2008-2015 Microchip Technology Inc. DS80000425P-page 13
PIC18F24K20/25K20/44K20/45K20
Data Sheet Clarifications
The following typographic corrections and clarifications
are to be noted for the latest version of the device data
sheet (DS41303H):
1. Module: Product Identification System
The temperature range values have been
corrected.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Note: Corrections are shown in bold. Where
possible, the original bold text formatting
has been removed for clarity.
PART NO.
X /XX XXX
PatternPackageTemperature
Range
Device
Device: PIC18F24K20; PIC18F25K20; PIC18F44K20; PIC18F26K20;
PIC18F45K20; PIC18F44K20; PIC18F45K20; PIC18F46K20.
Tape and Reel
Option:
Blank = Standard packaging (tube or tray)
T = Tape and Reel
(1)
Temperature
Range:
I= -40C to +85C(Industrial)
E= -40C to +125C(Extended)
Package: PT = TQFP (Thin Quad Flatpack)
SS = SSOP
SO = SOIC
SP = SPDIP (Skinny Plastic DIP)
P=PDIP
ML = QFN
MV = UQFN
Pattern: QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
a) PIC18F45K20 - E/P 301 = Industrial temp.,
PDIP package, QTP pattern #301.
b) PIC18F24K20 - I/SO = Industrial temp., SOIC
package.
c) PIC18F44K20 - E/P = Extended temp., PDIP
package.
d) PIC18F46K20 - I/PT = Industrial temp., TQFP
package, tape and reel.
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
[X]
(1)
Tape and Reel
Option
PIC18F24K20/25K20/44K20/45K20
DS80000425P-page 14 2008-2015 Microchip Technology Inc.
APPENDIX A: DOCUMENT
REVISION HISTORY
Rev A Document (12/2008)
Initial release of this document.
Rev B Document (05/2009)
Updated Errata to new format; Added Module 11:
PORTB and Module 12: ADC; minor edits.
Clarifications/Corrections to the Data Sheet: Added
Module 1: MSSP; Module 2: Electrical Specifications;
Module 3: Electrical Specifications.
Rev C Document (06/2009)
Clarifications/Corrections to the Data Sheet:
Deleted Module 1: MSSP: Figure 17-17 Baud Rate
Generator Block Diagram, updating subsequent num-
bering. Added Module 3 MSSP: Register 17-3
SSPADD; Added Module 4 MSSP: Section 17.4.2
Operation; Added Module 5 MSSP: Figure 17-16
MSSP Block Diagram; Added Module 6 MSSP: Sec-
tions 17.4.7.1, 17.4.8, 17.4.9, 17.4.17.1, 17.4.17.2,
17.4.17.3: SSPADD, changing <6:0> to <7:0>.
Rev D Document (11/2009)
Updated to add revision 0x1B.
Data Sheet Clarifications: Deleted Modules 1, 2, 3, 4,
5, 6.
Rev E Document (04/2010)
Updated to include early revisions of silicon, revision
IDs 0xA through 0x11. These early revisions were
described in DS80366 errata, which is now obsolete.
Rev F Document (05/2010)
Updated Table 1.
Rev G Document (07/2010)
Removed ADC Work around #2 and changed #3 to #2
(Module 28).
Rev H Document (07/2011)
Updated errata to the new format; Updated Module 16;
Added Modules 38 and 39; Updated Table 2 to include
the new modules.
Data Sheet Clarifications: Added Module 1.
Rev J Document (07/2012)
Added Silicon revision AF.
Rev K Document (05/2013)
Added MPLAB X IDE; Added Module 40, Low-Voltage
Detect.
Data Sheet Clarifications: Added Module 2, Electrical
Characteristics.
Rev L Document (12/2013)
Data Sheet Clarification: Updated Module 2 (Electrical
Characteristics, Table 26-8).
Rev M Document (4/2014)
Data Sheet Clarifications: Added Modules 3, 4, 5, 6, 7,
8.
Rev N Document (7/2014)
Added Module 41, Timer1/3 to Silicon Errata Issues
section.
Rev P Document (9/2015)
Data Sheet Clarifications:
Removed modules 1-8. Added Module 1, Product
Identification System.
2008-2015 Microchip Technology Inc. DS80000425P-page 15
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, K
EELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC
32
logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2008-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-796-6
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
®
MCUs and dsPIC
®
DSCs, KEELOQ
®
code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==

PIC18F24K20-E/SS

Mfr. #:
Manufacturer:
Microchip Technology
Description:
8-bit Microcontrollers - MCU 16KB Flash 768B RAM 25 I/O 8B
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union