MT72JSZS4G72LZ-1G9E2C3 Datasheet MT72JSZS4G72LZ-1G9E2C3 | P7-P9

Table 6: Component-to-Module DQ Map, Front (Continued)

Component

Reference

Number

Component

DQ Module DQ

Module Pin

Number

Component

Reference

Number

Component

DQ Module DQ

Module Pin

Number

U18 0 38 206 U19 0 33 82

1 37 201 1 34 87

2 36 200 2 32 81

3 39 207 3 35 88

Table 7: Component-to-Module DQ Map, Back

Component

Reference

Number

Component

DQ Module DQ

Module Pin

Number

Component

Reference

Number

Component

DQ Module DQ

Module Pin

Number

U20 0 42 96 U21 0 46 215

1 40 90 1 45 210

2 41 91 2 47 216

3 43 97 3 44 209

U22 0 50 105 U23 0 53 219

1 48 99 1 55 225

2 49 100 2 54 224

3 51 106 3 52 218

U25 0 14 137 U26 0 9 13

1 12 131 1 8 12

2 15 138 2 11 19

3 13 132 3 10 18

U27 0 CB5 159 U28 0 20 140

1 CB6 164 1 23 147

2 CB7 165 2 21 141

3 CB4 158 3 22 146

U29 0 18 27 U30 0 34 87

1 17 22 1 32 81

2 16 21 2 35 88

3 19 28 3 33 82

U31 0 37 201 U32 0 57 109

1 36 200 1 58 114

2 39 207 2 59 115

3 38 206 3 56 108

32GB (x72, ECC, QR) 240-Pin DDR3 LRDIMM

DQ Map

PDF: 09005aef83b62686

jszs72c4gx72lz.pdf - Rev. F 2/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Table 7: Component-to-Module DQ Map, Back (Continued)

Component

Reference

Number

Component

DQ Module DQ

Module Pin

Number

Component

Reference

Number

Component

DQ Module DQ

Module Pin

Number

U33 0 62 233 U34 0 7 129

1 61 228 1 6 128

2 63 234 2 4 122

3 60 227 3 5 123

U35 0 0 3 U36 0 CB1 40

1 3 10 1 CB2 45

2 1 4 2 CB3 46

3 2 9 3 CB0 39

U37 0 31 156 U38 0 27 37

1 29 150 1 26 36

2 30 155 2 24 30

3 28 149 3 25 31

32GB (x72, ECC, QR) 240-Pin DDR3 LRDIMM

DQ Map

PDF: 09005aef83b62686

jszs72c4gx72lz.pdf - Rev. F 2/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

Functional Block Diagram

Figure 2: Functional Block Diagram

Group A

(Address/Command/Control/ Clock)

36 TwinDie DRAM in 4 Module Rank Configuration

Group B

(Address/Command/Control/Clock)

CKE2A/B,

ODT0A/B,

CS2

CKE3A/B,

ODT1A/B,

CS3

CKE1A/B, ODT1A/B, CS1

CKE0A/B, ODT0A/B, CS0

Rank 1

Memory Buffer

SPD/EEPROM

Temp Sensor

EVENT#

Temp

Sensor

Configuration

and

Status Registers

EVENT#

SMBus

DQS[17:0]

DQS#[17:0]

DQ[63:0]

CB[7:0]

Data and Strobes

CK0

CK0#

S#[3:0]

BA[2:0]

A[15:0]

Par_In

RAS#

CAS#

WE#

CKE0

CKE1

ODT0

ODT1

RESET#

Address/Command/Control/Clock

Err_Out#

REFCA

REFDQ

Rank

Multiplication

A15

S#[1:0]

S2#/A16

S3#/A17

Rank

Multiplier

Data and Strobes

Rank 2

Rank 0

Rank 3

Notes:

1. The ZQ ball on each DDR3 die is connected to a separate external 240Ω ±1% resistor

that is tied to V

. This supports ZQ calibration to the entire device with one command

set. It is used for the calibration of the component’s ODT and output driver.

2. A15 used for rank multiplication for 16GB module and for DRAM addressing for 32GB

module.

32GB (x72, ECC, QR) 240-Pin DDR3 LRDIMM

Functional Block Diagram

PDF: 09005aef83b62686

jszs72c4gx72lz.pdf - Rev. F 2/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18

MT72JSZS4G72LZ-1G9E2C3

Mfr. #:

Buy MT72JSZS4G72LZ-1G9E2C3

Manufacturer:

Micron

Description:

MODULE DDR3 SDRAM 32GB 240LRDIMM

Lifecycle:

New from this manufacturer.

Delivery:

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Payment:

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MT72JSZS4G72LZ-1G9E2C3