CY7C026A
Document Number: 38-06046 Rev. *J Page 10 of 24
Capacitance
Parameter
[7]
Description Test Conditions Max Unit
C
IN
Input capacitance T
A
= 25 °C, f = 1 MHz, V
CC
= 5.0 V 10 pF
C
OUT
Output capacitance 10 pF
AC Test Loads and Waveforms
Figure 2. AC Test Loads and Waveforms
0.00
0.1 0
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
10 15 20 25 30 35
Note
7. Tested initially and after any design or process changes that may affect these parameters.
CY7C026A
Document Number: 38-06046 Rev. *J Page 11 of 24
Data Retention Mode
The CY7C026A is designed with battery backup in mind. Data
retention voltage and supply current are guaranteed over
temperature. The following rules ensure data retention:
1. Chip Enable (CE
) must be held HIGH during data retention,
within V
CC
to V
CC
– 0.2 V.
2. CE must be kept between V
CC
– 0.2 V and 70% of V
CC
during
the power up and power down transitions.
3. The RAM can begin operation > t
RC
after V
CC
reaches the
minimum operating voltage (4.5 V).
Timing
Parameter Test Conditions
[8]
Max Unit
ICC
DR1
At VCC
DR
= 2 V 1.5 mA
Data Retention Mode
4.5 V
4.5 V
V
CC
2.0 V
V
CC
to V
CC
0.2 V
V
CC
CE
t
RC
V
IH
Note
8. CE
= V
CC
, V
in
= GND to V
CC
, T
A
= 25 C. This parameter is guaranteed but not tested.
CY7C026A
Document Number: 38-06046 Rev. *J Page 12 of 24
Switching Characteristics
Over the Operating Range
Parameter
[9]
Description
CY7C026A
Unit-15 -20
Min Max Min Max
Read Cycle
t
RC
Read cycle time 15 20 ns
t
AA
Address to data valid 15 20 ns
t
OHA
Output hold from address change 3 3 ns
t
ACE
[10]
CE LOW to data valid 15 20 ns
t
DOE
OE LOW to data valid 10 12 ns
t
LZOE
[11, 12, 13]
OE LOW to Low Z 3 3 ns
t
HZOE
[11, 12, 13]
OE HIGH to High Z 10 12 ns
t
LZCE
[11, 12, 13]
CE LOW to Low Z 3 3 ns
t
HZCE
[11, 12, 13]
CE HIGH to High Z 10 12 ns
t
PU
[13]
CE LOW to Power-up 0 0 ns
t
PD
[13]
CE HIGH to Power-down 15 20 ns
t
ABE
[10]
Byte enable access time 15 20 ns
Write Cycle
t
WC
Write cycle time 15 20 ns
t
SCE
[10]
CE LOW to write end 12 15 ns
t
AW
Address valid to write end 12 15 ns
t
HA
Address hold From write end 0 0 ns
t
SA
[10]
Address setup to write start 0 0 ns
t
PWE
Write pulse width 12 15 ns
t
SD
Data setup to write end 10 15 ns
t
HD
[14]
Data hold from write end 0 0 ns
t
HZWE
[12, 13]
R/W LOW to High Z 10 12 ns
t
LZWE
[12, 13]
R/W HIGH to Low Z 3 3 ns
t
WDD
[15]
Write pulse to data delay 30 45 ns
t
DDD
[15]
Write data valid to read data valid 25 30 ns
Notes
9. Test conditions assume signal transition time of 3 ns or less, timing reference levels of 1.5 V, input pulse levels of 0 to 3.0 V, and output loading of the specified I
OI
/I
OH
and 30 pF load capacitance.
10. To access RAM, CE
= L, SEM = H. To access semaphore, CE = H and SEM = L. Either condition must be valid for the entire t
SCE
time.
11. At any given temperature and voltage condition for any given device, t
HZCE
is less than t
LZCE
and t
HZOE
is less than t
LZOE
.
12. Test conditions used are Load 2.
13. This parameter is guaranteed but not tested.
14. For 15 ns industrial parts t
HD
minimum is 0.5 ns.
15. For information on port-to-port delay through RAM cells from writing port to reading port, refer to Figure 10 on page 17.

CY7C026A-20AXCT

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 256Kb 20ns 16K x 16 Dual Port SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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