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LPC2102FHN48,551

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37
LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 31 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
11. Package outline
Fig 10. Package outline SOT313-2 (LQFP48)
UNIT
A
max.
A
1
A
2
A
3
b
p
cE
(1)
eH
E
LL
p
Zywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
1.6
0.20
0.05
1.45
1.35
0.25
0.27
0.17
0.18
0.12
7.1
6.9
0.5
9.15
8.85
0.95
0.55
7
0
o
o
0.12 0.10.21
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
0.75
0.45
SOT313-2 MS-026136E05
00-01-19
03-02-25
D
(1) (1)(1)
7.1
6.9
H
D
9.15
8.85
E
Z
0.95
0.55
D
b
p
e
E
B
12
D
H
b
p
E
H
v M
B
D
Z
D
A
Z
E
e
v M
A
1
48
37
36
25
24
13
θ
A
1
A
L
p
detail X
L
(A )
3
A
2
X
y
c
w M
w M
0 2.5 5 mm
scale
pin 1 index
LQFP48: plastic low profile quad flat package; 48 leads; body 7 x 7 x 1.4 mm
SOT313-2
LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 32 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
Fig 11. Package outline SOT619-7 (HVQFN48)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT619-7 - - -
MO-220
- - -
SOT619-7
05-10-24
05-10-25
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
mm
0.05
0.00
0.30
0.18
7.1
6.9
7.1
6.9
3.45
3.15
0.5
0.3
A
1
b
1
A
(1)
max
D
(1)
E
(1)
E
h
3.45
3.15
D
h
ee
1
L v
0.15.5
e
2
5.50.5
c
0.2
w
0.05
y
0.05
y
1
0.1
C
y
C
y
1
X
A
detail X
A
1
c
b
terminal 1
index area
D
h
E
h
L
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
v
M
Cw
M
13 24
48 37
36
25
12
1
terminal 1
index area
D
E
B
A
LPC2101_02_03_4 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 04 — 2 June 2009 33 of 37
NXP Semiconductors
LPC2101/02/03
Single-chip 16-bit/32-bit microcontrollers
Fig 12. Package outline SOT778-3 (HVQFN48)
terminal 1
index area
terminal 1
index area
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT778-3 - - -
- - -
- - -
SOT778-3
04-06-16
04-06-23
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included
DIMENSIONS (mm are the original dimensions)
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 x 6 x 0.85 mm
detail X
E
h
D
h
L
A
c
A
1
b
D
E
B
C
A
12
13 24
48 37
1
25
36
e
2
e
1
e
e
1/2 e
1/2 e
AC
B
v
M
Cw
M
y
C
y
1
X
0 2.5 5 mm
scale
UNIT
mm
0.05
0.00
0.25
0.15
6.1
5.9
6.1
5.9
3.95
3.65
0.5
0.3
A
1
b
1
A
(1)
max
D
(1)
E
(1)
E
h
3.95
3.65
D
h
ee
1
L v
0.14.4
e
2
4.40.4
c
0.2
w
0.05
y
0.05
y
1
0.1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37

LPC2102FHN48,551

Mfr. #:
Buy LPC2102FHN48,551
Manufacturer:
NXP Semiconductors
Description:
Microcontrollers - MCU ARM Microcontrollers - MCU 16K FL/4K RAM 8CH 10-B ADC
Lifecycle:
New from this manufacturer.
Delivery:
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