NCP1339
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4
Figure 3. NCP1339 Functional Block Diagram
Fault
Latch
Vfault(OVP)
Vfault(OTP)
S
R
Q
Q
BONOK
Ifault(OTP)
Rfault(clamp)
Vfault(clamp)
5V
CS
/Kfb
LEB
tcs(LEB2)
FB
ICS
5V
OPP
Vilim2
Vilim1
LEB
tcs(LEB1)
+
Counter count
Reset
Overload Timer
Count Up
Count Down
PWM
comparator
Peak current
Comparator with OPP
Peak current
Comparator W/O OPP
Short Circuit
Comparator
Vfreeze
Frozen Curent
Comparator
Ip_flag
PWM
Reset
Overcurrent
CSStop
DRV
VOPP
VOPP
Thermal
Shutdown
Auto−Restart
Fault Control
DRV
S
R
Q
Q
Latch
PWM Reset
Overcurrent
QR Clock
Clamp
VCC
ZCD
+
Vzcd(th)
Blanking Time
Tzcd(blank)
Timeout
QR
Logic
DRV
(internal)
(internal)
QR clock
VFB
DEMAG
HV
REM
X2
VCC
VCC charge
X2 Capacitor discharge
BONOK detection
Line monitoring
PSM control
HV(stop)
Latch
VFB
BO_buf
Fault or PSM
VCC Management
and internal Reference
HV(stop)
UVLO
VDD
Circuit reset
When VCC<VCC(reset)
VCC(OVP)
Clock_25 kHz
Delay
25−kHz
Frequency Clamp
Clock_25 kHz
DRV
Vskip
FB
Skip
Skip Comparator
GND
IFF
IFF(bias)
5V
VIFF
I and J versions only
or VIFF/4
NCP1339
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5
MAXIMUM RATINGS
Rating Symbol Value Unit
High Voltage Startup Circuit Input Voltage V
HV
−0.3 to 500 V
High Voltage Startup Circuit Input Current I
HV
20 mA
Supply Input Voltage V
CC(MAX)
−0.3 to 30 V
Supply Input Current I
CC(MAX)
30 mA
Supply Input Voltage Slew Rate dV
CC
/dt 1
V/ms
Fault and IFF Input Voltage V
i1
−0.3 to (V
CC
+ 1) V
Fault and IFF Input Current I
i1
10 mA
REM and X2 Input Voltage V
i2
−0.3 to 10 V
REM and X2 Input Current I
i2
10 mA
Zero Current Detection and OPP Input Voltage V
ZCD
−0.3 to (V
CC
+ 1) V
Zero Current Detection and OPP Input Current I
ZCD
−2/+5 mA
Current Sense Input Voltage V
CS
−0.3 to 5 V
Current Sense Input Current I
CS
10 mA
Feedback Input Voltage V
FB
−0.3 to 9 V
Feedback Input Current I
FB
10 mA
Driver Maximum Voltage (Note 1) V
DRV
−0.3 to V
DRV(high)
V
Driver Maximum Current I
DRV(SRC)
I
DRV(SNK)
500
800
mA
Operating Junction Temperature T
J
−40 to 125 °C
Maxim Junction Temperature T
J(MAX)
150 °C
Storage Temperature Range T
STG
–60 to 150 °C
Thermal Resistance, Junction to Ambient 2 Oz Cu Printed Circuit Copper Clad With a
100 mm
2
copper heat spreader area
R
θ
JA
132 °C/W
ESD Capability
Human Body Model per JEDEC Standard JESD22−A114F (All pins except HV)
Human Body Model per JEDEC Standard JESD22−A114F (HV Pin)
Machine Model per JEDEC Standard JESD22−A115C
Charge Device Model per JEDEC Standard JESD22−C101E
Latch−Up Protection per JEDEC Standard JESD78
2000
1000
200
500
±100
V
V
V
V
mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Maximum driver voltage is limited by the driver clamp voltage, V
DRV(high)
, when V
CC
exceeds the driver clamp voltage. Otherwise, the
maximum driver voltage is V
CC
.
NCP1339
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6
ELECTRICAL CHARACTERISTICS (V
CC
= 12 V, V
HV
= 120 V, V
Fault
= open, V
FB
= 3 V, V
CS
= 0 V, V
ZCD
= 0 V, C
VCC
= 100 nF ,
C
DRV
= 1 nF, for typical values T
J
= 25°C, for min/max values, T
J
is – 40°C to 125°C, unless otherwise noted)
Characteristics
Conditions Symbol Min Typ Max Unit
STARTUP AND SUPPLY CIRCUITS
Supply Voltage
Startup Threshold
Minimum Operating Voltage
Operating Hysteresis
Transition from I
start1
to I
start2
dV/dt = 0.1 V/ms
V
CC
increasing
V
CC
decreasing
V
CC(on)
− V
CC(off)
V
CC
increasing, I
HV
= 650 mA
V
CC(on)
V
CC(off)
V
CC(inhibit)
14.0
8.0
5.6
0.55
15.0
9.0
1.00
16.0
10.0
1.20
V
Blanking Duration After V
CC(off)
V
CC
above V
CC(reset)
t
UVLO(blank)
2 15
ms
Startup Delay Delay from V
CC(on)
to QR Enable t
delay(start)
725
ms
Minimum voltage for current source
operation
VHV
min
30 60 V
Current flowing out of V
cc
V
cc
= 0 V IC1 −0.8 −0.5 −0.3 mA
Current flowing out of V
cc
pin V
cc
= V
cc(on)
– 0.5 V IC2 −15 −10 −6 mA
Off−state leakage current V
HV
= 500 V, V
cc
= 15 V, V
REM
= 0 V I
leak1
25.5
mA
HV pin leakage current when PSM is active V
HV
= 141 V I
leak2
11
mA
HV pin leakage current when PSM is active V
HV
= 325 V I
leak3
18
mA
V
cc
level during a fault V
CC(bias)
4.7 5.5 6.3 V
Supply Current
Before Startup, Fault or Latch
Flyback in Skip
switching at 70 kHz
V
CC
= V
CC(on)
– 0.5 V
V
FB
= 0.35 V
C
DRV
open
I
CC2
I
CC3
0.05
0.2
1.0
0.10
0.68
1.6
0.54
1.0
3.0
mA
V
CC
Overvoltage Protection Threshold V
CC(OVP)
27 28 29.5 V
V
CC
Overvoltage Protection Delay t
delay(VCC_OVP)
22.5 30.0 37.5
ms
INPUT FILTER DISCHARGE
X2 timer disable switch threshold voltage
V
th_X2
1.0 1.5 2.0 V
Hysteresis on the X2 pin V
th_X2_hyst
150 mV
X2 input clamp voltage V
_X2_clamp
4 V
X2 timer duration X2_timer 50 170 ms
X2 input leakage current V
X2
= 2.5 V I
_X2_leak
0.3
mA
Maximum discharge switch current V
CC
= 10V I
_X2_dis
7 10 14 mA
REMOTE INPUT – POWER SAVINGS MODE
Remote pin voltage below which PSM is
deactivated
V
REM
increasing V_REM_on 1 1.5 2 V
Remote pin voltage above which PSM is
activated
V
REM
decreasing V_REM_off 7.2 8 8.8 V
Remote input leakage current V_REM = 10 V I_REM_leak 20 1000 nA
Remote timer duration REM_timer 50 170 ms
Resistance of the Remote Pin Internal
pull−down Switch
R_SW_REM 1000 3000
W
BROWN OUT DETECTION
Brown−Out Start Level
HV pin voltage increasing V
BO(start)
90 101 110 V
System Shutdown Threshold HV pin voltage decreasing V
BO(stop)
84 93 104 V
Brown−out Detection Blanking Time V
HV
decreasing, delay from
V
BO(stop)
to drive disable
t
BO(stop)
30 100 ms
GATE DRIVE
Rise Time (10−90%)
V
DRV
from 10 to 90% t
DRV(rise)
40 80 ns

NCP1339HDR2G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Switching Controllers HIGH VOLTAGE QUASI R
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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