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BSC067N06LS3GATMA1

P1-P3P4-P6P7-P9P10-P10
Type
BSC067N06LS3 G
OptiMOS
TM
3 Power-Transistor
Features
• Ideal for high frequency switching and sync. rec.
• Optimized technology for DC/DC converters
• Excellent gate charge x R
DS(on)
product (FOM)
• Very low on-resistance R
DS(on)
• Superior thermal resistance
• N-channel, logic level
• 100% avalanche tested
• Pb-free plating; RoHS compliant
• Qualified according to JEDEC
1)
for target applications
• Halogen-free according to IEC61249-2-21
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Continuous drain current
I
D
V
GS
=10 V, T
C
=25 °C
50 A
V
GS
=10 V, T
C
=100 °C
50
V
GS
=4.5 V, T
C
=25 °C
50
V
GS
=4.5 V,
T
C
=100 °C
37
V
GS
=10 V, T
A
=25 °C,
R
thJA
=50 K/W
2)
15
Pulsed drain current
3)
I
D,pulse
T
C
=25 °C
200
Avalanche energy, single pulse
4)
E
AS
I
D
=50 A, R
GS
=25 W
47 mJ
Gate source voltage
V
GS
±20 V
4)
See figure 13 for more detailed information
Value
1)
J-STD20 and JESD22
3)
See figure 3 for more detailed information
2)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
V
DS
60
V
R
DS(on),max
mW
I
D
50
A
Product Summary
Type
BSC067N06LS3 G
Package
PG-TDSON-8
Marking
067N06LS
Rev. 2.4 page 1 2013-09-18
BSC067N06LS3 G
Maximum ratings, at T
j
=25 °C, unless otherwise specified
Parameter Symbol Conditions Unit
Power dissipation
P
tot
T
C
=25 °C
69 W
T
A
=25 °C,
R
thJA
=50 K/W
2)
2.5
Operating and storage temperature
T
j
, T
stg
-55 ... 150 °C
IEC climatic category; DIN IEC 68-1 55/150/56
Parameter Symbol Conditions Unit
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case
R
thJC
- - 1.8 K/W
Device on PCB
R
thJA
minimal footprint - - 62
6 cm
2
cooling area
2)
- - 50
Electrical characteristics, at T
j
=25 °C, unless otherwise specified
Static characteristics
Drain-source breakdown voltage
V
(BR)DSS
V
GS
=0 V, I
D
=1 mA
60 - - V
Gate threshold voltage
V
GS(th)
V
DS
=V
GS
, I
D
=35 µA
1.2 1.7 2.2
Zero gate voltage drain current
I
DSS
V
DS
=60 V, V
GS
=0 V,
T
j
=25 °C
- 0.1 1 µA
V
DS
=60 V, V
GS
=0 V,
T
j
=125 °C
- 10 100
Gate-source leakage current
I
GSS
V
GS
=20 V, V
DS
=0 V
- 10 100 nA
Drain-source on-state resistance
R
DS(on)
V
GS
=4.5 V, I
D
=25 A
- 8.0 12.1
mW
V
GS
=10 V, I
D
=50 A
- 5.4 6.7
Gate resistance
R
G
- 1.3 -
W
Transconductance
g
fs
|V
DS
|>2|I
D
|R
DS(on)max
,
I
D
=50 A
38 77 - S
Value
Values
Rev. 2.4 page 2 2013-09-18
BSC067N06LS3 G
Parameter Symbol Conditions Unit
min. typ. max.
Dynamic characteristics
Input capacitance
C
iss
- 3800 5100 pF
Output capacitance
C
oss
- 710 940
Reverse transfer capacitance
C
rss
- 32 -
Turn-on delay time
t
d(on)
- 15 - ns
Rise time
t
r
- 26 -
Turn-off delay time
t
d(off)
- 37 -
Fall time
t
f
- 7 -
Gate Charge Characteristics
5)
Gate to source charge
Q
gs
- 14 - nC
Gate charge at threshold
Q
g(th)
- 7 -
Gate to drain charge
Q
gd
- 5 -
Switching charge
Q
sw
- 12 -
Gate charge total
Q
g
- 23 30
Gate plateau voltage
V
plateau
- 3.6 - V
Gate charge total
Q
g
V
DD
=30 V, I
D
=50 A,
V
GS
=0 to 10 V
- 51 67 nC
Output charge
Q
oss
V
DD
=30 V, V
GS
=0 V
- 35 47
Reverse Diode
Diode continuous forward current
I
S
- - 50 A
Diode pulse current
I
S,pulse
- - 200
Diode forward voltage
V
SD
V
GS
=0 V, I
F
=50 A,
T
j
=25 °C
- 0.9 1.2 V
Reverse recovery time
t
rr
- 40 - ns
Reverse recovery charge
Q
rr
- 39 - nC
5)
See figure 16 for gate charge parameter definition
V
R
=30 V, I
F
=20A,
di
F
/dt=100 A/µs
T
C
=25 °C
Values
V
GS
=0 V, V
DS
=30 V,
f=1 MHz
V
DD
=30 V, V
GS
=10 V,
I
D
=20 A, R
G,ext
=2 W
V
DD
=30 V, I
D
=50 A,
V
GS
=0 to 4.5 V
Rev. 2.4 page 3 2013-09-18
P1-P3P4-P6P7-P9P10-P10

BSC067N06LS3GATMA1

Mfr. #:
Buy BSC067N06LS3GATMA1
Manufacturer:
Infineon Technologies
Description:
MOSFET N-Ch 60V 50A TDSON-8 OptiMOS 3
Lifecycle:
New from this manufacturer.
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