WeEn Semiconductors
BTA201W-800E
3Q Hi-Com triac
BTA201W-800E All information provided in this document is subject to legal disclaimers.
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WeEn Semiconductors Co., Ltd. 2016. All rights reserved
Product data sheet 15 June 2016 6 / 16
8. Thermal characteristics
Table 5. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-sp)
thermal resistance
from junction to solder
point
full and half cycle; Fig. 6 - - 15 K/W
in free air; printed circuit board
mounted; minimum footprint; Fig. 7
- 156 - K/WR
th(j-a)
thermal resistance
from junction to
ambient free air
in free air; printed circuit board
mounted; pad area; Fig. 8
- 70 - K/W
003aak513
1
10
-1
10
10
2
Z
th(j-sp)
(K/W)
10
-2
t
p
(s)
10
-5
1 1010
-1
10
-2
10
-4
10
-3
(1) Unidirectional (half cycle)
(2) Bidirectional (full cycle)
Fig. 6. Transient thermal impedance from junction to solder point as a function of pulse width