ZSSC3131
© 2016 Integrated Device Technology, Inc.
1.4. Interface Characteristics and EEPROM
Table 1.4 Interface Characteristics and EEPROM
No. Parameter Symbol Conditions Min Typ Max Unit
1.4.1. I²C
Interface
(Refer to the ZSSC313x Functional Description for timing details)
1.4.1.1 I²C™ voltage level HIGH V
I²C,HIGH
0.8 VDDA
1.4.1.2 I²C™ voltage level LOW
1)
V
I²C,LOW
0.2 VDDA
1.4.1.3 Slave output level LOW
1)
V
I²C,LOW_OUT
Open drain, I
OL
<2mA 0.15 VDDA
1.4.1.4 SDA load capacitance
C
SDA
400 pF
1.4.1.5 SCL clock frequency
1)
f
I²C
f
OSC
≥2MHz 400 kHz
1.4.1.6 Internal pull-up resistor
1)
R
I²C,PULLUPI
25 100
kΩ
1.4.2. ZACwire™ One-Wire Interface (OWI)
(Refer to the ZSSC313x Functional Description for timing details)
1.4.2.1 OWI voltage level HIGH
1)
V
OWI,HIGH
0.75 VDDA
1.4.2.2 OWI voltage level LOW
1)
V
OWI,LOW
0.2 VDDA
1.4.2.3 Slave output level LOW
1)
V
OWI,LOW_OUT
Open drain, I
OL
<2mA 0.15 VDDA
1.4.2.4 Start window
t
OWI,STARTWIN
At f
OSC
=3MHz 96 175 455 ms
1.4.3. EEPROM
1.4.3.1 Ambient temperature for
EEPROM programming
1)
T
AMB_EEP
-40 150
°C
1.4.3.2 Write cycles
n
EEP_WRI
Write <= 85°C 100 000
Write up to 150°C 100
1.4.3.3 Read cycles
1) 2)
n
EEP_READ
≤175°C 8 * 10
8
1.4.3.4 Data retention
1) 3)
t
EEP_RETENTION
1300h at 175°C
( = 3000h at 150°C
+ 27000h at 125°C
+ 100000h at 55°C )
15 a
1.4.3.5 Programming time
1)
t
EEP_WRI
Per written word 12 ms
1) No measurement in mass production, parameter is guaranteed by design and/or quality observation.
2) Valid for the dice. Note that the package and the temperature version cause additional restrictions.
3) Over lifetime and valid for the dice. Use the calculation sheet ZSSC313x Temperature Profile Calculation Sheet for temperature stress calculation.
Note that the package and the temperature version cause additional restrictions.
