Preliminary
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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specifications: DS-CPC7584 - R0B
© Copyright 2004, Clare, Inc.
All rights reserved. Printed in USA.
1/23/2004
temperatures may lead to moisture induced
delamination and cracking of the component. To
prevent this, this component must be handled in
accordance with IPC/JEDEC standard J-STD-020A
per the labeled moisture sensitivity level (MSL), level 1
for the SOIC package, and level 2 for the MLP
package.
3.4.2 Reflow Profile
The maximum ramp rates, dwell times, and
temperatures of the assembly reflow profile should not
exceed those specified in IPC/JEDEC standard
J-STD-020A, which were used to determine the
moisture sensitivity level of this component.
3.5 Washing
Clare does not recommend ultrasonic cleaning of
LCAS parts.
