L6741 Package mechanical data
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6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
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Package mechanical data L6741
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Figure 9. Package dimensions
Table 6. SO-8 mechanical data
Dim.
mm. inch
Min Typ Max Min Typ Max
A 1.35 1.75 0.053 0.069
A1 0.10 0.25 0.004 0.010
A2 1.10 1.65 0.043 0.065
B 0.33 0.51 0.013 0.020
C 0.19 0.25 0.007 0.010
D
(1)
1. Dimensions D does not include mold flash, protru-sions or gate burrs. Mold flash, potrusions or gate burrs
shall not exceed 0.15mm (.006inch) in total (both side).
4.80 5.00 0.189 0.197
E 3.80 4.00 0.15 0.157
e 1.27 0.050
H 5.80 6.20 0.228 0.244
h 0.25 0.50 0.010 0.020
L 0.40 1.27 0.016 0.050
k 0° (min.), 8° (max.)
ddd 0.10 0.004
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L6741 Revision history
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7 Revision history
Table 7. Document revision history
Date Revision Changes
20-Aug-2007 1 Initial release.
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L6741TR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Gate Drivers SnglPphase Dual MOSFET Driver
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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