2004-2016 Microchip Technology Inc. DS20001889F-page 27
MCP111/112
APPENDIX A: REVISION HISTORY
Revision F (July 2016)
The following is the list of modifications:
1. Updated Table 3-1.
2. Updated Section 5.0 “Packaging informa-
tion”.
3. Minor typographical corrections.
Revision E (January 2013)
• Added a note to each package outline drawing.
Revision D (June 2005)
1. Added SOT-89-3 package information
throughout.
Revision C (March 2005)
The following is the list of modifications:
1. Added Section 4.4 “Using in PIC® Microcon-
troller ICSP™ Applications (MCP111 only)”
on using the MCP111 in PIC microcontroller
ICSP applications.
2. Added V
ODH
specifications in Section 1.0
“Electrical Characteristics” (for ICSP
applications).
3. Added Figure 2-28.
4. Added devices features table to page 1.
5. Updated SC-70 package markings and added
Pb-free marking information to Section 5.0
“Packaging information”.
6. Added Appendix A: “Revision History”.
Revision B (August 2004)
1. Corrected package marking information in
Section 5.0 “Packaging information”.
Revision A (May 2004)
• Original release of this document.
