LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 22 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
7. Limiting values
[1] The following applies to the limiting values:
a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to V
SS
unless
otherwise noted.
[2] Core and internal rail.
[3] External rail.
[4] On ADC related pins.
[5] Including voltage on outputs in 3-state mode.
[6] Only valid when the V
DD(3V3)
supply voltage is present.
[7] Not to exceed 4.6 V.
[8] Per supply pin.
[9] The peak current is limited to 25 times the corresponding maximum current.
[10] Per ground pin.
[11] Dependent on package type.
[12] Performed per AEC-Q100-002.
[13] Performed per AEC-Q100-003.
[14] Performed per AEC-Q100-011.
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Symbol Parameter Conditions Min Max Unit
V
DD(1V8)
supply voltage (1.8 V)
[2]
0.5 +2.5 V
V
DD(3V3)
supply voltage (3.3 V)
[3]
0.5 +4.6 V
V
DDA
analog 3.3 V pad supply voltage 0.5 +4.6 V
V
i(VBAT)
input voltage on pin VBAT for the RTC 0.5 +4.6 V
V
IA
analog input voltage
[4]
0.5 +5.1 V
V
I
input voltage 5 V tolerant I/O
pins
[5][6]
0.5 +6.0 V
other I/O pins
[5]
0.5 V
DD
+ 0.5
[7]
V
I
DD
supply current
[8]
- 100
[9]
mA
I
SS
ground current
[10]
- 100
[9]
mA
T
stg
storage temperature
[11]
65 +150 °C
P
tot(pack)
total power dissipation (per package) based on package
heat transfer, not
device power
consumption
- 1.5 W
V
ESD
electrostatic discharge voltage Human Body
Model (HBM)
4000 +4000 V
[12]
Machine Model
(MM)
200 +200 V
[13]
Charged Device
Model (CDM)
800 +800 V
[14]
LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 23 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
8. Static characteristics
Table 5. Static characteristics
T
amb
=
40
°
C to +85
°
C for commercial applications, unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit
V
DD(1V8)
supply voltage
(1.8 V)
[2]
1.65 1.8 1.95 V
V
DD(3V3)
supply voltage
(3.3 V)
[3]
2.6
[4]
3.3 3.6 V
V
DDA
analog 3.3 V pad
supply voltage
2.6
[5]
3.3 3.6 V
V
i(VBAT)
input voltage on pin
VBAT
2.0
[6]
3.3 3.6 V
Standard port pins,
RST, RTCK
I
IL
LOW-level input
current
V
I
= 0 V; no pull-up - - 3 µA
I
IH
HIGH-level input
current
V
I
=V
DD(3V3)
; no pull-down - - 3 µA
I
OZ
OFF-state output
current
V
O
=0V, V
O
=V
DD(3V3)
; no
pull-up/down
--3µA
I
latch
I/O latch-up current (0.5V
DD(3V3)
) < V
I
< (1.5V
DD(3V3)
);
T
j
< 125 °C
- - 100 mA
V
I
input voltage pin configured to provide a digital
function; V
DD(3V3)
and V
DDA
3.0 V
[7][8]
[9]
0 - 5.5 V
pin configured to provide a digital
function; V
DD(3V3)
and V
DDA
< 3.0 V
[7][8]
[9]
0V
DD(3V3)
V
V
O
output voltage output active 0 - V
DD(3V3)
V
V
IH
HIGH-level input
voltage
2.0 - - V
V
IL
LOW-level input
voltage
- - 0.8 V
V
hys
hysteresis voltage 0.4 - - V
V
OH
HIGH-level output
voltage
I
OH
= 4mA
[10]
V
DD(3V3)
0.4 - - V
V
OL
LOW-level output
voltage
I
OL
= 4mA
[10]
- - 0.4 V
I
OH
HIGH-level output
current
V
OH
=V
DD(3V3)
0.4 V
[10]
4--mA
I
OL
LOW-level output
current
V
OL
= 0.4 V
[10]
4--mA
I
OHS
HIGH-level
short-circuit output
current
V
OH
=0V
[11]
--45 mA
I
OLS
LOW-level
short-circuit output
current
V
OL
=V
DDA
[11]
- - 50 mA
I
pd
pull-down current V
I
=5V
[12]
10 50 150 µA
LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 24 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
I
pu
pull-up current V
I
=0V
[13]
15 50 85 µA
V
DD(3V3)
<V
I
<5V
[12]
000µA
I
DD(CORE)
core supply current Active mode;
code
while(1){}
executed from flash; all peripherals
enabled via PCONP register but not
configured to run; CCLK = 70 MHz
V
DD(1V8)
= 1.8 V; T
amb
=25°C - 41 70 mA
Power-down mode;
V
DD(1V8)
= 1.8 V; T
amb
=25°C - 2.5 25 µA
V
DD(1V8)
= 1.8 V; T
amb
=85°C - 35 105 µA
Deep power-down mode;
RTC off; SRAM off; T
amb
=25°C
V
i(VBAT)
= 3.3 V; V
DD(1V8)
= 1.8 V - 0.7 - µA
I
BAT
battery supply
current
Active mode; CCLK = 70 MHz;
PCLK = 17.5 MHz;
PCLK enabled to RTCK;
RTC clock = 32 kHz (from RTCX
pins); T
amb
=25°C
[14]
V
DD(1V8)
= 1.8 V; V
i(VBAT)
= 3.0 V - 10 15 µA
Power-down mode;
RTC clock = 32 kHz
(from RTCX pins); T
amb
=25°C
V
DD(1V8)
= 1.8 V; V
i(VBAT)
= 2.5 V - 7 12 µA
V
DD(1V8)
= 1.8 V; V
i(VBAT)
= 3.0 V - 8 12 µA
Deep power-down mode;
RTC off; SRAM off; T
amb
=25°C
V
DD(1V8)
= 1.8 V; V
i(VBAT)
= 3.0 V - 8 - µA
I
2
C-bus pins
V
IH
HIGH-level input
voltage
0.7V
DD(3V3)
--V
V
IL
LOW-level input
voltage
- - 0.3V
DD(3V3)
V
V
hys
hysteresis voltage - 0.5V
DD(3V3)
-V
V
OL
LOW-level output
voltage
I
OLS
=3mA
[10]
- - 0.4 V
I
LI
input leakage
current
V
I
=V
DD(3V3)
-24µA
V
I
=5V
[15]
-1022µA
Oscillator pins
V
i(XTAL1)
input voltage on pin
XTAL1
0 - 1.8 V
Table 5. Static characteristics
…continued
T
amb
=
40
°
C to +85
°
C for commercial applications, unless otherwise specified.
Symbol Parameter Conditions Min Typ
[1]
Max Unit

LPC2103FBD48,151

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 32KF/8KR/10BADC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union