9ZX21501B
FIFTEEN OUTPUT DIFFERENTIAL ZBUFFER FOR PCIE GEN2/3 AND QPI
IDT®
FIFTEEN OUTPUT DIFFERENTIAL ZBUFFER FOR PCIE GEN2/3 AND QPI 7
9ZX21501B REV E 041613
Electrical Characteristics–DIF 0.7V Current Mode Differential Outputs
Electrical Characteristics–Current Consumption
TA = T
COM;
Supply Voltage VDD/VDDA = 3.3 V +/-5%, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
Slew rate Trf Scope avera
g
in
g
on 1 2.5 4
V/ns
1, 2, 3
Slew rate matching
Δ
Trf Slew rate matching, Scope averaging on 20
%
1, 2, 4
Voltage High VHigh 660 750 850 1
Voltage Low VLow -150 150 1
Max Voltage Vmax 1150 1
Min Voltage Vmin -300 1
Vswin
g
Vswin
g
Scope avera
g
in
g
off 300 mV 1, 2
Crossing Voltage (abs) Vcross_abs Scope averaging off 250 550 mV 1, 5
Crossing Voltage (var)
Δ
-Vcross Scope averaging off 140 mV 1, 6
2
Measured from differential waveform
5
Vcross is defined as voltage where Clock = Clock# measured on a component test board and only applies to the differential rising
edge (i.e. Clock rising and Clock# falling).
6
The total variation of all Vcross measurements in any particular system. Note that this is a subset of V_cross_min/max (V_cross
absolute
)
allowed. The intent is to limit Vcross induced modulation b
y
settin
g
V_cross_delta to be smaller than V_cross absolute.
mV
Statistical measurement on single-ended signal
using oscilloscope math function. (Scope
averaging on)
Measurement on single ended signal using
absolute value. (Scope averaging off)
mV
1
Guaranteed by design and characterization, not 100% tested in production. IREF = VDD/(3xR
R
). For R
R
= 475
(1%), I
REF
= 2.32mA.
I
OH
= 6 x I
REF
and V
OH
= 0.7V @ Z
O
=50
(100
differential impedance).
3
Slew rate is measured through the Vswing voltage range centered around differential 0V. This results in a +/-150mV window around
differential 0V.
4
Matching applies to rising edge rate for Clock and falling edge rate for Clock#. It is measured using a +/-75mV window centered on
the average cross point where Clock rising meets Clock# falling. The median cross point is used to calculate the voltage thresholds the
oscilloscope is to use for the edge rate calculations.
TA = T
COM;
Supply Voltage VDD/VDDA = 3.3 V +/-5%, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
Operating Supply Current I
DD3.3OP
All outputs active @100MHz, C
L
= Full load; 390 425 mA 1
Powerdown Current
I
DD3.3PDZ
All differential pairs tri-stated 5 15 mA 1
1
Guaranteed by desi
g
n and characterization, not 100% tested in production.
9ZX21501B
FIFTEEN OUTPUT DIFFERENTIAL ZBUFFER FOR PCIE GEN2/3 AND QPI
IDT®
FIFTEEN OUTPUT DIFFERENTIAL ZBUFFER FOR PCIE GEN2/3 AND QPI 8
9ZX21501B REV E 041613
Electrical Characteristics–Skew and Differential Jitter Parameters
TA = T
COM;
Supply Voltage VDD/VDDA = 3.3 V +/-5%, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS NOTES
CLK_IN, DIF[x:0] t
SPO_PLL
Input-to-Output Skew in PLL mode
nominal value @ 25°C, 3.3V
-300 -200 -100 ps 1,2,4,5,8
CLK_IN, DIF[x:0] t
PD_BYP
Input-to-Output Skew in Bypass mode
nominal value @ 25°C, 3.3V
2.5 3.5 4.5 ns 1,2,3,5,8
CLK_IN, DIF[x:0] t
DSPO_PLL
Input-to-Output Skew Varation in PLL mode
across voltage and temperature
-50 0 50 ps 1,2,3,5,8
CLK_IN, DIF[x:0] t
DSPO_BYP
Input-to-Output Skew Varation in Bypass mode
across voltage and temperature
-250 250 ps 1,2,3,5,8
CLK_IN, DIF[x:0] t
DTE
Random Differential Tracking error beween two
9ZX devices in Hi BW Mode
35
ps
(rms)
1,2,3,5,8
CLK_IN, DIF[x:0] t
DSSTE
Random Differential Spread Spectrum Tracking
error beween two 9ZX devices in Hi BW Mode
15 75 ps 1,2,3,5,8
DIF{x:0] t
SKEW_ALL
Output-to-Output Skew across all outputs
(Common to Bypass and PLL mode)
45 65 ps 1,2,3,8
PLL Jitter Peaking j
p
eak-hibw
LOBW#_BYPASS_HIBW = 1 0 1 2.5 dB 7,8
PLL Jitter Peaking j
p
eak-lobw
LOBW#_BYPASS_HIBW = 0 0 1 2 dB 7,8
PLL Bandwidth pll
HIBW
LOBW#_BYPASS_HIBW = 1 2 3 4 MHz 8,9
PLL Bandwidth pll
LOBW
LOBW#_BYPASS_HIBW = 0 0.7 1 1.4 MHz 8,9
Duty Cycle t
D
C
Measured differentially, PLL Mode 45 50 55 % 1
Duty Cycle Distortion t
DCD
Measured differentially, Bypass Mode
@100MHz
-2 0 2 % 1,10
PLL mode 24 50 ps 1,11
Additive Jitter in Bypass Mode 20 50 ps 1,11
Notes for preceding table:
6.
t is the period of the input clock
7
Measured as maximum pass band
g
ain. At frequencies within the loop BW, hi
g
hest point of ma
g
nification is called PLL jitter peakin
g
.
8.
Guaranteed by design and characterization, not 100% tested in production.
9
Measured at 3 db down or half power point.
10
Duty cycle distortion is the difference in duty cycle between the output and the input clock when the device is operated in bypass mode.
11
Measured from differential waveform
Jitter, Cycle to cycle t
jcyc-cyc
1
Measured into fixed 2 pF load cap. Input to output skew is measured at the first output edge following the corresponding input.
2
Measured from differential cross-
p
oint to differential cross-
p
oint. This
p
arameter can be tuned with external feedback
p
ath
,
if
p
resent.
3
All Bypass Mode Input-to-Output specs refer to the timing between an input edge and the specific output edge created by it.
4
This
p
arameter is deterministic for a
g
iven device
5
Measured with scope averaging on to find mean value. DIF_IN slew rate must be matched to DIF output slew rate.
9ZX21501B
FIFTEEN OUTPUT DIFFERENTIAL ZBUFFER FOR PCIE GEN2/3 AND QPI
IDT®
FIFTEEN OUTPUT DIFFERENTIAL ZBUFFER FOR PCIE GEN2/3 AND QPI 9
9ZX21501B REV E 041613
Electrical Characteristics–Phase Jitter Parameters
TA = T
COM;
Supply Voltage VDD/VDDA = 3.3 V +/-5%, See Test Loads for Loading Conditions
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Notes
t
jp
hPCIeG1
PCIe Gen 1 36 86 ps (p-p) 1,2,3
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
1.2 3
ps
(rms)
1,2
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
1.9
3.1
ps
(rms)
1,2
t
jphPCIeG3
PCIe Gen 3
(PLL BW of 2-4MHz, CDR = 10MHz)
0.5
1
ps
(rms)
1,2,4
QPI & SMI
(100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI)
0.31 0.5
ps
(rms)
1,5
QPI & SMI
(100MHz, 8.0Gb/s, 12UI)
0.21 0.3
ps
(rms)
1,5
QPI & SMI
(100MHz, 9.6Gb/s, 12UI)
0.17 0.2
ps
(rms)
1,5
t
jp
hPCIeG1
PCIe Gen 1 4 10 ps (p-p) 1,2,3
PCIe Gen 2 Lo Band
10kHz < f < 1.5MHz
0.25 0.3
ps
(rms)
1,2,6
PCIe Gen 2 High Band
1.5MHz < f < Nyquist (50MHz)
0.57 0.7
ps
(rms)
1,2,6
t
jphPCIeG3
PCIe Gen 3
(PLL BW of 2-4MHz, CDR = 10MHz)
0.20
0.3
ps
(rms)
1,2,4,6
QPI & SMI
(100MHz or 133MHz, 4.8Gb/s, 6.4Gb/s 12UI)
0.22 0.3
ps
(rms)
1,5,6
QPI & SMI
(100MHz, 8.0Gb/s, 12UI)
0.08 0.1
ps
(rms)
1,5,6
QPI & SMI
(100MHz, 9.6Gb/s, 12UI)
0.08 0.1
ps
(rms)
1,5,6
1
Applies to all outputs.
6
For RMS figures, additive jitter is calculated by solving the following equation: (Additive jitter)^2 = (total jittter)^2 - (input jitter)^2
5
Calculated from Intel-supplied Clock Jitter Tool v 1.6.3
t
jphPCIeG2
t
jphQPI_SMI
2
See http://www.pcisig.com for complete specs
3
Sample size of at least 100K cycles. This figures extrapolates to 108ps pk-pk @ 1M cycles for a BER of 1-12.
Additive Phase Jitter,
Bypass mode
4
Sub
j
ect to final ratification b
y
PCI SIG.
Jitter, Phase
t
jphPCIeG2
t
jphQPI_SMI

9ZX21501BKLF

Mfr. #:
Manufacturer:
IDT
Description:
Clock Buffer PCIE BUFFER - Z TECH
Lifecycle:
New from this manufacturer.
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