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74ABT374APW,118
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74ABT374A
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2012. All rights rese
rved.
Product data sheet
Rev
. 2
— 18 December 2012
10 of 16
NXP Semiconductors
74ABT374A
Oct
al D-type flip-flop; positive-edge t
rigger; 3-st
ate
Fig 1
1.
Packag
e outline SOT163-1
(SO20)
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
(1)
eH
E
LL
p
Q
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
inches
2.65
0.3
0.1
2.45
2.25
0.49
0.36
0.32
0.23
13.0
12.6
7.6
7.4
1.27
10.65
10.00
1.1
1.0
0.9
0.4
8
0
o
o
0.25
0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
w
M
b
p
detail X
Z
e
11
1
D
y
0.25
075E04
MS-013
pin 1 index
0.1
0.012
0.004
0.096
0.089
0.019
0.014
0.013
0.009
0.51
0.49
0.30
0.29
0.05
1.4
0.055
0.419
0.394
0.043
0.039
0.035
0.016
0.01
0.25
0.01
0.004
0.043
0.016
0.01
0
5
10 mm
scale
X
θ
A
A
1
A
2
H
E
L
p
Q
E
c
L
v
M
A
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm
SOT163-1
99-12-27
03-02-19
74ABT374A
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2012. All rights rese
rved.
Product data sheet
Rev
. 2
— 18 December 2012
1
1 of 16
NXP Semiconductors
74ABT374A
Oct
al D-type flip-flop; positive-edge t
rigger; 3-st
ate
Fig 12.
Package
outline SOT339-1 (SSOP20
)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
Q
(1)
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.21
0.05
1.80
1.65
0.38
0.25
0.20
0.09
7.4
7.0
5.4
5.2
0.65
7.9
7.6
0.9
0.7
0.9
0.5
8
0
o
o
0.13
1.25
0.2
0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1
MO-150
99-12-27
03-02-19
X
w
M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v
M
A
(A )
3
A
11
0
20
11
y
0.25
pin 1 index
0
2.5
5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm
SOT339-1
A
max.
2
74ABT374A
All informatio
n provided in thi
s document is su
bject to legal
disclaimers.
© NXP B.V
. 2012. All rights rese
rved.
Product data sheet
Rev
. 2
— 18 December 2012
12 of 16
NXP Semiconductors
74ABT374A
Oct
al D-type flip-flop; positive-edge t
rigger; 3-st
ate
Fig 13.
Package ou
tline SOT360-1 (TSSOP20)
UNIT
A
1
A
2
A
3
b
p
cD
(1)
E
(2)
(1)
eH
E
LL
p
QZ
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.15
0.05
0.95
0.80
0.30
0.19
0.2
0.1
6.6
6.4
4.5
4.3
0.65
6.6
6.2
0.4
0.3
0.5
0.2
8
0
o
o
0.13
0.1
0.2
1
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1
MO-153
99-12-27
03-02-19
w
M
b
p
D
Z
e
0.25
11
0
20
11
pin 1 index
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
H
E
E
c
v
M
A
X
A
y
0
2.5
5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm
SOT360-1
A
max.
1.1
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
74ABT374APW,118
Mfr. #:
Buy 74ABT374APW,118
Manufacturer:
NXP Semiconductors
Description:
Flip Flops OCTAL D 3-S
Lifecycle:
New from this manufacturer.
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