LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 34 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
12. Abbreviations
Table 8. Acronym list
Acronym Description
ADC Analog-to-Digital Converter
AMBA Advanced Microcontroller Bus Architecture
APB Advanced Peripheral Bus
DCC Debug Communications Channel
DSP Digital Signal Processor
FIFO First In, First Out
FIQ Fast Interrupt reQuest
GPIO General Purpose Input/Output
IAP In-Application Programming
IRQ Interrupt Request
ISP In-System Programming
PLL Phase-Locked Loop
PWM Pulse Width Modulator
SPI Serial Peripheral Interface
SRAM Static Random Access Memory
SSI Synchronous Serial Interface
SSP Synchronous Serial Port
TTL Transistor-Transistor Logic
UART Universal Asynchronous Receiver/Transmitter
VIC Vectored Interrupt Controller
LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 35 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
13. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change
notice
Supersedes
LPC2101_02_03_4 20090602 Product data sheet LPC2101_02_03_3
Modifications:
Section 6.17.4 “Code security (Code Read Protection - CRP)”: added description of three
CRP levels (applicable to Revision A and higher).
Section 6.17.7 “Power control”: added description of Deep power-down mode (applicable to
Revision A and higher).
Section 10.1 “XTAL1 input” added.
Section 10.2 “XTAL and RTC Printed Circuit Board (PCB) layout guidelines” added.
Figure 6, Figure 7, Figure 8: added power consumption data for Deep power-down mode
(applicable to Revision A and higher).
Table 3: added table note 7.
Table 3: modified description of P0.14, RTCX1, RTCX2, XTAL1, XTAL2, JTAG, and DBGSEL
pins.
Table 4: modified value for V
DD(3V3)
.
Table 5: added and modified values for V
hys
.
Table 5: Voltage range for pins V
DD(3V3)
and V
DDA
extended to 2.6 V.
LPC2101_02_03_3 20081007 Product data sheet - LPC2101_02_03_2
Modifications:
Updated data sheet status to Product data sheet.
Table 1 and Table 2: added LPC2102FHN48 and LPC2103FHN48.
Table 1, Table 2, Table 3 and related figures: removed LPC2103FA44.
Table 3: updated pad descriptions.
Table 3: updated description of pin 47, SCL1.
Table 3: updated description of pins V
DDA
and V
DD(1V8)
.
Table 4: changed storage temperature range from 40 °C/125 °C to 65 °C/150 °C.
Table 5: added or modified values for I
DD(act)
, I
DD(pd)
, I
BATpd
, I
BATact
.
Table 5: removed “CCLK = 10 MHz” and associated values for I
DD(act)
.
Section 5: added Figure 3.
Section 11: added Figure 11.
LPC2101_02_03_2 20071218 Preliminary data sheet - LPC2101_02_03_1
LPC2101_02_03_1 20060118 Preliminary data sheet - -
LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 36 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL
http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at
http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I
2
C-bus — logo is a trademark of NXP B.V.
15. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Document status
[1][2]
Product status
[3]
Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.

LPC2103FBD48,151

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
ARM Microcontrollers - MCU ARM7 32KF/8KR/10BADC
Lifecycle:
New from this manufacturer.
Delivery:
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