2004-2016 Microchip Technology Inc. DS20001889F-page 19
MCP111/112
Microchip Technology Drawing C04-060C Sheet 2 of 2
Number of Pins
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Molded Package Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E1
A2
e
L
E
N
0.65 BSC
0.10
0.15
0.80
0.00
-
0.20
1.25 BSC
-
-
2.10 BSC
MILLIMETERS
MIN
NOM
3
0.46
0.40
1.10
0.10
MAX
c
-0.20 0.26
Lead Thickness
3-Lead Plastic Small Outline Transistor (LB) [SC70]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Overall Length
Exposed Pad Length
D
D2
2.50
2.00 BSC
2.60 2.70
0.80 - 1.00
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.15mm per side.
2. Dimensioning and tolerancing per ASME Y14.5M
MCP111/112
DS20001889F-page 20 2004-2016 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Microchip Technology Drawing No. C04-2060B
3-Lead Plastic Small Outline Transistor (LB) [SC70]
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
CContact Pad Spacing
Contact Pitch
MILLIMETERS
0.65 BSC
MIN
E
MAX
2.20
Contact Pad Length
Contact Pad Width
Y
X
0.85
0.50
NOM
Distance Between Pads G 1.25
C
E
X
Y
G
SILK SCREEN
12
3
2004-2016 Microchip Technology Inc. DS20001889F-page 21
MCP111/112
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3-Lead Plastic Small Outline Transistor (MB) - [SOT-89]
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MCP112T-315E/LB

Mfr. #:
Manufacturer:
Microchip Technology
Description:
Supervisory Circuits 1uA Sup P-P Act Low
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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