe filtered phase jitter measurements.
3
Outputs configured as LP-HCSL or LVDS with REF output off unless noted.
Programmable
Capacitance at XIN and
XO (XIN in parallel with
XO)
C
L
XIN/CLKIN, XO. 0 8 pF
Input Duty Cycle t2 CLKIN, measured at V
DDREF
/2. 40 50 60 %
Output Duty Cycle t3
LVCMOS, f
OUT
> 156.25MHz. 40 50 60 %
LVCMOS, f
OUT
< 156.25MHz. 45 50 55 %
LVDS, LP-HCSL outputs. 45 50.3 55 %
Clock Jitter t6
Cycle-to-cycle jitter (peak-to-peak).
See “Test Frequencies for Jitter
Measurements in Common Electrical
Characteristics” for configurations.
28 ps 4
Reference clock RMS phase jitter
(12kHz to 5MHz integration range).
See “Test Frequencies for Jitter
Measurements in Common Electrical
Characteristics” for configurations.
338
fs
rms
4
OUTx RMS phase jitter (12kHz to
20MHz integration range) differential
output. See “Test Frequencies for
Jitter Measurements in Common
Electrical Characteristics” for
configurations.
259
fs
rms
4
Output Skew t7
Skew between the same frequencies,
with outputs using the same driver
format.
105 ps
Lock Time t8 PLL lock time from power-up. 5 10 ms 2,3
Table 7. Test Frequencies for Jitter Measurements in Common Electrical Characteristics Table
Device XIN/CLKIN OUT0 OUT1 OUT2 OUT3 Unit Notes
9FGV1001
50 156.25
MHZ
1,3
50 100 2,3
Table 6. Common Electrical Characteristics (Cont.)
Parameter Symbol Conditions Minimum Typical Maximum Units Notes