GP2AP002S00F
7
■Notes
●Before the circuit design
In circuit designing, make allowance for the degradation of the light emitting diode output that results from long
continuous operation. (50% degradation/5 years)
●Please take proper methods to prevent ESD. The IC built in GP2AP002S00F is ESD-sensitive because it is fabricated
by sub-micron CMOS process. For example, in handling GP2AP002S00F, human body and soldering iron etc. should
be grounded.
●As it takes at most 100ms to let GP2AP002S00F go to active operation from shut-down mode, please take this delay
into system design consideration. Also, if the host system relies on the actual value of this delay, e.g. to do frequent
software shutdown, please thoroughly make sure that the operation be successful in any realistic situation.
●Regarding to prevention of malfunction
To prevent GP2AP002S00F from faulty operation due to external light noise sources, do not set the detection surface
to these sources directly. Under very unlikely situation, GP2AP002S00F output may fall into malfunction
(See attached document 【1】1-10 for more detail). It can be reset by letting GP2AP002S00F go shutdown once,
and then activating GP2AP002S00F again. In case of this, take it into consideration, in software implementation, to
prepare a method to reset GP2AP002S00F. Also, if some other electronic components are placed close to this device,
faulty operation may occur. (The light reflection caused by the other components may slip into the photo-detecting
portion of the device and may cause faulty operation.)
●Directions for power-line connection
Avoid that GP2AP002S00F’s SDA/SCL terminals are pulled-up to the other power line than GP2AP002S00F’s Vio
terminal even if they are in the same operating voltage. See also 10) Recommended external circuit. For example,
when you shut down GP2AP002S00F by letting Vcc and Vio terminals go to GND level (instead of using software
shutdown function), and if GP2AP002S00F’s SDA/SCL terminals are still pulled-up to another active power line,
these terminals will draw significant currents from a pull-up resister through internal ESD devices and the SCL and
SDA lines are pulled-down, which causes system error (I
2
C bus error).
Also, when you consider reducing total current consumption of the I
2
C devices by turning off the power line(s), avoid
that one of the Vcc and Vio terminals of GP2AP002S00F is turned off and the other is kept on. It never shuts down
GP2AP002S00F’s current consumption, but possibly yields excessive current between these power lines.
Please consider making use of “software shutdown” function. However, when you do have to turn off one of these
power lines (Vcc, Vio, SDA/SCL pull-up level), all of them in GP2AP002S00F should be turned off for the purpose of
choking GP2AP002S00F’s current consumption regardless of the register setting for the software shutdown function.
●Directions for I
2
C-bus interface
GP2AP002S00F is equipped with a 7-bit address as a slave device on the I
2
C bus interface. Through the SDA and SCL
terminals, GP2AP002S00F’s registers can be set up, and also GP2AP002S00F’s sensing result can be read out.
However, the read format specified for GP2AP002S00F is a proprietary one that differs from the normal read format
(immediately after the first byte) or the combined format shown in the I
2
C-bus specification version 2.1, January 2000.
For more details to let GP2AP002S00F operate properly, see attached document【1】1-2, I
2
C-bus interface, and 【2】
recommended operation mode / register setting procedure.
●After being mounted and soldered, if GP2AP002S00F is deformed by external force or impact, e.g. something falls
onto the device, it may result in defective implementation such as lift-off of the terminals. Careful handling should be
taken.
●For soldering
Refer to the page 10
●For cleaning
Cleaning shall carry out as the below items to avoid keeping solvent, solder and flux on the device
(1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3 min or less
(2) Ultrasonic cleaning : Please don't carry out ultrasonic cleaning.
(3) The cleaning shall be carried out with solvent below.
Solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
