DALLAS SEMICONDUCTOR Preliminary
Quad T1/E1 Transceiver (5V)
Quad T1/E1 Transceiver (3.3V)
DS21Q552/DS21Q554
DS21Q352/DS21Q354
December 29, 1998
FEATURES
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• Four (4) Completely Independent T1 or E1 Transceivers
In One Small 27mm x 27mm Package
• Each Transceiver Contains a Short & Long Haul Line Interface
Plus a Full Featured Framer with Alarm Detection/Generation,
Elastic Stores, Hardware Based Signaling Support, Per DS0
Channel Control and HDLC Controller
• Each Multi-Chip Module (MCM) Contains Four Die of:
DS21352 (DS21Q352)
DS21552 (DS21Q552)
DS21354 (DS21Q354)
DS21554 (DS21Q554)
• Selection Guide:
Supply Device
T1 3.3V DS21Q352
T1 5V DS21Q552
E1 3.3V DS21Q354
E1 5V DS21Q554
• See the Specific DS21352/DS21552 and DS21354/DS21554
Data Sheets for Details on their Feature Set and Operation
• All Four T1 or E1 Transceivers Can be Concatenated into a Single
8.192MHz Backplane Data Stream
• IEEE 1149.1 JTAG-Boundary Scan Architecture
• DS21Q352/DS21Q552 and DS21Q354/DS21Q554 are Pin Compatible
to Allow the Same Footprint to Support T1 and E1 Applications
• 256–lead MCM BGA package (27mm X 27mm)
• Low Power 5V CMOS or Low Power 3.3V CMOS with 5V
Tolerant Input & Outputs
DESCRIPTION
The Quad T1 and E1 Transceiver MCMs offer a high density packaging arrangement for the
DS21352/DS21552 T1 Single-Chip Transceivers and the DS21354/DS21554 E1 Single-Chip Transceivers.
Four silicon die of one of these devices is packaged in a Multi-Chip Module (MCM) with the electrical
connections as shown in Figure 1. All of the functions available on the DS21352/DS21552 and
DS21354/DS21554 are also available in the MCM packaged version however in order to minimize package
size, some signals have been deleted. These differences are detailed in Table 1.
This data sheet describes the electrical connections and the mechanical dimensions only. Please see the
DS21352/DS21552 and DS21354/DS21554 data sheets for full details on all of the features and the
operating characteristics of the device.
