STHDLS101T Functional description
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Table 4. OE_N function
OE_N IN_Dx
OUT_Dx
(TMDS outputs)
Notes
De-asserted
(high level)
High-Z High-Z
Device disabled.
Low power state.
Internal bias currents are
disabled.
Asserted or
unconnected
(low level)
50 Ω termination Enabled
Level shifting mode
enabled.
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Maximum ratings STHDLS101T
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5 Maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 5. Absolute maximum ratings
Symbol Parameter Value Unit
V
CC
Supply voltage to ground potential -0.5 to +4.0 V
V
I
DC input voltage (TMDS and PCIe ports) -0.5 to +4.0 V
Control pins -0.5 to +4.0 V
SDA_SINK, SCL_SINK, HPD_SINK pins -0.5 to +6 V
I
O
DC output current 120 mA
P
D
Power dissipation 1 W
T
STG
Storage temperature -65 to +150 °C
T
L
Lead temperature (10 sec) 300 °C
V
ESD
Electrostatic discharge
voltage on IOs
(1)
1. In accordance with the MIL standard 883 method 3015
Human body model ±6 kV
Table 6. Thermal data
Symbol Parameter QFN-48 Unit
θ
JA
Junction-ambient thermal coefficient 48 °C/W
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STHDLS101T Maximum ratings
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5.1 Recommended operating conditions
5.1.1 Power supply and temperature range
5.1.2 Differential inputs (IN_D signals)
Table 7. Power supply and temperature range
Symbol Parameter Comments Min Typ Max Unit
V
CC33
3.3 V power supply 3.0 3.3 3.6 V
I
CC
Maximum power supply current
Total current from V
CC
3.3 V power supply
100 mA
T Operating temperature range -40 85
o
C
Table 8. Differential input characteristics for IN_D signals
Symbol Parameter Comments Min Typ Max Unit
Tbit Unit interval
Tbit is determined by the
display mode. Nominal bit
rate ranges from 250 Mbps
to 2.5 Gbps per lane.
Nominal Tbit at
2.5 Gbps = 400 ps. 360 ps =
400 ps – 10%
360 ps
V
RX-DIFFp-p
Differential input peak to peak voltage
V
RX-DIFFp-p
=2*|V
RX-D+
- V
RX-
D-
|. Applies to IN_D signals.
0.175 1.2 V
T
RX-EYE
Minimum eye width at IN_D input pair
The level shifter may add a
maximum of 0.02UI jitter
0.8 Tbit
V
CM-AC-pp
AC peak common mode input voltage
VCM-AC-pp=|VRX-D+ +
VRX-D-|/2 – VRX-CM-DC.
VRX-CM-DC=DC(avg) of
|VRX-D+ + VRX-D-|/2
VCM-AC-pp includes all
frequencies above 30 kHz.
100 mV
Z
RX-DC
DC single-ended input impedance
Applies to IN_D+ as well as
IN_D- pins (50 ± 20%
tolerance)
40 50 60 Ω
V
RX-Bias
RX input termination voltage
Intended to limit power-up
stress on chipset’s PCIE
output buffers
02V
Z
RX-HIGH-Z
Single-ended input resistance for
IN_Dx when inputs are in high-Z state
Differential inputs must be in
a high impedance state
100 KΩ
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STHDLS101TQTR

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
Interface - Specialized AC coupled HDMI level shifter
Lifecycle:
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