BUK9506-55B_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 23 July 2009 6 of 13
NXP Semiconductors
BUK9506-55B
N-channel TrenchMOS FET
6. Characteristics
Table 6. Characteristics
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source
breakdown voltage
I
D
=25A; V
GS
=0V; T
j
=-5C 50 - - V
I
D
=25A; V
GS
=0V; T
j
=2C 55 - - V
V
GS(th)
gate-source threshold
voltage
I
D
=1mA; V
DS
= V
GS
; T
j
=-5C;
see Figure 9 and 10
--2.3V
I
D
=1mA; V
DS
= V
GS
; T
j
=2C;
see Figure 9
and 10
1.1 1.5 2 V
I
D
=1mA; V
DS
= V
GS
; T
j
= 175 °C;
see Figure 9
and 10
0.5 - - V
I
DSS
drain leakage current V
DS
=55V; V
GS
=0V; T
j
= 25 °C - 0.02 1 µA
V
DS
=55V; V
GS
=0V; T
j
= 175 °C - - 500 µA
I
GSS
gate leakage current V
DS
=0V; V
GS
=15V; T
j
= 25 °C - 2 100 nA
V
DS
=0V; V
GS
=-15V; T
j
= 25 °C - 2 100 nA
R
DSon
drain-source on-state
resistance
V
GS
=4.5V; I
D
=25A; T
j
=2C;
see Figure 11 and 12
--6.4m
V
GS
=10V; I
D
=25A; T
j
=2C;
see Figure 11
and 12
-4.85.4m
V
GS
=5V; I
D
=25A; T
j
=17C;
see Figure 11 and 12
--12m
V
GS
=5V; I
D
=25A; T
j
=2C;
see Figure 11
and 12
-5.16m
Dynamic characteristics
Q
G(tot)
total gate charge I
D
=25A; V
DS
=44V; V
GS
=5V;
T
j
=2C; see Figure 14 and 15
-60-nC
Q
GS
gate-source charge - 11 - nC
Q
GD
gate-drain charge - 22 - nC
V
GS(pl)
gate-source plateau
voltage
I
D
=25A; V
DS
=44V; T
j
=2C;
see Figure 14 and 15
-2.4-V
C
iss
input capacitance V
GS
=0V; V
DS
=25V; f=1MHz;
T
j
=2C; see Figure 16
- 5674 7565 pF
C
oss
output capacitance - 755 906 pF
C
rss
reverse transfer
capacitance
- 255 350 pF
t
d(on)
turn-on delay time V
DS
=30V; R
L
=1.2; V
GS
=5V;
R
G(ext)
=10; T
j
=2C
-37-ns
t
r
rise time - 95 - ns
t
d(off)
turn-off delay time - 117 - ns
t
f
fall time - 106 - ns
L
D
internal drain
inductance
from drain lead 6 mm from package to
center of die; T
j
=2C
-4.5-nH
from contact screw on mounting base to
center of die; T
j
=2C
-3.5-nH
L
S
internal source
inductance
from source lead to source bonding pad;
T
j
=2C
-7.5-nH
BUK9506-55B_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 23 July 2009 7 of 13
NXP Semiconductors
BUK9506-55B
N-channel TrenchMOS FET
Source-drain diode
V
SD
source-drain voltage I
S
=25A; V
GS
=0V; T
j
=2C;
see Figure 13
- 0.85 1.2 V
t
rr
reverse recovery time I
S
=20A; dI
S
/dt = -100 A/µs; V
GS
=0V;
V
DS
=30V; T
j
=2C
-64-ns
Q
r
recovered charge - 79 - nC
Table 6. Characteristics
…continued
Symbol Parameter Conditions Min Typ Max Unit
Fig 5. Output characteristics: drain current as a
function of drain-source voltage; typical values
Fig 6. Drain-source on-state resistance as a function
of drain current; typical values
Fig 7. Forward transconductance as a function of
drain current; typical values
Fig 8. Transfer characteristics: drain current as a
function of gate-source voltage; typical values
03nj65
0
50
100
150
200
250
300
350
0246810
V
DS
(V)
I
D
(A)
3.8
3.6
3.4
3.2
3
2.8
2.6
2.4
10
6
4
4.2
5
V
GS
(V) is
03nj66
2
4
6
8
10
12
14
0 100 200 300 400
I
D
(A)
R
DSon
(mΩ)
V
GS
(V) is
3
3.2
10
5
4
3.4
03nj62
0
50
100
150
200
0 20406080
I
D
(A)
g
fs
(S)
03nj63
0
25
50
75
100
0123
V
GS
(V)
I
D
(A)
T
j
= 175
°
C
T
j
= 25
°
C
BUK9506-55B_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 23 July 2009 8 of 13
NXP Semiconductors
BUK9506-55B
N-channel TrenchMOS FET
Fig 9. Gate-source threshold voltage as a function of
junction temperature
Fig 10. Sub-threshold drain current as a function of
gate-source voltage
Fig 11. Drain-source on-state resistance as a function
of gate-source voltage; typical values
Fig 12. Normalized drain-source on-state resistance
factor as a function of junction temperature
60 180120060
03ng52
1.0
1.5
0.5
2.0
2.5
V
GS(th)
(V)
0
T
j
(°C)
min
typ
max
03ng53
V
GS
(V)
0321
10
4
10
5
10
2
10
3
10
1
I
D
(A)
10
6
min typ max
03nj64
4
5
6
7
3 7 11 15
V
GS
(V)
R
DSon
(mΩ)
03ne89
0
0.5
1
1.5
2
-60 0 60 120 180
T
j
(
°
C)
a

BUK9606-55B,118

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET HIGH PERF TRENCHMOS
Lifecycle:
New from this manufacturer.
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