ISL76321
6
FN7803.2
May 1, 2015
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Absolute Maximum Ratings Thermal Information
Supply Voltage
VDD_P to GND_P, VDD_TX to GND_TX, VDD_IO to GND_IO . . -0.5V to 4.6V
VDD_CDR to GND_CDR, VDD_CR to GND_CR . . . . . . . . . . . . . . . . -0.5V to 2.5V
Between any pair of GND_P, GND_TX, GND_IO, GND_CDR,
GND_CR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.1V to 0.1V
3.3V Tolerant LVTTL/LVCMOS
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VDD_IO +0.3V
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . .-0.3V to VDD_IO + 0.3V
Differential Output Current . . . . . . . . . . . . . . . . . . . . Short Circuit Protected
LVTTL/LVCMOS Outputs. . . . . . . . . . . . . . . . . . . . . . . Short Circuit Protected
ESD Rating
Human Body Model (Tested per JESD22-A114E)
All pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4kV
SERIOP/N
(All VDD Connected, all GND Connected) . . . . . . . . . . . . . . . . . . . . . . 8kV
Machine Model (Tested per JESD-A115-A) . . . . . . . . . . . . . . . . . . . . 200V
Charge Device Model (Tested per AEC-Q100-011-B) . . . . . . . . . . . 2000V
Latch-up (Tested per JESD-78B; Class2, Level A) . . . . . . . . . . . . . . . 100mA
Thermal Resistance (Typical)
JA
JC
(°C/W)
QFN Package (Notes 6
, 7) . . . . . . . . . . . . . . 32 3.7
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 327mW
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . .+125°C
Maximum Storage Temperature Range . . . . . . . . . . . . . .-65°C to +150°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see TB493
Recommended Operating Conditions
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . .-40°C to +105°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
6.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
Brief TB379.
7. For
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
Electrical Specifications Unless otherwise indicated, all data is for: VDD_CDR
= VDD_CR = 1.8V, VDD_IO = 3.3V
,
VDD_TX = VDD_P = VDD_AN
= 3.3V, T
A
= +25°C, Ref_Res = 3.16kΩ, High-speed AC-coupling capacitor = 27nF. Boldface limits apply over the operating
temperature range, -40°C to +105°C.
PARAMETER SYMBOL CONDITIONS
MIN
(Note 10
)TYP
MAX
(Note 10)UNITS
POWER SUPPLY VOLTAGE
VDD_CDR, VDD_CR 1.7 1.8 1.9 V
VDD_TX, VDD_P, VDD_AN, VDD_IO 3.0 3.3 3.6 V
SERIALIZER POWER SUPPLY CURRENTS
Total 1.8V Supply Current PCLK_IN = 45MHz 62 80 mA
Total 3.3V Supply Current (Note 8
)4052 mA
DESERIALIZER POWER SUPPLY CURRENTS
Total 1.8V Supply Current PCLK_IN = 45MHz 66 76 mA
Total 3.3V Supply Current (Note 8
)5063 mA
POWER-DOWN SUPPLY CURRENT
Total 1.8V Power-Down Supply Current RSTB = GND 10 mA
Total 3.3V Power-Down Supply Current 0.5 mA
PARALLEL INTERFACE
High Level Input Voltage V
IH
2.0 V
Low Level Input Voltage V
IL
0.8 V
Input Leakage Current I
IN
-1 ±0.01 1 µA
High Level Output Voltage V
OH
I
OH
= -4.0mA, VDD_IO = 3.0V 2.6 V
Low Level Output Voltage V
OL
I
OL
= 4.0mA, VDD_IO = 3.6V 0.4 V
Output Short Circuit Current I
OSC
35 mA
