PC4D10SNIP0F

7
Sheet No.: D2-A09201EN
PC4D10SNIP0F Series
Fig.11-a Propagation Delay Time vs.
Ambient Temperature
Fig.11-b Propagation Delay Time vs.
Ambient Temperature
Propagation delay time t
PLH
, t
PHL
(ns)
Ambient temperature T
a
(C)
0
60 40 20 0 20 40 60 80 100
20
40
60
100
80
t
PHL
t
PLH
V
CC
=5V
I
F
=7.5mA
C
L
=15pF
R
L
=350Ω
Propagation delay time t
PLH
, t
PHL
(ns)
Ambient temperature T
a
(C)
0
60 40 20 0 20 40 60 80 100
20
40
60
100
80
t
PLH
t
PHL
V
CC
=5V
I
F
=7.5mA
C
L
=15pF
R
L
=1kΩ
Fig.12 Pulse width Distortion vs.
Ambient Temperature
Pulse width distrrion Δtw (ns)
Ambient temperature T
a
(C)
20
60 40 20 0 20 40 60 80 100
0
20
40
60
80
V
CC
=5V
I
F
=7.5mA
C
L
=15pF
R
L
=1kΩ
R
L
=4kΩ
R
L
=350Ω
Fig.11-c Propagation Delay Time vs.
Ambient Temperature
Propagation delay time t
PLH
, t
PHL
(ns)
Ambient temperature T
a
(C)
20
60 40 20 0 20 40 60 80 100
40
60
140
120
100
80
t
PLH
t
PHL
V
CC
=5V
I
F
=7.5mA
C
L
=15pF
R
L
=4kΩ
Fig.13 Rise Time / Fall Time vs.
Ambient Temperature
Rise time t
r
, Fall time t
f
(ns)
Ambient temperature T
a
(C)
0
60 40 20 0 20 40 60 80 100
10
20
30
50
40
t
r
t
f
V
CC
=5V
I
F
=7.5mA
C
L
=15pF
R
L
=350Ω
Remarks : Please be aware that all data in the graph
are just for reference and anot for guarantee.
8
Sheet No.: D2-A09201EN
PC4D10SNIP0F Series
Design Considerations
Recommended operating conditions
Parameter Symbol MIN. TYP. MAX. Unit
Low level input current I
FL
0
250
μ
A
High level input current I
FH
8
15 mA
Supply voltage V
CC
4.5
5.5 V
Fan out (TTL load) N
−−
5
Output pull-up resitor R
L
330
4 000
Ω
Operating temperature T
opr
40
+
85 ˚C
Notes about static electricity
Transistor of detector side in bipolar con guration may be damaged by static electricity due to its minute de-
sign.
When handling these devices, general countermeasure against static electricity should be taken to avoid
breakdown of devices or degradation of characteristics.
Design guide
In order to stabilize power supply line, we should certainly recommend to connect a by-pass capacitor of
0.01
μ
F or more between V
CC
and GND near the device.
In case that some sudden big noise caused by voltage variation is provided between primary and secondary
terminals of photocoupler some current caused by it is oating capacitance may be generated and result in
false operation since current may go through LED or current may change.
If the photocoupler may be used under the circumstances where noise will be generated we recommend to
use the bypass capacitors at the both ends of LED.
The detector which is used in this device, has parasitic diode between each pins and GND.
There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin
becomes below GND level even for instant.
Therefore it shall be recommended to design the circuit that electric potential of any pin does not become
below GND level.
This product is not designed against irradiation and incorporates non-coherent LED.
Degradation
In general, the emission of the LED used in photocouplers will degrade over time.
In the case of long term operation, please take the general LED degradation (50% degradation over 5 years)
into the design consideration.
Please decide the input current which become 2 times of MAX. I
FHL
.
Recommended foot print (reference)
1.27
0.64
1.9
7.49
1.271.27
(Unit : mm)
9
Sheet No.: D2-A09201EN
PC4D10SNIP0F Series
Manufacturing Guidelines
Soldering Method
Re ow Soldering:
Re ow soldering should follow the temperature pro le shown below.
Soldering should not exceed the curve of temperature pro le and time.
Please don't solder more than twice.
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in ow solder bath is allowed under the be-
low listed guidelines.
Flow soldering should be completed below 270̊C and within 10s.
Preheating is within the bounds of 100 to 150̊C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.
Please don't solder more than twice.
Other notice
Please test the soldering method in actual condition and make sure the soldering works ne, since the im-
pact on the junction between the device and PCB varies depending on the tooling and soldering conditions.
1234
300
200
100
0
0
(˚C)
Terminal : 260˚C peak
(package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)

PC4D10SNIP0F

Mfr. #:
Manufacturer:
Sharp Microelectronics
Description:
High Speed Optocouplers Dual Ch. SO8-1Mbit/s High CMR 1.5Kpcs
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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