LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 28 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
Test conditions: Deep power-down mode entered; RTC off; SRAM off; V
DD(3V3)
= 3.3 V;
V
DD(1V8)
= 1.8 V; V
i(BAT)
=V
DDA
= 3.3 V.
Fig 8. I/O supply current I
DD(IO)
measured at different temperatures
002aae682
Temperature (°C)
40 853510 6015
0.05
0.15
0.10
0.20
I
DD(IO)
(µA)
0
LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 29 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
9. Dynamic characteristics
[1] Parameters are valid over operating temperature range unless otherwise specified.
[2] Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
[3] Bus capacitance C
b
in pF, from 10 pF to 400 pF.
10. Application information
10.1 XTAL1 input
The input voltage to the on-chip oscillators is limited to 1.8 V. If the oscillator is driven by a
clock in slave mode, it is recommended that the input be coupled through a capacitor with
C
i
= 100 pF. To limit the input voltage to the specified range, choose an additional
capacitor to ground C
g
which attenuates the input voltage by a factor C
i
/(C
i
+C
g
). In slave
mode, a minimum of 200 mV (RMS) is needed. For more details see the
LPC2101/02/03
User manual UM10161
.
Table 7. Dynamic characteristics
T
amb
=0
°
Cto70
°
C for commercial applications,
40
°
C to +85
°
C for industrial applications, V
DD(1V8)
, V
DD(3V3)
over
specified ranges
[1]
.
Symbol Parameter Conditions Min Typ
[2]
Max Unit
External clock
f
osc
oscillator frequency 10 - 25 MHz
T
cy(clk)
clock cycle time 40 - 100 ns
t
CHCX
clock HIGH time T
cy(clk)
× 0.4 - - ns
t
CLCX
clock LOW time T
cy(clk)
× 0.4 - - ns
t
CLCH
clock rise time - - 5 ns
t
CHCL
clock fall time - - 5 ns
Port pins (except P0.2 and P0.3)
t
r(o)
output rise time - 10 - ns
t
f(o)
output fall time - 10 - ns
I
2
C-bus pins (P0.2 and P0.3)
t
f(o)
output fall time V
IH
to V
IL
20 + 0.1 × C
b
[3]
--ns
Fig 9. Slave mode operation of the on-chip oscillator
LPC2xxx
XTAL1
C
i
100 pF
C
g
002aae718
LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 30 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
10.2 XTAL and RTC Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
x1
and C
x2
, and C
x3
in
case of third overtone crystal usage, have a common ground plane. The external
components must also be connected to the ground plain. Loops must be made as small
as possible, in order to keep the noise coupled in via the PCB as small as possible. Also
parasitics should stay as small as possible. Values of C
x1
and C
x2
should be chosen
smaller accordingly to the increase in parasitics of the PCB layout.

LPC2102FHN48,551

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Microcontrollers - MCU ARM Microcontrollers - MCU 16K FL/4K RAM 8CH 10-B ADC
Lifecycle:
New from this manufacturer.
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