ZSSC3131BA2T Datasheet ZSSC3131BA2R, ZSSC3131BE2T, ZSSC3131BE2R | P19-P21

ZSSC3131

Datasheet

January 25, 2016

5 ESD Protection

All pins have an ESD protection of >2000V according to the Human Body Model (HBM). The pins VDDE, VSSE

and AOUT have an additional ESD protection of >4000V (HBM).

ESD protection is tested with devices in SSOP14 packages during product qualification. The ESD test follows the

Human Body Model with 1.5kOhm/100pF based on MIL 883, Method 3015.7.

6 Quality and Reliability

The ZSSC3131 is qualified according to the AEC-Q100 standard, operating temperature grade 0.

A fit rate <5fit (T=55°C, S=60%) is guaranteed. A typical fit rate of the semiconductor technology used is 2.5fit.

7 Customization

For high-volume applications that require an upgraded or downgraded functionality compared to the ZSSC3131,

IDT can customize the circuit design by adding or removing certain functional blocks.

Please contact IDT for further information.

ZSSC3131

Datasheet

January 25, 2016

8 Ordering Information

Product Sales Code Description Package

ZSSC3131BA2T

ZSSC3131 SSOP14 – temperature range -40 to +125°C Tube

ZSSC3131BA2R

ZSSC3131 SSOP14 – temperature range -40 to +125°C Reel

ZSSC3131BA1B

ZSSC3131 die – temperature range -40 to +125°C Tested dice on unsawn

wafer

ZSSC3131BA1C

ZSSC3131 die – temperature range -40 to +125°C Tested dice on frame

ZSSC3131BE2T

ZSSC3131 SSOP14 – temperature range -40 to +150°C Tube

ZSSC3131BE2R

ZSSC3131 SSOP14 – temperature range -40 to +150°C Reel

ZSSC3131BE1B

ZSSC3131 die – temperature range -40 to +150°C

Tested dice on unsawn wafer

ZSSC3131BE1C

ZSSC3131 die – temperature range -40 to +150°C Tested dice on frame

ZSSC313xKITV1.1

ZSSC313x Evaluation Kit, revision 1.1

, including Evaluation Board,

ZSSC3131 IC samples, USB cable (software can be downloaded

from the product page www.IDT.com/ZSSC3131)

Kit

ZSSC313x Mass

Calibration System V1.1

Modular Mass Calibration System (MSC) for ZSSC313x including

MCS boards, cable, connectors (software can be downloaded from

the product page www.IDT.com/ZSSC3131)

Kit

ZSSC3131

Datasheet

January 25, 2016

9 Related Documents

Document

ZSSC3131 Feature Sheet

ZSSC313x Functional Description

ZSSC313x Evaluation Kit Description

ZSSC313x Application Notes—Automotive Sensor

Switch

ZSSC313x Tech Note—EMC Design Guidelines*

ZSSC313x Tech Note—High Voltage Protection*

ZSSC313x Tech Note Die and Package

Dimensions**

IDT Wafer Dicing Guidelines

ZSSC313x Temperature Profile Calculation

Spread Sheet

ZSSC313x Bandwidth Calculation Spread Sheet**

Visit the ZSSC3131 product page (www.IDT.com/ZSSC3131) or contact your nearest sales office for the latest

version of these documents.

* Documents marked with an asterisk (*) require a login account for access on the web..

** Documents marked with a double asterisk (**) are available only on request.

10 Glossary

Term Description

ADC Analog-to-Digital Converter

AEC Automotive Electronics Council

AFE Analog Front-end

AOUT Analog Output

BAMP Buffer Amplifier

BR Bridge Sensor Signal

CM Command Mode

CMC Calibration Microcontroller

CMOS Complementary Metal Oxide Semiconductor

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P18 P19-P21 P22-P23

ZSSC3131BA2T

Mfr. #:

Buy ZSSC3131BA2T

Manufacturer:

IDT

Description:

Sensor Interface Sensor Signal Conditoner

Lifecycle:

New from this manufacturer.

Delivery:

DHL FedEx Ups TNT EMS

Payment:

T/T Paypal Visa MoneyGram Western Union

ZSSC3131BA2T

ZSSC3131BA2T

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