USB2250/50i/51/51i
DS00002005A-page 37 2009 - 2015 Microchip Technology Inc.
Note 9-5 Output leakage is measured with the current pins in high impedance.
Note 9-6 See The USB 2.0 Specification, Chapter 7, for USB DC electrical characteristics
Note 9-7 RBIAS is a 3.3 V tolerant analog pin.
Note 9-8 Output current range is controlled by program software, software disables FET during short circuit
condition.
9.4 Capacitance
T
A
= 25°C; fc = 1 MHz; V
DD
, V
DDP
= 1.8 V
9.5 Package Thermal Specification
Note 9-9 Thermal parameters are measured or estimated for devices with the exposed pad soldered to thermal
vias in a multilayer 2S2P PCB per JESD51. Thermal resistance is measured from the die to the
ambient air.
Supply Current Active
Full Speed
High Speed
I
CC
I
CC
110
135
140
165
mA
mA
V
DD33
= 3.3 V
Supply Current Suspend I
CSBY
350 750 AV
DD33
, V = 3.3 V
Industrial Temperature Suspend I
CSBYI
350 950 A
Parameter Symbol
Limits
Unit Test Condition
MIN TYP MAX
Clock Input Capacitance C
XTAL
2 pF All pins (except USB pins and
pins under test) are tied to AC
ground.
Input Capacitance C
IN
10 pF
Output Capacitance C
OUT
20 pF
TABLE 9-1: 128-PIN VTQFP PACKAGE THERMAL PARAMETERS
Parameter
Velocity
(meters/sec)
Symbol Value Unit
Thermal Resistance 0
JA
55
°C/W148
245
Junction-to-Top-of-Package 0
JT
18
°C/W118
218
Parameter Symbol MIN TYP MAX Units Comments
