SiC530
www.vishay.com
Vishay Siliconix
S15-2523-Rev. B, 02-Nov-15
10
Document Number: 62940
For technical questions, contact: powerictechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PCB LAYOUT RECOMMENDATIONS
Step 1: V
IN
/ P
GND
Planes and Decoupling
1. Layout V
IN
and P
GND
planes as shown above.
2. Ceramic capacitors should be placed directly between
V
IN
and P
GND
, and close to the device for best
decoupling effect.
3. Different values / packages of ceramic capacitors should
be used to cover entire decoupling spectrum e.g. 1210,
0805, 0603, 0402.
4. Smaller capacitance values, placed closer to the device’s
V
IN
pin(s), results in better high frequency noise
absorbing.
Step 2: V
SWH
Plane
1. Connect output inductor to IC with large plane to lower
resistance.
2. V
SWH
plane also serves as a heat-sink for low-side
MOSFET. Make the plane wide and short to achieve the
best thermal path.
3. If a snubber network is required, place the components
as shown above, the network can be placed at bottom.
Step 3: V
CIN
/ V
DRV
Input Filter
1. The V
CIN
/ V
DRV
input filter ceramic cap should be placed
as close as possible to the IC. It is recommended to
connect two capacitors separately.
2. V
CIN
capacitor should be placed between pin 2 (V
CIN
) and
pin 3 (A
GND
of driver IC) to achieve best noise filtering.
3. V
DRV
capacitor should be placed between pin 20
(P
GND
of driver IC) and pin 21 (V
DRV
) to provide maximum
instantaneous driver current for low side MOSFET during
switching cycle.
4. For connecting V
CIN
to A
GND
, it is recommended to use
a large plane to reduce parasitic inductance.
Step 4: BOOT Resistor and Capacitor Placement
1. The components need to be placed as close as possible
to IC, directly between PHASE (pin 5) and BOOT (pin 4).
2. To reduce parasitic inductance, chip size 0402 can be
used.
V
IN
V
SWH
P
GND
V
IN
Pl ane
P
GND
Pl ane
P
GND
Plane
V
SWH
Snubber
P
GND
C
vcin
C
vdrv
A
GND
Cboot
Rboot
SiC530
www.vishay.com
Vishay Siliconix
S15-2523-Rev. B, 02-Nov-15
11
Document Number: 62940
For technical questions, contact: powerictechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Step 5: Signal Routing
1. Route the PWM and ZCD_EN# signal traces out of the
top left corner next to pin 1.
2. The PWM signal is an important signal, both signal and
return traces should not cross any power nodes on any
layer.
3. It is best to “shield” these traces from power switching
nodes, e.g. V
SWH
, with a GND island to improve signal
integrity.
4. GL (pin 19) has been connected with GL pad (pin 24)
internally.
Step 6: Adding Thermal Relief Vias
1. Thermal relief vias can be added on the V
IN
and A
GND
pads to utilize inner layers for high-current and thermal
dissipation.
2. To achieve better thermal performance, additional vias
can be placed on V
IN
plane and P
GND
plane.
3. V
SWH
pad is a noise source, it is not recommended to
place vias on this pad.
4. 8 mil vias for pads and 10 mils vias for planes are the
optimal via sizes. Vias on pad may drain solder during
assembly and cause assembly issues. Consult with the
assembly house for guidelines.
Step 7: Ground Connection
1. It is recommended to make a single connection between
A
GND
and P
GND
which can be made on the top layer.
2. It is recommended to make the entire first inner layer
(below top layer) the ground plane and separate them
into A
GND
and P
GND
planes.
3. These ground planes provide shielding between noise
sources on top layer and signal traces on bottom layer.
P
GND
A
GND
A
GND
V
IN
Plane
P
GND
Plane
V
SWH
P
GND
V
IN
A
GND
V
SWH
P
GND
A
GND
SiC530
www.vishay.com
Vishay Siliconix
S15-2523-Rev. B, 02-Nov-15
12
Document Number: 62940
For technical questions, contact: powerictechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
RECOMMENDED LAND PATTERN PowerPAK
®
MLP4535-22L
Component for MLP 4.5 x 3.5 22L
Land pattern for MLP 4.5 x 3.5 22L
22 21 20 19 18 17
6 7 8 9 10 11
1
2
3
4
5
16
15
14
13
12
0.750.75
0.37
0.30
0.30
0.75 1
0.5 x 2
= 1.00
0.5 x 3 = 1.50
0.5 x 4 = 2.00
0.75
0.75
2.31
0.145
0.75
0.595
0.45
0.14
0.45
0.75
0.50
0.30
0.595
0.30
0.5 x 2
= 1.00
0.30
3.50
3.050
0.210
0.365
0.355
0.110
45°
0.810
0.31
0.145
12.00
0.3
1.610
0.145
0.895
0.555
2.05
0.190
1.16
1.205 0.735
0.290
5
135°
4
6 7 8 9 10 11
12
13
14
15
16
171819202122
0.30
0.75
4.50
0.45
0.155
1.00
3
2
1
0.5 x 4 = 2.00
0.150
0.80
0.25
C 0.114
C 0.114
0.140

SIC530CD-T1-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
Gate Drivers 30A DrMOS VRPower
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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