ADN2882 Data Sheet
Rev. A | Page 12 of 12
OUTLINE DIMENSIONS
1.20
0.70
1
2
3
4
5 6 7 8 10
13151617
9
14
11
12
TOP VIEW
SIDE VIEW
0.25
Figure 27. 17-Pad Bare Die Sales [CHIP]
C-17-1
Dimensions shown in millimeters
Table 7. Pad Coordinates
Pad No. Mnemonic X (μm) Y (μm)
1 GND −500 +260
2 IN −500 +130
3 TEST −500 +10
4 FILTER −500 −120
5 FILTER −500 −260
6 GND −350 −260
7 RSSI −200 −260
8 CAP −50 −260
9 GND +130 −260
10 GND +500 −260
11 OUTB +350 −60
12 OUT +350 +60
13 GND +500 +260
14 GND +130 +260
15 VCCFILTER −50 +260
16 VCC −200 +260
17 VCC −350 +260
DIE INFORMATION
Die Size
0.7 mm × 1.2 mm (edge to edge, including 1 mil scribe)
Die Thickness
10 mils = 0.25 mm
Passivation Openings
0.075 mm × 0.075 mm (Pad 1 to 8, 10, 13, and Pad 15 to 17)
0.144 mm × 0.075 mm (Pad 9, 11, 12, and Pad 14)
Passivation Composition
5000 Å Si3N4 (top)
5000 Å SiO2 (bottom)
Pad Composition
Al/1%Cu
Substrate Contact
To ground
ORDERING GUIDE
Model Temperature MOQ Description
1
Package Option
ADN2882ACHIPS −40°C to +95°C
200
17-Pad Die Sales C-17-1
ADN2882A-DF −40°C to +95°C 5,704 Reconstituted die on 8” metal film frame
1
Contact Analog Devices, Inc., sales for more information on the film frame ADM2882A-DF.
©2005–2014 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04946-0-9/14(A)
