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LTC2862AIS8-2#PBF

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P22
LTC2862A
19
2862af
For more information www.linear.com/LTC2862A
Failsafe O Application (Idle State = Logic O)
±60V 20Mbps Level Shifter/Isolator
DI
GND
V
CC
V
CC1
LTC2862A-1
V
CC2
R2
±60V
R1
A
B
R1 = 200k 1%. PLACE R1 RESISTORS NEAR A AND B PINS OF RECEIVER.
R2 = 10k
C = 47pF, 5%, 50 WVDC. MAY BE OMITTED FOR DATA RATES < 100kbps.
DATA IN 1 DATA OUT 1
V
CC
RO
LTC2862A-1
GND
C
A
B
2862A TA03
R1
C
D R
PROFIBUS Compatible Line Interface
Typical applicaTions
RO
RE
DE
DI
8.2Ω
2862A TA02
A*
R
B*
* THE POLARITY OF A AND B IN THIS DATA SHEET IS OPPOSITE THE POLARITY DEFINED BY PROFIBUS.
V
CC
(4.75V TO 5.25V)
GND
LTC2862A
8.2Ω
390Ω
4V
P-P
≤ V
OD
≤ 7V
P-P
UP TO 1500kbps
220Ω
390Ω
B WIRE
A WIRE
B WIRE
A WIRE
V
CC
390Ω
220Ω
390Ω
V
CC
100m
5.5Ω/WIRE
V
OD
D
2862A TA04
RO
DE
DI
RO
DE
DI
B
R
I1
5V
A
“A”
“B”
GND
V
CC
LTC2862A
DI2
LTC2862A
20
2862af
For more information www.linear.com/LTC2862A
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698 Rev C)
packaGe DescripTion
Please refer to http://www.linear.com/product/LTC2862A#packaging for the most recent package drawings.
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.125
TYP
2.38 ±0.10
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 0509 REV C
0.25 ± 0.05
2.38 ±0.05
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
1.65 ±0.05
(2 SIDES)2.10 ±0.05
0.50
BSC
0.70 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
LTC2862A
21
2862af
For more information www.linear.com/LTC2862A
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
packaGe DescripTion
.016 – .050
(0.406 – 1.270)
.010 – .020
(0.254 – 0.508)
× 45°
0°– 8° TYP
.008 – .010
(0.203 – 0.254)
SO8 REV G 0212
.053 – .069
(1.346 – 1.752)
.014 – .019
(0.355 – 0.483)
TYP
.004 – .010
(0.101 – 0.254)
.050
(1.270)
BSC
1
2
3
4
.150 – .157
(3.810 – 3.988)
NOTE 3
8
7
6
5
.189 – .197
(4.801 – 5.004)
NOTE 3
.228 – .244
(5.791 – 6.197)
.245
MIN
.160 ±.005
RECOMMENDED SOLDER PAD LAYOUT
.045 ±.005
.050 BSC
.030 ±.005
TYP
INCHES
(MILLIMETERS)
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
4. PIN 1 CAN BE BEVEL EDGE OR A DIMPLE
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)
Please refer to http://www.linear.com/product/LTC2862A#packaging for the most recent package drawings.
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LTC2862AIS8-2#PBF

Mfr. #:
Buy LTC2862AIS8-2#PBF
Manufacturer:
Analog Devices Inc.
Description:
RS-422/RS-485 Interface IC 250kbps 60V Fault Protected RS485 Transceiver (Half Duplex + Enables)
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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