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NCN5110MNTWG

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24
NCN5110
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22
Communication Interface
The NCN5110 communication pins (TxD and RxD) are
connected immediately to the KNX transmitter/receiver. Bit
level coding/decoding has to be done by the host controller.
Keep in mind that the signals on the RXD− and TXD−pin are
inverted. Figure 9 gives an application example.
Figure 16. Bus Communication and the Corresponding Voltage Levels on RxD and TxD
DC Level
V
BUS
t
35 ms 69 ms
Active Pulse Equalization Pulse
V
eq
V
act
V
end
t
TXD/RXD
3.3V
NCN5110
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23
PACKAGE THERMAL CHARACTERISTICS
The NCN5110 is available in a QFN40 package. For cooling optimizations, the QFN40 has an exposed thermal pad which
has to be soldered to the PCB ground plane. The ground plane needs thermal vias to conduct the heat to the bottom layer.
Figure 17 gives an example of good heat transfer. The exposed thermal pad is soldered directly on the top ground layer (left
picture of Figure 17). It‘s advised to make the top ground layer as large as possible (see arrows Figure 17). To improve the heat
transfer even more, the exposed thermal pad is connected to a bottom ground layer by using thermal vias (see right picture of
Figure 17). It‘s advised to make this bottom ground layer as large as possible and with as less as possible interruptions.
For precise thermal cooling calculations the major thermal resistances of the device are given (Table 4). The thermal media
to which the power of the devices has to be given are:
− Static environmental air (via the case)
− PCB board copper area (via the exposed pad)
The major thermal resistances of the device are the Rth from the junction to the ambient (Rth
ja
) and the overall Rth from
the junction to exposed pad (Rth
jp
). In Table 4 one can find the values for the Rth
ja
and Rth
jp
, simulated according to JESD−51.
The Rth
ja
for 2S2P is simulated conform JEDEC JESD−51 as follows:
− A 4−layer printed circuit board with inner power planes and outer (top and bottom) signal layers is used
− Board thickness is 1.46 mm (FR4 PCB material)
− The 2 signal layers: 70 mm thick copper with an area of 5500 mm
2
copper and 20% conductivity
− The 2 power internal planes: 36 mm thick copper with an area of 5500 mm
2
copper and 90% conductivity
The Rth
ja
for 1S0P is simulated conform to JEDEC JESD−51 as follows:
− A 1−layer printed circuit board with only 1 layer
− Board thickness is 1.46 mm (FR4 PCB material)
− The layer has a thickness of 70 mm copper with an area of 5500 mm
2
copper and 20% conductivity
Figure 17. PCB Ground Plane Layout Condition (left picture displays the top ground layer, right picture displays
the bottom ground layer)
ORDERING INFORMATION
Device Number Temperature Range Package Shipping
†
NCN5110MNG −40°C to 105°C QFN−40
(Pb−Free)
50 Units / Tube
100 Tubes / Box
NCN5110MNTWG −40°C to 105°C QFN−40
(Pb−Free)
3000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
NCN5110
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24
PACKAGE DIMENSIONS
QFN40 6x6, 0.5P
CASE 485AU
ISSUE O
SEATING
NOTE 4
K
0.15 C
(A3)
A
A1
D2
b
1
11
20
21
40
E2
40X
10
30
L
BOTTOM VIEW
TOP VIEW
SIDE VIEW
D
A B
E
0.15
C
PIN ONE
LOCATION
0.10 C
0.08 C
C
31
e
A0.10 B
C
0.05
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.18 0.30
D 6.00 BSC
D2 3.10 3.30
E 6.00 BSC
3.30E2 3.10
e 0.50 BSC
L 0.30 0.50
K
PLANE
DIMENSIONS: MILLIMETERS
0.50 PITCH
3.32
0.28
3.32
40X
0.63
40X
6.30
6.30
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
1
L1
DETAIL A
L
OPTIONAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
OPTIONAL
CONSTRUCTIONS
DETAIL B
DETAIL A
0.20 MIN
L1 −−− 0.15
A0.10 BC
A0.10 BC
PACKAGE
OUTLINE
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P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NCN5110/D
KNX and the KNX Logos are trademarks of KNX Association.
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative
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P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24

NCN5110MNTWG

Mfr. #:
Buy NCN5110MNTWG
Manufacturer:
ON Semiconductor
Description:
Communication ICs - Various KNXB ANALOG
Lifecycle:
New from this manufacturer.
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