2
ATM applications for physical layers other than 100 Mbps
Multimode Fiber Interface are supported by Avago Tech-
nologies. Products are available for both the single mode
and the multimode ber SONET-OC-3C (STS-3C) ATM in-
terface and the 155 Mbps ATM 94 MBd multimode ber
ATM interface as speci ed in the ATM Forum UNI.
Transmitter Sections
The transmitter sections of the AFBR-5103Z series utilize
1300 nm Surface Emitting InGaAsP LEDs. These LEDs
are packaged in the optical subassembly portion of the
transmitter section. They are driven by a custom silicon
IC which converts di erential PECL logic signals, ECL ref-
erenced (shifted) to a +5 Volt supply, into an analog LED
drive current.
Receiver Sections
The receiver sections of the AFBR-5103Z series utilize
InGaAs PIN photo diodes coupled to a custom silicon
transimpedance preampli er IC. These are packaged in
the optical sub assembly portion of the receiver.
These PIN/preampli er com bi nations are coupled to
a custom quantizer IC which provides the nal pulse
shaping for the logic output and the Signal Detect func-
tion. The data output is di erential. The signal detect
output is single-ended. Both data and signal detect
outputs are PECL compat ible, ECL referenced (shifted) to
a +5 Volt power supply.
Package
The overall package concept for the Avago Technologies
transceivers consists of the following basic elements; two
optical subassemblies, an electrical subassembly and the
housing as illustrated in Figure 1 and Figure 1a.
Figure 2b shows the outline drawing for options that
include mezzanine height with extended shield.
The package outline drawing and pin out are shown in
Figures 2, 2a and 3. The details of this package outline
and pin out are compliant with the multi source de ni-
tion of the 1x9 SIP. The low pro le of the Avago Tech-
nologies transceiver design complies with the maximum
height allowed for the duplex SC connector over the
entire length of the package.
The optical subassemblies utilize a high volume assem-
bly process together with low cost lens elements which
result in a cost e ective building block.
The electrical subassembly con sists of a high volume
multilayer printed circuit board on which the IC chips
and various surface-mounted passive circuit elements
are attached.
The package includes internal shields for the electrical
and optical subassemblies to ensure low EMI emissions
and high immunity to external EMI elds.
The outer housing including the duplex SC connec-
tor receptacle or the duplex ST ports is molded of lled
non-conductive plastic to provide mechanical strength
and electrical isolation. The solder posts of the Avago
Technologies’ design are isolated from the circuit design
of the transceiver and do not require connection to a
ground plane on the circuit board.
The transceiver is attached to a printed circuit board with
the nine signal pins and the two solder posts which exit
the bottom of the housing. The two solder posts provide
the primary mechanical strength to withstand the loads
imposed on the trans ceiver by mating with duplex or
simplex SC or ST connectored ber cables.
DATA OUT
SIGNAL
DETECT OUT
DATA IN
ELECTRICAL SUBASSEMBLY
QUANTIZER IC
DRIVER IC
TOP VIEW
PIN PHOTODIODE
DUPLEX SC
RECEPTACLE
OPTICAL
SUBASSEMBLIES
LED
PREAMP IC
DIFFERENTIAL
SINGLE-ENDED
DIFFERENTIAL
Figure 1. SC Block Diagram
