6.42
19
High-Speed 3.3V 128/64K x 36 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges
IDT70V3599/89S
Functional Description
The IDT70V3599/89 provides a true synchronous Dual-Port Static
RAM interface. Registered inputs provide minimal set-up and hold times
on address, data, and all critical control inputs. All internal registers are
clocked on the rising edge of the clock signal, however, the self-timed
internal write pulse is independent of the LOW to HIGH transition of the clock
signal.
An asynchronous output enable is provided to ease asyn-
chronous bus interfacing. Counter enable inputs are also provided to stall
the operation of the address counters for fast interleaved
memory applications.
A HIGH on CE0 or a LOW on CE1 for one clock cycle will power down
the internal circuitry to reduce static power consumption. Multiple chip
enables allow easier banking of multiple IDT70V3599/89s for depth
expansion configurations. Two cycles are required with CE0 LOW and
CE1 HIGH to re-activate the outputs.
5617 drw 20
IDT70V3599/89
CE
0
CE
1
CE
1
CE
0
CE
0
CE
1
A
17
/A
16
(1)
CE
1
CE
0
V
DD
V
DD
IDT70V3599/89
IDT70V3599/89
IDT70V3599/89
Control Inputs
Control Inputs
Control Inputs
Control Inputs
BE,
R/W,
OE,
CLK,
ADS,
R EPEAT,
CNTEN
Depth and Width Expansion
The IDT70V3599/89 features dual chip enables (refer to Truth
Table I) in order to facilitate rapid and simple depth expansion with no
requirements for external logic. Figure 4 illustrates how to control the
various chip enables in order to expand two devices in depth.
The IDT70V3599/89 can also be used in applications requiring
expanded width, as indicated in Figure 4. Through combining the control
signals, the devices can be grouped as necessary to accommodate
applications needing 72-bits or wider.
Figure 4. Depth and Width Expansion with IDT70V3599/89
NOTE:
1. A
17 is for IDT70V3599, A16 is for IDT70V3589.
6.42
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High-Speed 3.3V 128/64K x 36 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges
IDT70V3599/89S
JTAG AC Electrical
Characteristics
(1,2,3,4)
70V3599/89
Symbol Parameter Min. Max. Units
t
JCYC
JTAG Clock Input Period 100
____
ns
t
JCH
JTAG Clock HIGH 40
____
ns
t
JCL
JTAG Clock Low 40
____
ns
t
JR
JTAG Clock Rise Time
____
3
(1)
ns
t
JF
JTAG Clock Fall Time
____
3
(1)
ns
t
JRST
JTAG Reset 50
____
ns
t
JRSR
JTAG Reset Recovery 50
____
ns
t
JCD
JTAG Data Output
____
25 ns
t
JDC
JTAG Data Output Hold 0
____
ns
t
JS
JTAG Setup 15
____
ns
t
JH
JTAG Hold 15
____
ns
5617 tbl 12
NOTES:
1. Guaranteed by design.
2. 30pF loading on external output signals.
3. Refer to AC Electrical Test Conditions stated earlier in this document.
4. JTAG operations occur at one speed (10MHz). The base device may run at
any speed specified in this datasheet.
JTAG Timing Specifications
TCK
Device Inputs
(1)
/
TDI/TMS
Device Outputs
(2)
/
TDO
TRST
t
JCD
t
JDC
t
JRST
t
JS
t
JH
t
JCYC
t
JRSR
t
JF
t
JCL
t
JR
t
JCH
5617 drw 21
,
Figure 5. Standard JTAG Timing
NOTES:
1. Device inputs = All device inputs except TDI, TMS, and TRST.
2. Device outputs = All device outputs except TDO.
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21
High-Speed 3.3V 128/64K x 36 Dual-Port Synchronous Static RAM Industrial and Commercial Temperature Ranges
IDT70V3599/89S
Identification Register Definitions
Instruction Field Value Description
Revision Number (31:28) 0x0 Reserved for version number
IDT Device ID (27:12)
0x0312
(1)
Defines IDT part number
IDT JEDEC ID (11:1) 0x33 Allows unique identification of device vendor as IDT
ID Register Indicator Bit (Bit 0) 1 Indicates the presence of an ID register
5617 tbl 13
NOTE:
1. Device ID for IDT70V3589 is 0x0313.
Scan Register Sizes
Register Name Bit Size
Instruction (IR) 4
Bypass (BYR) 1
Identification (IDR) 32
Boundary Scan (BSR) Note (3)
5617 tbl 14
System Interface Parameters
Instruction Code Description
EXTEST 0000 Forces contents of the boundary scan cells onto the device outputs
(1)
.
Places the boundary scan register (BSR) between TDI and TDO.
BYPASS 1111 Places the bypass registe r (BYR) between TDI and TDO.
IDCODE 0010 Loads the ID register (IDR) with the vendor ID code and places the
register between TDI and TDO.
HIGHZ
0011 Places the bypass register (BYR) between TDI and TDO. Forces all
device output drivers to a High-Z state.
SAMPLE/PRELOAD 0001 Places the boundary scan register (BSR) between TDI and TDO.
SAMPLE allows data from device inputs
(2)
to be captured in the
boundary scan cells and shifted serially through TDO. PRELOAD allows
data to be input serially into the boundary scan cells via the TDI.
RESERVED All other codes Several combinations are reserved. Do not use codes other than those
identified above.
5617 tbl 15
NOTES:
1. Device outputs = All device outputs except TDO.
2. Device inputs = All device inputs except TDI, TMS, and TRST.
3. The Boundary Scan Descriptive Language (BSDL) file for this device is available on the IDT website (www.idt.com), or by contacting your local
IDT sales representative.

70V3599S166BFG8

Mfr. #:
Manufacturer:
IDT
Description:
SRAM 128Kx36 STD-PWR 3.3V SYNC DUAL-PORT RAM
Lifecycle:
New from this manufacturer.
Delivery:
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Payment:
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