4
Package
The overall package concept for the device consists of
the following basic elements; two optical subassem-
blies, two electrical subassemblies and the housing as
illustrated in the block diagram in Figure 3.
The package outline drawing and pin out are shown in
Figures 4 and 5. The details of this package outline and
pin out are compliant with the multi source denition of
the 2 x 10 DIP.
The electrical subassemblies consist of high volume
multilayer printed circuit boards on which the IC and
various surface-mounted passive circuit elements are
attached.
The receiver electrical subassembly includes an internal
shield for the electrical and optical subassembly to en-
sure high immunity to external EMI elds.
The optical subassemblies are each attached to their
respective transmit or receive electrical subassemblies.
These two units are then placed within the outer hous-
ing of the transceiver. The outer housing of the trans-
ceiver is molded with nonconductive plastic to provide
mechanical strength. The housing is then encased with
a metal EMI protective shield. The case is signal ground
and we recommend soldering the four ground tabs to
host card signal ground.
Each electrical subassembly PCB carries the signal pins
that exit from the bottom of the transceiver.
The solder posts are fastened into the molding of the
device. This design provides the mechanical strength
required to withstand the additional stresses on the
transceiver resulting from the insertion force of ber
cable mating. Although the solder posts are not con-
nected electrically to the transceiver, it is recommended
that they are connected to the chassis ground.
Figure 3. Block Diagram
DATA OUT
SIGNAL
DETECT
DATA IN
DATA IN
Tx DISABLE
B
MON
(+)
B
MON
(-)
P
MON
(+)
P
MON
(-)
QUANTIZER IC
LASER DRIVER
AND CONTROL
CIRCUIT
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
DATA OUT
LC
RECEPTACLE
R
X
SUPPLY
T
X
SUPPLY
R
X
GROUND
T
X
GROUND
PHOTO DETECTOR
BIAS
LASER BIAS
MONITORING
LASER DIODE
OUTPUT POWER
MONITORING
CASE
*
* NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR IMPROVED EMI PERFORMANCE.
5
Figure 4. HFCT-5914ATLZ Package Outline Drawing
TOP VIEW
13.59
(0.535)
MAX
13.59
0.535
+ 0
- 0.2
+0
-0.008
( )
15.0 ± 0.2
(0.591 ± 0.008)
6.25
(0.246)
10.16
(0.4)
9.6 ± 0.2
(0.378 ±0.008)
Ø 1.07
(0.042)
1
(0.039)
1.78
(0.07)
20 x 0.5
(0.02)
0.25
(0.01)
4.06
(0.16)
MIN
9.8
(0.386)
MAX
48.2
(1.898)
FRONT VIEW SIDE VIEW
BACK VIEW
19.5 ±0.3
(0.768 ±0.012)
1
(0.039)
10.8 ± 0.2
(0.425 ± 0.008)
3.81
(0.15)
MIN
20 x 0.25
(0.01)
BOTTOM VIEW
(PIN THICKNESS)
NOTE: END OF PINS
CHAMFERED
DIMENSIONS IN MILLIMETERS (INCHES)
DIMENSIONS SHOWN ARE NOMINAL. ALL DIMENSIONS MEET THE MAXIMUM PACKAGE OUTLINE DRAWING IN THE SFF MSA.
Tcase REFERENCE
POINT
6
Pin Descriptions:
Pin 1 Photo Detector Bias, VpdR:
This pin enables monitoring of photo detector bias current.
The pin should either be connected directly to V
CC
RX, or to
V
CC
RX through a resistor (max 200 W) for monitoring
photo detector bias current.
Pins 2, 3, 6 Receiver Signal Ground V
EE
RX:
Directly connect these pins to the receiver ground
plane.
Pins 4, 5 DO NOT CONNECT
Pin 7 Receiver Power Supply V
CC
RX:
Provide +3.3 V dc via the recommended dc receiver power
supply lter circuit. Locate the power supply lter circuit as
close as possible to the V
CC
RX pin. Note: the lter circuit
should not cause V
CC
to drop below minimum specica-
tion.
Pin 8 Signal Detect SD:
Normal optical input levels to the receiver result in a
logic “1” output.
Low optical input levels to the receiver result in a logic
“0” output.
This Signal Detect output can be used to drive a LVTTL
input on an upstream circuit, such as Signal Detect in-
put or Loss of Signal-bar.
Connection Diagram
Figure 5. Pin Out Diagram (Top View)
LASER DIODE OPTICAL POWER MONITOR - POSITIVE END
LASER DIODE OPTICAL POWER MONITOR - NEGATIVE END
LASER DIODE BIAS CURRENT MONITOR - POSITIVE END
LASER DIODE BIAS CURRENT MONITOR - NEGATIVE END
TRANSMITTER SIGNAL GROUND
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
RX TX
o
o
o
o
o
o
o
o
o
o
1
2
3
4
5
6
7
8
9
10
o
o
o
o
o
o
o
o
o
o
20
19
18
17
16
15
14
13
12
11
PHOTO DETECTOR BIAS
RECEIVER SIGNAL GROUND
RECEIVER SIGNAL GROUND
NOT CONNECTED
NOT CONNECTED
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUTPUT BAR
RECEIVER DATA OUTPUT
Top
View
Mounting Studs/
Solder Posts
Package
Grounding Tabs
Pin 9 Receiver Data Out Bar RD-:
PECL logic family. Output internally biased and ac
coupled.
Pin 10 Receiver Data Out RD+:
PECL logic family. Output internally biased and ac
coupled.
Pin 11 Transmitter Power Supply V
CC
TX:
Provide +3.3 V dc via the recommen ded dc transmitter
power supply lter circuit. Locate the power supply l-
ter circuit as close as possible to the VCC TX pin.
Pins 12, 16 Transmitter Signal Ground V
EE
TX:
Directly connect these pins to the transmitter signal
ground plane.
Pin 13 Transmitter Disable T
DIS
:
Optional feature, connect this pin to +3.3 V TTL logic
high “1” to disable module. To enable module connect
to TTL logic low “0”.
Pin 14 Transmitter Data In TD+:
PECL logic family. Internal terminations are provided (Ter-
minations, ac coupling).
Pin 15 Transmitter Data In Bar TD-:
Internal terminations are provided (Terminations, ac
coupling).

HFCT-5914ATLZ

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
TXRX SMF LC 1.25GBD 2X10 EXT TMP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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