OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

ISL97522IRZ-TK

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
19
FN7445.0
December 13, 2006
6. The exposed die plate, on the underneath of the
package, should be soldered to an equivalent area of
metal on the PCB. This contact area should have multiple
via connections to the back of the PCB as well as
connections to intermediate PCB layers, if available, to
maximize thermal dissipation away from the IC.
7. To minimize the thermal resistance of the package when
soldered to a multi-layer PCB, the amount of copper track
and ground plane area connected to the exposed die
plate should be maximized and spread out as far as
possible from the IC. The bottom and top PCB areas
especially should be maximized to allow thermal
dissipation to the surrounding air.
8. A signal ground plane, separate from the power ground
plane and connected to the power ground pins only at the
exposed die plate, should be used for ground return
connections for feedback resistor networks (R
1
, R
11
,
R
41
) and the V
REF
capacitor, C
25
, the C
DELAY
capacitor
C
7
and the integrator capacitor C
30
, C
27
.
9. Minimize feedback input track lengths to avoid switching
noise pick-up.
ISL97522
20
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN7445.0
December 13, 2006
ISL97522
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L38.5x7B (One of 10 Packages in MDP0046)
38 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220)
SYMBOL
MILLIMETERS
NOTESMIN NOMINAL MAX
A 0.80 0.90 1.00 -
A1 0.00 0.02 0.05 -
D 5.00 BSC -
D2 3.50 REF -
E 7.00 BSC -
E2 5.50 REF -
L 0.35 0.40 0.45 -
b 0.23 0.25 0.27 -
c 0.20 REF -
e 0.50 BSC -
N 38 REF 4
ND 7 REF 6
NE 12 REF 5
Rev 0 5/06
NOTES:
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Tiebar view shown is a non-functional feature.
3. Bottom-side pin #1 I.D. is a diepad chamfer as shown.
4. N is the total number of terminals on the device.
5. NE is the number of terminals on the “E” side of the package
(or Y-direction).
6. ND is the number of terminals on the “D” side of the package
(or X-direction). ND = (N/2)-NE.
7. Inward end of terminal may be square or circular in shape with
radius (b/2) as shown.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

ISL97522IRZ-TK

Mfr. #:
Buy ISL97522IRZ-TK
Manufacturer:
Renesas / Intersil
Description:
LCD Drivers 4-CH TFT-LCD SUPPLY 5X7 38L 1K
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet