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NCV7707DQR2G

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P38
NCV7707, NCV7707B
www.onsemi.com
4
PIN FUNCTION DESCRIPTION
Pin No. Pin Name Pin Type Description
1 GND Ground Ground Supply (all GND pins have to be connected externally)
2 OUT11 HS driver Output Heater Output (has to be connected externally to pin 35)
3 OUT1
Half bridge driver
Output
Mirror common Output
4 OUT2
Half bridge driver
Output
Mirror x/y control Output
5 OUT3
Half bridge driver
Output
Mirror x/y control Output
6 VS Supply Battery Supply Input (all VS pins have to be connected externally)
7 VS Supply Battery Supply Input (all VS pins have to be connected externally)
8 SI Digital Input SPI interface Serial Data Input
9
ISOUT /
PWM2
Digital Input /
Analog Output
PWM control Input / Current Sense Output. This pin is a bidirectional pin. Depend-
ing on the selected multiplexer bits, an image of the instant current of the corres-
ponding HS stage can be read out.
This pin can also be used as PWM control input pin for OUT5, OUT8 and OUT10.
10 CSB Digital Input SPI interface Chip Select
11 SO Digital Output SPI interface Serial Data Output
12 VCC Supply Logic Supply Input
13 SCLK Digital Input SPI interface Shift Clock
14 VS Supply Battery Supply Input (all VS pins have to be connected externally)
15 VS Supply Battery Supply Input (all VS pins have to be connected externally)
16 OUT4
Half bridge driver
Output
Door Lock Output (has to be connected externally to pin 17)
17 OUT4
Half bridge driver
Output
Door Lock Output (has to be connected externally to pin 16)
18 GND Ground Ground Supply (all GND pins have to be connected externally)
19 GND Ground Ground Supply (all GND pins have to be connected externally)
20 OUT5
Half bridge driver
Output
Door Lock Output (has to be connected externally to pin 21)
21 OUT5
Half bridge driver
Output
Door Lock Output (has to be connected externally to pin 20)
22 OUT6
Half bridge driver
Output
Safe−Lock / Mirror Fold Output
23 VS Supply Battery Supply Input (all VS pins have to be connected externally)
24 VS Supply Battery Supply Input (all VS pins have to be connected externally)
25 ECON ECM driver Output
Electrochromic mirror control DAC output. If the Electrochrome feature is selec-
ted, this output controls an external Mosfet, otherwise it remains in high−imped-
ance state.
If the electrochrome feature is not used in the application and not selected via SPI
the pin can be connected to VS.
26 CHP Analog Output Reverse Polarity FET Control Output
27 PWM1 Digital Input PWM control Input for OUT1−4, OUT6/7, OUT9, OUT11
28 VS Supply Battery Supply Input (all VS pins have to be connected externally)
29 VS Supply Battery Supply Input (all VS pins have to be connected externally)
30 OUT7 HS driver Output LED / Bulb Output
31 OUT8 HS driver Output LED / Bulb Output
32 ECFB ECM Input / Output Electrochromic Mirror Feedback Input, Fast discharge transistor Output
33 OUT9 HS driver Output LED Output
34 OUT10 HS driver Output LED Output
35 OUT11 HS driver Output Heater Output (has to be connected externally to pin 2)
36 GND Ground Ground Supply (all GND pins have to be connected externally)
Heat slug Ground Substrate; Heat slug has to be connected to all GND pins
NCV7707, NCV7707B
www.onsemi.com
5
ABSOLUTE MAXIMUM RATINGS
Symbol Rating Min Max Unit
Vs
Power supply voltage
− Continuous supply voltage
− Transient supply voltage (t < 500 ms, ”clamped load dump”)
−0.3
−0.3
28
40
V
V
CC
Logic supply −0.3 5.5 V
Vdig DC voltage at all logic pins (SO, SI, SCLK, CSB, PWM1) −0.3 V
CC
+ 0.3 V
Visout/pwm2 Current monitor output / PWM2 logic input −0.3 V
CC
+ 0.3 V
Vchp Charge pump output (the most stringent value is applied)
−25
Vs − 25
40
Vs + 15
V
Voutx,
Vecon, Vecfb
Static output voltage (OUT1−11, ECON, ECFB) −0.3 Vs + 0.3 V
Iout1/6 OUT1/6 Output current −5 5 A
Iout2/3 OUT2/3 Output current −1.25 1.25 A
Iout4/5 OUT4/5 Output current −10 10 A
Iout7/8 OUT7/8 Output current −5 5 A
Iout9/10 OUT9/10 Output current −1.25 1.25 A
Iout11 OUT11 Output current −10 10 A
Iout_ecfb ECFB Output current 1.25 A
ESD_HBM
ESD Voltage, Human Body Model (HBM); (100 pF, 1500 W) (Note 1)
− All pins
− Output pins OUT1−6 and ECFB to GND (all unzapped pins grounded)
−2
−4
2
4
kV
ESD_CDM
ESD according to CDM (Charge Device Model) (Note 1)
− All pins
− Corner pins
−500
−750
500
750
V
T
J
Operating junction temperature range −40 150 °C
Tstg Storage temperature range −55 150 °C
MSL Moisture sensitivity level (Note 2) MSL3
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Charge Device Model tested per EIA/JES D22/C101, Field Induced Charge Model
2. For soldering information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Symbol Rating Value Unit
R
θJC
Thermal Characteristics, SSOP36−EP
Thermal Resistance, Junction−to−Case
2.5 °C/W
R
θJA
Thermal Characteristics, SSOP36−EP, 1−layer PCB
Thermal Resistance, Junction−to−Air (Note 3)
42 °C/W
R
θJA
Thermal Characteristics, SSOP36−EP, 4−layer PCB
Thermal Resistance, Junction−to−Air (Note 4)
19.5 °C/W
3. Values based on PCB of 76.2 x 114.3 mm, 72 μm copper thickness, 20 % copper area coverage and FR4 PCB substrate.
4. Values based on PCB of 76.2 x 114.3 mm, 72 / 36 μm copper thickness (signal layers / internal planes), 20 / 90 % copper area coverage
(signal layers / internal planes) and FR4 PCB substrate.
NCV7707, NCV7707B
www.onsemi.com
6
ELECTRICAL CHARACTERISTICS
4.5 V < V
CC
< 5.25 V, 8 V < Vs < 18 V, −40°C < T
J
< 150°C; unless otherwise noted.
Symbol Parameter Test Conditions Min Typ Max Unit
SUPPLY
Vs
Supply voltage
Functional (see V
UV_VS
/ V
OV_VS
)
Parameter specification
5.5
8
28
18
V
Is(standby)
Supply Current (VS),
Standby mode
Standby mode,
VS = 16 V, 0 V v V
CC
v 5.25 V,
CSB = V
CC
, OUTx/ECx = floating,
SI = SCLK = 0 V, T
J
< 85°C
(T
J
= 150°C)
3.5
(9)
12
(25)
mA
Is(active)
Supply current (VS), Active
mode
Active mode,
VS = 16 V,
OUTx/ECx = floating
8 20 mA
I
CC
(standby)
Supply Current (VCC),
Standby mode
Standby mode,
V
CC
= 5.25 V,
SI = SCLK = 0 V, T
J
< 85°C
(T
J
= 150°C)
4.5
(15)
6
(50)
mA
I
CC
(active)
Supply current (VCC),
Active mode
Active mode,
VS = 16 V,
OUTx/ECx = floating
6.5 8.4 mA
I(standby)
Total Standby mode supply
current (Is + I
CC
)
Standby mode,
VS = 16 V, T
J
< 85°C,
CSB = V
CC
, OUTx/ECx = floating
8 18
mA
OVERVOLTAGE AND UNDERVOLTAGE DETECTION
Vuv_vs(on)
VS Undervoltage detectio
n
VS increasing 5.6 6.2 V
Vuv_vs(off) VS decreasing 5.2 5.8 V
Vuv_vs(hys)
VS Undervoltage
hysteresis
Vuv_vs(on) − Vuv_vs(off) 0.65 V
Vov_vs(off)
VS Overvoltage detection
VS increasing 20 24.5 V
Vov_vs(on) VS decreasing 19 23.5 V
Vov_vs(hys) VS Overvoltage hysteresis Vov_vs(off) − Vov_vs(on) 2 V
Vuv_vcc(off)
VCC Undervoltage
detection
V
CC
increasing 2.9 V
Vuv_vcc(on) V
CC
decreasing 2 V
Vuv_vcc(hys)
VCC Undervoltage
hysteresis
V
uv_VCC(off)
− V
uv_VCC(on)
0.11 V
td_uvov
VS Undervoltage /
Overvoltage filter time
Time to set the power supply fail bit
UOV_OC in the Global Status Byte
6 100
ms
CHARGE PUMP OUTPUT CHP
Vchp8
Chargepump Output
Voltage
Vs = 8 V, Ichp = −60 mA
Vs + 6 Vs + 9.5 Vs + 13 V
Vchp10
Chargepump Output
Voltage
Vs = 10 V, Ichp = −80 mA
Vs + 8 Vs + 11 Vs + 13 V
Vchp12
Chargepump Output
Voltage
VS > 12 V, Ichp = −100 mA
Vs + 9.5 Vs + 11 Vs + 13 V
Ichp
Chargepump Output
current
VS = 13.5 V, Vchp = Vs + 10 V −750 −95
mA
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P38

NCV7707DQR2G

Mfr. #:
Buy NCV7707DQR2G
Manufacturer:
ON Semiconductor
Description:
Motor / Motion / Ignition Controllers & Drivers DOOR-MODULE DVR-IC
Lifecycle:
New from this manufacturer.
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