Data Sheet ADN2882
5-PIN TO-46 ASSEMBLY RECOMMENDATIONS
Contact sales for more details.
04946-003
C
PD
C
B
VPD
VCC
OUTB
OUT
Figure 18. 5-Pin TO-46 with External Photodiode Supply VPD
ADN2882
PD
C
B
C
PD
04946-031
Figure 19. Side View of the Assembly
0.85V20pF
50200 50
V
CC
C
B
C
PD
FILTER
IN
VCC
GND GND CAP
OUTB
OUT
RSSI
V
PD
B.W B.W.
B.W. B.W.
B.W.
B.W.
B.W. B.W.
B.W.
B.W.
04946-027
Figure 20. Equivalent Circuit of Assembly Including Bond Wires
Table 4. Bill of Materials (BOM)
Component
Description
PD 1× vendor specific, 4.25 Gbps, photodiode
TIA ADN2882 (0.7 mm × 1.2 mm), 4.25 Gbps,
transimpedance amplifier
C
B
1× 200 pF, RF single-layer capacitor
C
PD
1× 560 pF, RF single-layer capacitor
Notes
One mil thickness gold wire, ball bond recommended.
Minimize all GND bond-wire lengths.
Minimize IN, FILTER, OUT, and OUTB bond-wire lengths.
Maintain symmetry in length and orientation between OUT
and OUTB bond wires.
Maintain symmetry between IN/FILTER and OUT/OUTB
bond wires.
Rev. A | Page 9 of 12
ADN2882 Data Sheet
04946-023
C
B
VCC
OUTB
OUT
S
C
RSSI
Figure 21. 5-Pin TO-46 with Internal PD Biasing and RSSI Output
ADN2882
PD
C
B
S
C
04946-032
Figure 22. Side View of the Assembly
0.85V20pF
50200 50
V
CC
C
B
FILTER
IN
VCCVCCFILTER
GND GND CAP
OUTB
OUT
RSSI
04946-028
B.W.B.W.
B.W.
B.W.
B.W.
B.W. B.W.
B.W.
B.W.
B.W.
Figure 23. Equivalent Circuit of the Assembly Including Bond Wires
Table 5. Bill of Materials (BOM)
Component Description
PD 1× vendor specific, 4.25 Gbps, photodiode
TIA ADN2882 (0.7 mm × 1.2 mm), 4.25 Gbps,
transimpedance amplifier
C
B
1× 200 pF, RF single-layer capacitor
S
C
1× ceramic standoff or 1× optional capacitor
Notes
One mil thickness gold wire, ball bond recommended.
Minimize all GND bond-wire lengths.
Minimize IN, FILTER, OUT, and OUTB bond-wire lengths.
Maintain symmetry in length and orientation between OUT
and OUTB bond wires.
Maintain symmetry between IN/FILTER and OUT/OUTB
bond wires.
Rev. A | Page 10 of 12
Data Sheet ADN2882
Rev. A | Page 11 of 12
4-PIN TO-46 ASSEMBLY RECOMMENDATIONS
Contact sales for more details.
S
C
C
B
VCC
OUTOUTB
04946-004
Figure 24. 4-Pin TO-46 with Internal PD Biasing
ADN2882
PD
S
C
04946-030
TO CAN HEADER
C
B
Figure 25. Side View of the Assembly
0.85V20pF
50200 50
FILTER
IN
VCC
GND GND CAP
OUTB
OUT
RSSI
04946-029
V
CC
C
B
VCCFILTER
B.W.
B.W.
B.W.
B.W.
B.W.
B.W. B.W.
B.W.
B.W.
Figure 26. Equivalent Circuit of Assembly Including Bond Wires
Table 6. Bill of Materials (BOM)
Component Description
PD 1× vendor specific, 4.25 Gbps, photodiode
TIA
ADN2882 (0.7 mm × 1.2 mm), 4.25 Gbps,
transimpedance amplifier
C
B
1× 200 pF, RF single-layer capacitor
S
C
1× ceramic standoff or 1× optional capacitor
Notes
One mil thickness gold wire, ball bond recommended.
Minimize all GND bond-wire lengths.
Minimize IN, FILTER, OUT, and OUTB bond-wire lengths.
Maintain symmetry in length and orientation between OUT
and OUTB bond wires.
Maintain symmetry between IN/FILTER and OUT/OUTB
bond wires.

ADN2882A-DF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Transimpedance Amplifiers 4.25Gbps Transimpedance Amplifier IC.
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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