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MT72JSZS4G72LZ-1G9E2C3

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18
DRAM Operating Conditions
Recommended AC operating conditions are given in the DDR3 component data sheets.
Component specifications are available at micron.com. Module speed grades correlate
with component speed grades, as shown below.
Table 10: Module and Component Speed Grades
DDR3 components may exceed the listed module speed grades; module may not be available in all listed speed grades
Module Speed Grade Component Speed Grade
-2G1 -093
-1G9 -107
-1G6 -125
-1G4 -15E
-1G1 -187E
-1G0 -187
-80C -25E
-80B -25
Design Considerations
Simulations
Micron memory modules are designed to optimize signal integrity through carefully de-
signed terminations, controlled board impedances, routing topologies, trace length
matching, and decoupling. However, good signal integrity starts at the system level.
Micron encourages designers to simulate the signal characteristics of the system's
memory bus to ensure adequate signal integrity of the entire memory system.
Power
Operating voltages are specified at the DRAM, not at the edge connector of the module.
Designers must account for any system voltage drops at anticipated power levels to en-
sure the required supply voltage is maintained.
32GB (x72, ECC, QR) 240-Pin DDR3 LRDIMM
DRAM Operating Conditions
PDF: 09005aef83b62686
jszs72c4gx72lz.pdf - Rev. F 2/15 EN
13
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
I
DD
Specifications
Table 11: DDR3 I
CDD
Specifications and Conditions – 32GB (Die Revision E)
Values are for the MT41J2G4 DDR3 SDRAM only and are computed from values specified in the 8Gb TwinDie (2 Gig x 4)
component data sheet
Parameter
Combined
Symbol 1866 Units
Operating current 0: One bank ACTIVATE-to-PRECHARGE I
CDD0
2484 mA
Operating current 1: One bank ACTIVATE-to-READ-to-PRECHARGE I
CDD1
2538 mA
Precharge power-down current: Slow exit I
CDD2P0
1296 mA
Precharge power-down current: Fast exit I
CDD2P1
1638 mA
Precharge quiet standby current I
CDD2Q
1908 mA
Precharge standby current I
CDD2N
1908 mA
Precharge standby ODT current I
CDD2NT
2034 mA
Active power-down current I
CDD3P
1710 mA
Active standby current I
CDD3N
2016 mA
Burst read operating current I
CDD4R
4320 mA
Burst write operating current I
CDD4W
3762 mA
Refresh current I
CDD5B
5634 mA
Self refresh temperature current: MAX T
C
= 85°C I
CDD6
1440 mA
Self refresh temperature current (SRT-enabled): MAX T
C
= 95°C I
CDD6ET
1800 mA
All banks interleaved read current I
CDD7
5886 mA
Reset current I
CDD8
1440 mA
32GB (x72, ECC, QR) 240-Pin DDR3 LRDIMM
I
DD
Specifications
PDF: 09005aef83b62686
jszs72c4gx72lz.pdf - Rev. F 2/15 EN
14
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
Table 12: DDR3 I
CDD
Specifications and Conditions – 32GB (Die Revision N)
Values are for the MT41K2G4 DDR3 SDRAM only and are computed from values specified in the 8Gb TwinDie 1.35V (2 Gig
x 4) component data sheet
Parameter
Combined
Symbol 1866 Units
Operating current 0: One bank ACTIVATE-to-PRECHARGE I
CDD0
1728 mA
Operating current 1: One bank ACTIVATE-to-READ-to-PRECHARGE I
CDD1
1908 mA
Precharge power-down current: Slow exit I
CDD2P0
576 mA
Precharge power-down current: Fast exit I
CDD2P1
720 mA
Precharge quiet standby current I
CDD2Q
1224 mA
Precharge standby current I
CDD2N
1224 mA
Precharge standby ODT current I
CDD2NT
1368 mA
Active power-down current I
CDD3P
936 mA
Active standby current I
CDD3N
1440 mA
Burst read operating current I
CDD4R
2556 mA
Burst write operating current I
CDD4W
2556 mA
Refresh current I
CDD5B
3996 mA
Self refresh temperature current: MAX T
C
= 85°C I
CDD6
864 mA
Self refresh temperature current (SRT-enabled): MAX T
C
= 95°C I
CDD6ET
1152 mA
All banks interleaved read current I
CDD7
3366 mA
Reset current I
CDD8
720 mA
32GB (x72, ECC, QR) 240-Pin DDR3 LRDIMM
I
DD
Specifications
PDF: 09005aef83b62686
jszs72c4gx72lz.pdf - Rev. F 2/15 EN
15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2010 Micron Technology, Inc. All rights reserved.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18

MT72JSZS4G72LZ-1G9E2C3

Mfr. #:
Buy MT72JSZS4G72LZ-1G9E2C3
Manufacturer:
Micron
Description:
MODULE DDR3 SDRAM 32GB 240LRDIMM
Lifecycle:
New from this manufacturer.
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